Driven by the rapid proliferation of generative AI and global high-performance computing (HPC) infrastructure, data center requirements for energy efficiency and bandwidth density are escalating at an unprecedented pace, making data transmission power consumption a critical bottleneck in advanced chip development. Seizing the transformative "Photonics-over-Copper" industry transition, Topco Scientific (TOPCO; TWSE: 5434), a leading integrated service provider for key semiconductor and optoelectronic materials, has partnered with Japan-based Nanoimprint Lithography (NIL) pioneer SCIVAX to capture critical market opportunities in high-bandwidth, energy-efficient Co-Packaged Optics (CPO).
Compared to conventional pluggable optical modules, the CPO architecture shortens electrical interconnect paths lowers power consumption, expands bandwidth density, and enhances thermal dissipation efficiency, representing a decisive paradigm shift in overcoming energy-scaling limits in data transmission. On September 4 at 11:00 AM, TOPCO will present "Welcoming the Photonics-over-Copper Era: Key Applications of NIL in Optical Communications and CPO" at SEMICON Taiwan's TechXPOT Stage, showcasing a turnkey solution spanning optical simulation, customized design, and high-precision wafer-scale nanoimprint manufacturing.
Addressing AI and HPC Demands: "Photonics-over-Copper" Fuels CPO Architecture Adoption
Dennis Chen, senior CEO of TOPCO, stated: "As data traffic from artificial intelligence and HPC experiences exponential growth, traditional copper-based interconnects face severe physical bandwidth constraints and surging power penalties. By co-packaging optical engines with logic ASICs on a unified substrate, CPO substantially shortens electrical interconnect lengths, slashes power consumption, and maximizes bandwidth density and power efficiency."
At this structural inflection point, high-precision, mass-producible optical manufacturing technologies are essential for the commercial adoption of CPO. SCIVAX combines advanced optical simulation capabilities with patented nanoimprint lithography, enabling high-fidelity pattern replication of complex, custom optical surfaces directly onto wafers.
Integrating SCIVAX High-Precision NIL with Shin-Etsu Chemical's High-Reliability Materials
By combining SCIVAX's precision imprint processing with high-reliability optical materials from Shin-Etsu Chemical, the resulting Microlens Arrays (MLA) achieve excellent heat resistance and high optical coupling efficiency. This ensures optimal optical signal integrity even within the ultra-dense packaging and elevated thermal environments, showcasing robust capabilities in optical component miniaturization and high-performance manufacturing.
Rigorous testing demonstrates that the optical lens structures exhibit zero peeling or cracking across extreme thermal cycling and thermal stresses, validating their long-term operational reliability and transmission stability under high-heat conditions. Furthermore, TOPCO will showcase a self-standing MLA with a thickness of under 60 μm and manufactured without a glass substrate, delivering high-efficiency optical coupling within highly constrained physical packages.
To address rapidly shifting demands across optical communications and AI silicon platforms, SCIVAX leverages its proprietary imprint methodology to dramatically compress the end-to-end "design-to-manufacturing" cycle. In terms of foundry capacity, SCIVAX operates two dedicated wafer foundries in Toyama City, offering an aggregate capacity of 8,000 8-inch wafers per month. This high-coupling-efficiency optical platform supports low drive currents and ultra-low power consumption, providing a scalable manufacturing foundation for volume CPO deployment and accelerating the industry's transition into the high-speed photonics era.
▲Topco partners with Japan's SCIVAX to showcase the CPO technology model at SEMICON Taiwan 2026.
▍SEMICON Taiwan 2026 ▕ Topco Scientific Exhibition Information
◆ Exhibition Dates: September 2 (Wed.) - September 4 (Fri.), 2026, 10:00-17:00 (Open until 16:00 on the final day)
◆ Booth Location: Taipei Nangang Exhibition Center, Hall 1, 1F, Booth #I2700
▍SEMICON Taiwan Corporate Day ▕ Topco Scientific Business Outlook
◆ Presentation Time: September 3 (Thu.), 2026, 14:20-14:50
◆ Presentation Venue: Room 506, 5F, Taipei Nangang Exhibition Center, Hall 1
▍Innovation Technology Presentation▕ Embracing the Era of Optics in, Copper Out: Key Applications of Nanoimprint in Optical Communications and CPO
◆ Presentation Time: September 4 (Fri.), 2026, 11:00-11:20
◆ Presentation Venue: TechXPOT Stage, Optics Corridor, L Area, 4F, Taipei Nangang Exhibition Center, Hall 1
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