Chipbond Technology — Online Investment Forum by Citi Securities Virtual Meetings 2022

14 slides from Chipbond Technology's conference presentation, May 18, 2022

Slide 1: Chipbond 2022H
CHIPIBOND 2022H |
Slide 2: Packaging Industry
PACKAGING INDUSTRY Most IC ASE, SPIL, Amkor Wire Bonding > 70% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes
Slide 3: Gold Bumping
GOLD BUMPING Au Applications Display Driver IC RF Front End Smart Card Finger Print Sensor
Slide 4: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 5: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrate Has to be gold for driver IC
Slide 6: Chip on Film
CHIP ON FILM PCB Glass PCB board
Slide 7: Chip on Glass
CHIP ON GLASS Glass PCB board
Slide 8: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 9: Products by application: TV, Phone, NB/PC, RF
TV Phone NB/PC RF Bumping 8” 12” 8” 8” Testing v v v v Chip on Glass v v Chip on Film v Film v
Slide 10: 2018 2019 2020 2021
2018 2019 2020 2021
Slide 11: Applications
APE EIGANEICINs
Slide 12: 2022 Growth
2022 GROWTH •Smartphone OLED •Automotives •non-Driver IC
Slide 13: Year of OLED
YEAR OF OLED • China - 70mn -> 115mn • Korea • SDC - 15mn -> xx mn • LSI - outsource to TW foundries and OSAT
Slide 14: SP OLED
SP OLED 2021 2022F SDC 480 490 LGD 50 60 BOE 60 85 CSOT 5 15 Tianma 5 15