Interim Financial Report for the Fiscal Year Ending March 31, 2025
JAPAN PURE CHEMICAL CO.,LTD.
Securities Code: 4973
証券コード：4973
October 24, 2025
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Summary of Financial Results
Key points on how to read the Company's business results
Sales vary significantly between selling noble metals with chemicals and selling chemicals alone.
Noble metals have a significant impact on sales because they are expensive and their prices fluctuate.
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Term | Applications | Features | |
Electrolytic plating | - | Plating method on metal surfaces with electric current | |
Pure gold plating | Printed circuit boards (CPU, GPU, etc.) for PCs, smartphones, etc. | High-purity gold plating | |
Hard gold plating | Connectors for smartphones, automotive, industrial machinery, etc. | Gold plating that is hardened with alloy components | |
Palladium (Pd) plating | Lead frames for PCs, automotive, industrial machinery, etc. | Used as an undercoat for gold plating. PPF stands for Pre Plated Lead frame. | |
Electroless plating | - | Plating method by chemical reaction without electric current | |
Immersion plating | Semiconductor memory ( DRAM, NAND) Substrates with semiconductors for servers, PCs, smart phones, etc. | Plating method for forming by replacing metal on surface by utilizing solubility (ionization tendency) of each metal | |
Auto catalytic plating(Au) | Semiconductor Mounted Substrate CPU, GPU, etc. for servers, PCs, etc. | Plating method capable of forming thick coatings by utilizing chemical reaction with reducing agents | |
Auto catalytic plating(Pd) | Semiconductor Mounted Substrate for PC, server | Plating method capable of forming thick coatings by utilizing chemical reaction with reducing agents used as a base for gold plating | |
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Plating Method
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Plating Methods | Applications | Product Lineup | |||
Electrolytic plating | Pure gold |
| TEMPERESIST Series | ||
Hard gold （Alloy） | Gold saving hard gold plating for micro connectors: OROBRGHT BAR7 | OROBRIGHT BAR7 | |||
Palladium (Pd) | Palladium plating for thin coating applicable to PPF: PALLABRIGHT NANO2 | PALLABRIGHT NANO2 | |||
Electroless plating | Immersion gold | Immersion gold plating compatible with mid- to high-P Ni: IM-GOLD IB2X Immersion gold plating with less Ni corrosion: IM-GOLD CN Immersion gold plating without Ni plating: IM-GOLD PC | IM-GOLD IB2X IM-GOLD CN IM-GOLD PC | ||
Auto catalytic gold | Auto catalytic gold plating for thin coating using gold sulfite: HY-GOLD Auto catalytic gold plating for thin coating using gold cyanide: HY-GOLD CN | HY-GOLD HY-GOLD CN | |||
Auto catalytic palladium | Auto catalytic palladium plating for ENEPIG: NEO PALLABRIGHT 2 Direct auto catalytic palladium plating: NEO PALLABRIGHT DP | NEO PALLABRIGHT 2 NEO PALLABRIGHT DP | |||
Peripheral fields | Base metals (copper, tin, nickel) Alloy plating, Post-treatment agents | ||||
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Product Lineup
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Plating Process Description
Ni 2-7μm
Cu 15-30μm
Term
Description
Composition of plating
ENIG
Electroless Nickel Immersion Gold. Composition of plating is Cu-Ni-Au.
Au 0.06μm
ENEPIG
Electroless Nickel Electroless Palladium Immersion Gold.
Composition of plating is Cu-Ni-Pd-
Au 0.06μm Pd 0.04μm
Ni 0.15-7μm
Au.
Cu 15-30μm
DIG
EPIG
Direct Immersion Gold. Since Ni plating is omitted, used for fine pitch compared to ENIG. Composition of plating is Cu-Au.
Electroless Palladium Immersion Gold.
Composition of plating is Cu-Pd-Au.
Au 0.06μm Cu 15-30μm
Au 0.06μm Pd 0.04μm
Cu15-30μm
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Au: gold, Pd: palladium, Ni: nickel, Cu: copper,
Micrometer (μm): one millionth of one meter 4