Financial Report for
First quarter Ended June 30, 2025
JAPAN PURE CHEMICAL CO.,LTD.
Securities Code: 4973
証券コード：4973
July 25, 2025
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Summary of Financial Results
Key points on how to read the Company's business results
Sales vary significantly between selling noble metals with chemicals and selling chemicals alone.
Noble metals have a significant impact on sales because they are expensive and their prices fluctuate.
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Plating Method
Term
Electrolytic plating
Pure gold plating
Applications
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Printed circuit boards (CPU, GPU, etc.) for PCs, smartphones, etc.
Explanation
Plating method on metal surfaces with electric current
High-purity gold plating
Hard gold plating
Palladium (Pd) plating
Electroless plating
Immersion plating
Auto catalytic plating(Au)
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Auto catalytic plating(Pd)
Connectors for smartphones, automotive, industrial machinery, etc.
Lead frames for PCs, automotive, industrial machinery, etc.
-
Semiconductor memory( DRAM, NAND) Substrates with semiconductors for servers, PCs, smart phones, etc.
Semiconductor Mounted Substrate CPU, GPU, etc. for servers, PCs, etc.
Semiconductor Mounted Substrate for PC, server
Gold plating that is hardened with alloy components
Used as an undercoat for gold plating. PPF stands for Pre Plated Lead frame.
Plating method by chemical reaction without electric current
Plating method for forming by replacing metal on surface by utilizing solubility (ionization tendency) of each metal
Plating method capable of forming thick coatings by utilizing chemical reaction with reducing agents
Plating method capable of forming thick coatings by utilizing chemical reaction with reducing agents used as a base for
gold plating 2
Copyright © JAPAN PURE CHEMICAL CO.,LTD.
Product Lineup
Plating Methods | Applications | Product Lineup | |||
3 | |||||
Electrolytic plating | Pure gold |
| TEMPERESIST Series | ||
Hard gold （Alloy） | Gold saving hard gold plating for micro connectors: OROBRIGHT BAR7 | OROBRIGHT BAR7 | |||
Palladium (Pd) | Palladium plating for thin coating applicable to PPF: PALLABRIGHT NANO2 | PALLABRIGHT NANO2 | |||
Electroless plating | Immersion gold | Immersion gold plating compatible with mid- to high-P Ni: IM-GOLD IB2X Immersion gold plating with less Ni corrosion: IM-GOLD CN Immersion gold plating without Ni plating: IM- GOLD PC | IM-GOLD IB2X IM-GOLD CN IM-GOLD PC | ||
Auto catalytic gold | Auto catalytic gold plating for thin coating using gold sulfite: HY-GOLD Auto catalytic gold plating for thin coating using gold cyanide: HY-GOLD CN | HY-GOLD HY-GOLD CN | |||
Auto catalytic palladium | Auto catalytic palladium plating for ENEPIG: NEO PALLABRIGHT 2 Direct auto catalytic palladium plating: NEO PALLABRIGHT DP | NEO PALLABRIGHT 2 NEO PALLABRIGHT DP | |||
Peripheral fields | Base metals (copper, tin, nickel) Alloy plating, Post-treatment agents | ||||
Plating Process Description
Term
Explanation
Composition of plating
ENIG
Stands for Electroless Nickel Immersion Gold.
Composition of plating is Cu-Ni-Au.
Au 0.06μm
Ni 2-7μm
Cu 15-30μm
ENEPIG
Stands for Electroless Nickel Electroless Palladium Immersion
Gold.
Au 0.06μm Pd 0.04μm
Ni 0.15-7μm
Composition of plating is Cu-Ni-Pd-Au.
Stands for Direct Immersion Gold.
Cu 15-30μm
DIG
EPIG
Since Ni plating is omitted, used for fine pitch compared to ENIG. Composition of plating is Cu-Au.
Stands for Electroless Palladium Immersion Gold.
Composition of plating is Cu-Pd-Au.
Au 0.06μm Cu 15-30μm
Au 0.06μm Pd 0.04μm
Cu 15-30μm
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Au: gold, Pd: palladium, Ni: nickel, Cu: copper,
Micrometer (μm): one millionth of one meter 4