Chipbond Technology Corporation · TPEX:6147
Chipbond Technology — Investment forum held by Cathay Securities, Taipei, 2023
20 slides from Chipbond Technology's conference presentation, Dec 12, 2023
Slide 1: Chipbond 2023H2
CHIPIBOND 2023H2
Slide 2: Packaging Industry
PACKAGING INDUSTRY Most IC ASE, SPIL, Amkor Wire Bonding > 70% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes
Slide 3: Gold Bumping
GOLD BUMPING Au Applications Display Driver IC RF Front End Smart Card Finger Print Sensor
Slide 4: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 5: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrate Has to be gold for driver IC
Slide 6: Chip on Film
CHIP ON FILM PCB Glass PCB board
Slide 7: Chip on Glass
CHIP ON GLASS Glass PCB board
Slide 8: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 9: Products by application: TV, Phone, NB/PC, RF
TV Phone NB/PC RF Bumping 8” 12” 8” 8” Testing v v v v Chip on Glass v v Chip on Film v v Film v v
Slide 10: 2018 2019 2020 2021
2018 2019 2020 2021
Slide 11: 2022 Demand
222 OEM ANE Zea*
Slide 12: Applications
AFB EIGANTIGIN|s Non Driver
Slide 13: Sellthrough
SELLTHROUGH 2021 2022 2023F Source Samsung / TV 220 180 190-200 Omdia NB 240 180 160 IDC SP 1300 1217 1200 GfK
Slide 14: Utilization
UTILIZATION 100 90 80 70 60 2020 2021 2022 2023
Slide 15: Supply Chain
SUPPLY CHAIN Panel DDI OSAT AUO Novatek Chipbond Innolux Himax ChipMos Samsung Raydium Lusem LGD LX Semicon LB Semicon BOE Ilitek 通富 China Star Parade 新匯成 Tianma ChipOne HannStar Fitipower JDI Focaltech ESWin Samsung
Slide 16: LCD Capacity
LCD CAPACITY 100 75 50 25 0 Panel DDI OSAT
Slide 17: OLED Capacity
OLED CAPACITY 100 75 50 25 0 Panel DDI OSAT
Slide 18: Smartphone
SMARTPHONE 2022 2023F OLED 600m 700m LCD 650m 500m
Slide 19: Display resolution and DDI count
8K Ultra HD 7680x4320 40 DDI 4K UHD 3840x2160 20 DDI FHD 1920x1080 10 DDI SD 1280x720 3 DDI
Slide 20: Future
FUTURE LCD migrate to OLED FHD migrate to 4k to 8k Automotive Non-Driver IC
Chipbond Technology — Investment forum held by Cathay Securities, Taipei, 2023 on 6ix