Showcases Advanced Packaging Thermal Management, CPO and Energy-Saving Equipment Integration Capabilities at SEMICON Taiwan

Topco Scientific Showcases Advanced Packaging Thermal Management, CPO and Energy-Saving Equipment Integration Capabilities at SEMICON Taiwan 2026-08-24

Topco Scientific (TWSE: 5434), a leading integrated service provider of key semiconductor materials, is participating in "SEMICON Taiwan 2026." In response to the challenges of chip thermal management and transmission bottlenecks driven by the AI and high-performance computing (HPC) wave, Topco Scientific has developed "Advanced Packaging and Thermal Management" and "Co-Packaged Optics for Silicon Photonics" models this year, presenting solutions ranging from high-efficiency thermal interface materials, microchannel cooling, and advanced packaging substrates to nanoimprint optical components. At the same time, Topco Scientific is showcasing a variety of carbon-reduction and energy-saving equipment, demonstrating its strong semiconductor supply chain integration capabilities and sustainability initiatives.

Topco Scientific Senior CEO, Dennis Chen said, "As the power consumption of AI chips reaches the kilowatt level and advanced packaging structures such as wafer-level multi-chip modules become increasingly complex, the semiconductor materials provided by Topco Scientific have become a key factor in determining the performance and yield of next-generation chips." In terms of thermal management materials, given the stringent requirements for high power consumption and high reliability in AI applications and data centers, traditional thermal management solutions have encountered thermal resistance bottlenecks. The industry is actively shifting toward more advanced thermal management technologies while also adopting high-strength carriers for advanced packaging.

AI Chip Thermal Management Model Highlights Advanced Packaging and Thermal Management Technologies
As the heat generated by high-performance AI chips increases significantly, thermal management capabilities have become a core factor in the continued advancement of advanced packaging technologies. Topco Scientific has developed an AI chip thermal management model to present a complete packaging thermal management architecture. In terms of the critical thermal interface materials (TIM), Topco Scientific provides various thermal management material solutions in response to different product requirements, significantly reducing chip thermal resistance. To improve liquid cooling efficiency, Topco Scientific has introduced a modular cooling solution that uses a micro-copper-pillar (Copper Pillar) array to create chip microchannels (Microchannel). Cooling media such as high-purity water or coolant can flow between the copper pillars to dissipate heat, achieving highly efficient thermal management.

In response to the warpage and adhesion issues that traditional glass substrates are prone to during high-temperature processes, Topco Scientific provides single-crystal sapphire substrates featuring high warpage resistance, high light transmittance, and a high reuse rate, enhancing customers' process stability in high-end packaging and meeting the stringent requirements of next-generation advanced packaging.

Nanoimprint Technology Supports Key Upgrades in CPO and Optical Communications
In response to the trend toward high-bandwidth and low-power transmission driven by demand for AI computing power, the shift from copper to optical technologies is accelerating across the semiconductor and optical communications industries. Topco Scientific, in collaboration with Japan's nanoimprint technology leader SCIVAX, is showcasing the application of optical components in "Co-Packaged Optics (CPO)." Through high-precision nanoimprint technology, optical design surfaces are completely replicated onto wafers, and highly reliable optical materials from Shin-Etsu Chemical in Japan are used to form microlens arrays, ensuring excellent optical transmission quality even under the high-density and high-temperature conditions. This nanoimprint technology demonstrates capabilities in the miniaturization and high-performance manufacturing of optical components. At 11:00 a.m. on September 4, Topco Scientific will present the technology "Welcoming the Photonics-over-Copper Era: Key Applications of NIL in Optical Communications and CPO" on the TechXPOT stage, providing a one-stop solution from optical simulation to high-precision nanoimprint mass production.

Introducing Green Components to Help Wafer Fabs Move Toward Net-Zero Carbon Emissions
In addition to providing key materials for wafer manufacturing, advanced packaging, and optoelectronic integration technologies, Topco Scientific provides environmental and green energy solutions through facility engineering and low-carbon services. It is also showcasing a variety of green energy-saving equipment, such as components for light-based laser cleaning and etching process equipment, as well as gas sensors applicable to automated production lines. These solutions help wafer fab customers reduce energy consumption from equipment operation and monitor environmental safety indicators in real time, fulfilling the company's commitment to green manufacturing and low-carbon sustainable transformation.

Topco Scientific Senior CEO, Dennis Chen said, "Facing the extreme challenges of semiconductor scaling and wafer-level advanced packaging, we must continue to make breakthroughs in materials to meet the needs of next-generation computing." As semiconductor processes advance toward 3-nanometer, 2-nanometer, and A16 nodes, demand for high-end AI chips and HBM is accelerating the development of advanced fields such as 3D packaging and CPO. Topco Scientific is actively introducing world-leading materials and technologies and developing new products to meet end-market demand in area such as AI servers, high-speed communications, and silicon photonics. At the same time, Topco Scientific continues to deepen localized services in the United States, Japan, and Southeast Asia, working with global semiconductor partners to expand its presence in overseas markets and create win-win outcomes.

▍SEMICON Taiwan 2026 ▕ Topco Scientific Exhibition Information
◆ Exhibition Dates: September 2 (Wed.) - September 4 (Fri.), 2026, 10:00-17:00 (Open until 16:00 on the final day)
◆ Booth Location: Taipei Nangang Exhibition Center, Hall 1, 1F, Booth #I2700

▍SEMICON Taiwan Corporate Day ▕ Topco Scientific Business Outlook
◆ Presentation Time: September 3 (Thu.), 2026, 14:20-14:50
◆ Presentation Venue: Room 506, 5F, Taipei Nangang Exhibition Center, Hall 1

▍Innovation Technology Presentation▕ Embracing the Era of Optics in, Copper Out: Key Applications of Nanoimprint in Optical Communications and CPO
◆ Presentation Time: September 4 (Fri.), 2026, 11:00-11:20
◆ Presentation Venue: TechXPOT Stage, Optics Corridor, L Area, 4F, Taipei Nangang Exhibition Center, Hall 1

▲Topco Scientific showcases an AI chip thermal management model at SEMICON Taiwan, presenting a complete packaging thermal management architecture. Press Contacts