Chipbond Technology Corporation · TPEX:6147
Chipbond Technology — Investment Forum by Credit Suisse Taipei 2019
31 slides from Chipbond Technology's conference presentation, Sep 4, 2019
Slide 1: Chipbond 2019 Q3
CHIPIBOND 2019 Q3
Slide 2: Founded in 1997
Founded in 1997 Capital: USD 200Mn Staff: 5000
Slide 3: Packaging Industry
PACKAGING INDUSTRY Most IC ASE, SPIL, Amkor Wire Bonding > 70% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes
Slide 4: Gold Bumping
GOLD BUMPING Au Applications Display Driver IC RF Front End Smart Card Finger Print Sensor
Slide 5: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 6: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrate Has to be gold for driver IC
Slide 7: Chip on Film
CHIP ON FILM PCB Glass PCB board
Slide 8: Chip on Glass
CHIP ON GLASS Glass PCB board
Slide 9: Panel Industry
PANEL INDUSTRY All Panels uses Driver ICs 100% of Driver IC use Gold Bumping No exceptions
Slide 10: Supply Chain
SUPPLY CHAIN Design House Foundry Packaging Panel Maker LCM
Slide 11: Global Capacity
GLOBAL CAPACITY Chipbond LB Semicon 48% | 6% Nepes Others 9%
Slide 12: Competitive Strength
COMPETITIVE STRENGTH Equipment design capability - Much lower equipment cost - Better understanding of process Dominating market share - Price bargaining power - ASP stability
Slide 13: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 14: Products by application: TV, Phone, NB/PC, RF
TV Phone NB/PC RF Bumping 8” 12” 8” 8” Testing v v v v Chip on Glass v v Chip on Film v Film v
Slide 15: Applications
APPLICATIONS
Slide 16: Growth: TDDI, Edge Displays, 4K TV
GROWTH TDDI Edge Displays 4k TV
Slide 17: Touch Display Driver IC
Touch Display Driver IC
Slide 18: Out Cell
OUT CELL Cover Glass Touch Touch Sensor Controller IC TFT LCD Display Driver IC
Slide 19: In Cell
IN CELL Cover Glass TFT LCD Touch Display Touch Sensor Driver IC
Slide 20: TDDI
TDDI 20% Larger Die Size 3x Longer Test Time 40% Content per die
Slide 21: 16Q2 17Q1 18Q1 19Q1
80 60 40 20 0 16Q2 17Q1 18Q1 19Q1
Slide 22: Edge Displays
Edge Displays
Slide 23: Slide 23
Slide 24: Slide 24
Slide 25: COG vs COF assembly cost
COG COF Assembly Cost 1x 2~3x Film Cost - O
Slide 26: 4K TV
4K TV
Slide 27: Driver IC
Driver IC 8 ch Driver
Slide 28: Driver
Driver Driver Driver Driver Driver Driver
Slide 29: Retina Display
Retina Display
Slide 30: FHD vs 4K
FHD 4K Cost 1x 1.1x Retail 1x 1.2x # IC required 11~14 28 ~ 32
Slide 31: TV Shipment
TV SHIPMENT 250 200 150 126 100 101 73 50 38 3 20 0 2012 2013 2014 2015 2016 2017 2018
Chipbond Technology — Investment Forum by Credit Suisse Taipei 2019 on 6ix