Chipbond Technology Corporation · TPEX:6147
Chipbond Technology — Investment Forum by Credit Suisse, Taipei 2018
27 slides from Chipbond Technology's conference presentation, Sep 4, 2018
Slide 1: Chipbond 2018 Q3
CHIPIBOND 2018 Q3
Slide 2: Founded in 1997, Capital USD 200Mn, Staff 5000
Founded in 1997 Capital: USD 200Mn Staff: 5000
Slide 3: Packaging Industry
PACKAGING INDUSTRY Most IC ASE, SPIL, Amkor Wire Bonding > 70% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes
Slide 4: Gold Bumping
GOLD BUMPING Au Applications Display Driver IC RF Front End Smart Card Finger Print Sensor
Slide 5: Products
PRODUCTS Bumping Testing Chip on Glass Chip on Film Film
Slide 6: Gold Bumping
GOLD BUMPING Interconnect between IC and Substrate Has to be gold for driver IC
Slide 7: Chip on Film
CHIP ON FILM PCB Glass PCB board Used for medium/large panels TV, Monitors
Slide 8: Chip on Glass
CHIP ON GLASS Glass PCB board Used for small panels Handsets, Tablets, NB
Slide 9: Panel Industry
PANEL INDUSTRY All Panels uses Driver ICs 100% of Driver IC use Gold Bumping No exceptions
Slide 10: Supply Chain
SUPPLY CHAIN Design House Foundry Packaging Panel Maker LCM
Slide 11: Global Capacity
GLOBAL CAPACITY Chipbond LB Semicon 48% | 6% Nepes ie) Others 9% 9%
Slide 12: Competitive Strength
COMPETITIVE STRENGTH Equipment design capability - Much lower equipment cost - Better understanding of process Dominating market share - Price bargaining power - ASP stability
Slide 13: Driver IC
Driver IC 8 ch Driver
Slide 14: Driver IC
Driver Driver Driver Driver Driver Driver
Slide 15: Retina Display
Retina Display
Slide 16: Applications
APPLICATIONS
Slide 17: PPI
PPI 600 500 400 300 200 100 2008 2010 2012 2014 Phones Tablets
Slide 18: Out Cell
OUT CELL Cover Glass Touch Touch Sensor Controller IC TFT LCD Display Driver IC
Slide 19: In Cell
IN CELL Cover Glass TFT LCD Touch Display Touch Sensor Driver IC
Slide 20: TDDI
TDDI 20% Larger Die Size 3x Longer Test Time 40% Content per die
Slide 21: 16Q2 17Q1 18Q1
70 52.5 35 17.5 0 16Q2 17Q1 18Q1
Slide 22: Slide 22
Slide 23: COG vs COF
COG COF Assembly Cost 1x 2~3x Film Cost - O
Slide 24: Huawei, OPPO, VIVO, Xiaomi Models
Huawei OPPO Mate 20 R15s Mate 20 Pro R15s Pro Mate X A97 P30 Plus P30 VIVO Magic X23 Nova 3s Nova 3 Plus Enjoy 8 Plus Xiaomi Enjoy 8s Mi Mix 3 麥芒 7 Mi Max 3 Honor V11 Mi 9 Honor 10 Lite Honor 8x
Slide 25: FHD vs 4K
FHD 4K Cost 1x 1.1x Retail 1x 1.2x # IC required 11~14 30~40
Slide 26: 4K & FHD
4K & FHD 100 75 50 25 0 Y0 Y1 Y2 Y3 Y4 Y5 Y6
Slide 27: TV Shipment
TV SHIPMENT 250 200 150 100 73 50 38 3 20 0 2011 2012 2013 2014 2015 2016
Chipbond Technology — Investment Forum by Credit Suisse, Taipei 2018 on 6ix