Chipbond Technology — Investment Forum by Cathay Securities 2023, Shangri-La Far Eastern, Taipei

15 slides from Chipbond Technology's conference presentation, Jun 8, 2023

Slide 1: Chipbond 2023H2
CHIPIBOND 2023H2
Slide 2: Packaging Industry
PACKAGING INDUSTRY Most IC ASE, SPIL, Amkor Wire Bonding > 70% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes
Slide 3: Gold Bumping
GOLD BUMPING Au Applications Display Driver IC RF Front End Smart Card Finger Print Sensor
Slide 4: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 5: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrate Has to be gold for driver IC
Slide 6: Chip on Film
CHIP ON FILM PCB Glass PCB board
Slide 7: Chip on Glass
CHIP ON GLASS Glass PCB board
Slide 8: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 9: Products by application: TV, Phone, NB/PC, RF
TV Phone NB/PC RF Bumping 8” 12” 8” 8” Testing v v v v Chip on Glass v v Chip on Film v v Film v v
Slide 10: 2018 2019 2020 2021
2018 2019 2020 2021
Slide 11: 2022 Demand
222 OEM ANE Zea*
Slide 12: Utilization
UTILIZATION 100 90 80 70 60 2020 2021 2022 2023
Slide 13: Applications
AFB EIGANTIGIN|s Non Driver
Slide 14: Sellthrough
SELLTHROUGH 2021 2022 2023F Source Samsung / TV 220 180 190-200 Omdia NB 240 180 165 IDC SP 1300 1217 1200 GfK
Slide 15: Smartphone
SMARTPHONE 2022 2023F OLED 600m 700m LCD 650m 500m