Financial Results for the
Third Quarter Ended December 31, 2025
JAPAN PURE CHEMICAL CO.,LTD.
Securities Code: 4973
証券コード：4973
January 26, 2026
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Summary of Financial Results
Key points on how to read the Company's business results
Sales vary significantly between selling noble metals with chemicals and selling chemicals alone.
Noble metals have a significant impact on sales because they are expensive and their prices fluctuate.
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Term | Applications | Features | |
Electrolytic plating | - | Plating method on metal surfaces with electric current | |
Pure gold plating | Printed circuit boards (CPU, GPU, etc.) for PCs, smartphones, etc. | High-purity gold plating | |
Hard gold plating | Connectors for smartphones, automotive, industrial machinery, etc. | Gold plating that is hardened with alloy components | |
Palladium (Pd) plating | Lead frames for PCs, automotive, industrial machinery, etc. | Used as an undercoat for gold plating. PPF stands for Pre Plated Lead frame. | |
Electroless plating | - | Plating method by chemical reaction without electric current | |
Immersion plating | Semiconductor memory ( DRAM, NAND) Substrates with semiconductors for servers, PCs, smart phones, etc. | Plating method for forming by replacing metal on surface by utilizing solubility (ionization tendency) of each metal | |
Auto catalytic plating(Au) | Semiconductor Mounted Substrate CPU, GPU, etc. for servers, PCs, etc. | Plating method capable of forming thick coatings by utilizing chemical reaction with reducing agents | |
Auto catalytic plating(Pd) | Semiconductor Mounted Substrate for PC, server | Plating method capable of forming thick coatings by utilizing chemical reaction with reducing agents used as a base for gold plating | |
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Plating Method
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Plating Methods | Applications | Product Lineup | ||
Electrolytic plating | Pure gold |
| TEMPERESIST Series | |
Hard gold （Alloy） | Gold saving hard gold plating for micro connectors: OROBRGHT BAR7 | OROBRIGHT BAR7 | ||
Palladium (Pd) | Palladium plating for thin coating applicable to PPF: PALLABRIGHT NANO2 | PALLABRIGHT NANO2 | ||
Electroless plating | Immersion gold | Immersion gold plating compatible with mid- to high-P Ni: IM-GOLD IB2X Immersion gold plating with less Ni corrosion: IM-GOLD CN Immersion gold plating without Ni plating: IM-GOLD PC | IM-GOLD IB2X IM-GOLD CN IM-GOLD PC | |
Auto catalytic gold | Auto catalytic gold plating for thin coating using gold sulfite: HY-GOLD Auto catalytic gold plating for thin coating using gold cyanide: HY-GOLD CN | HY-GOLD HY-GOLD CN | ||
Auto catalytic palladium | Auto catalytic palladium plating for ENEPIG: NEO PALLABRIGHT 2 Direct auto catalytic palladium plating: NEO PALLABRIGHT DP | NEO PALLABRIGHT 2 NEO PALLABRIGHT DP | ||
Peripheral fields | Base metals (copper, tin, nickel) Alloy plating, Post-treatment agents | |||
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Product Lineup
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Plating Process Description
Ni 2-7μm
Cu 15-30μm
Term
Description
Composition of plating
ENIG
Electroless Nickel Immersion Gold. Composition of plating is Cu-Ni-Au.
Au 0.06μm
ENEPIG
Electroless Nickel Electroless Palladium Immersion Gold.
Composition of plating is Cu-Ni-Pd-
Au 0.06μm Pd 0.04μm
Ni 0.15-7μm
Au.
Cu 15-30μm
DIG
EPIG
Direct Immersion Gold. Since Ni plating is omitted, used for fine pitch compared to ENIG. Composition of plating is Cu-Au.
Electroless Palladium Immersion Gold.
Composition of plating is Cu-Pd-Au.
Au 0.06μm Cu 15-30μm
Au 0.06μm Pd 0.04μm
Cu15-30μm
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Au: gold, Pd: palladium, Ni: nickel, Cu: copper,
Micrometer (μm): one millionth of one meter 4