Chipbond Technology Corporation · TPEX:6147

Chipbond Technology — Investors Conference by Credit Suisse Hong Kong 2017

26 slides from Chipbond Technology's conference presentation, Jan 12, 2017

1. Slide 1: Chipbond 2017 Q1

   CHIPRBOND 2017 Q|

2. Slide 2: Founded in 1997, Capital USD 200Mn, Staff 5000

   Founded in 1997 Capital: USD 200Mn Staff: 5000

3. Slide 3: IC packaging and test market

   封測市場 Most IC ASE, SPIL, Amkor 打線 > 70% 凸塊 Solder Bumps ⾦金金 CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes

4. Slide 4: Gold bump product applications

   ⾦金金凸塊 Au 產品應⽤用 驅動IC RFID 智慧卡 指紋辨識晶片

5. Slide 5: Production flow: bumping, testing, film

   ⽣生產流程 Bumping Testing Chip on Glass Chip on Film Film

6. Slide 6: Gold bump interconnect between IC and substrate

   ⾦金金凸塊 Interconnect between IC and Substrate Has to be gold for driver IC

7. Slide 7: Chip on film

   CHIP ON FILM PCB Glass PCB board Used for medium/large panels TV, Monitors

8. Slide 8: Chip on glass

   CHIP ON GLASS Glass PCB board Used for small panels Handsets, Tablets, NB

9. Slide 9: Panel industry

   PANEL INDUSTRY All Panels uses Driver ICs 100% of Driver IC use Gold Bumping No exceptions

10. Slide 10: Supply chain

    供應鏈 Design House Foundry Packaging Panel Maker LCM

11. Slide 11: Market share: Chipbond, LB Semicon, Nepes

    Chipbond LB Semicon 48% 16% Nepes ie) Others 9% 9%

12. Slide 12: Competitive strength

    COMPETITIVE STRENGTH Equipment design capability - Much lower equipment cost - Better understanding of process Dominating market share - Price bargaining power - ASP stability

13. Slide 13: Driver IC

    Driver IC 8 ch Driver

14. Slide 14: Driver IC

    Driver Driver Driver Driver Driver Driver

15. Slide 15: Retina display

    Retina Display a &% es

16. Slide 16: Product structure

    產品結構

17. Slide 17: PPI trends

    PPI 600 500 400 300 200 100 2008 2010 2012 2014 Phones Tablets

18. Slide 18: White box price

    Samsung 1440 LG G3 S6 Samsung iPhone 1080 HTC S5 M9 6+ 720 White 360 Box 0 200 400 600 800 Price

19. Slide 19: Redmi Note 4

    紅米 NOTE 4 Helio X20 (Dec-core) 5.5” FHD (1920 x 1080) 13MB Camera Metal Case RMB 999

20. Slide 20: China smartphone resolution mix

    中國智慧⼿手機 Others WVGA HD720 FHD 100 75 50 25 0 2014 2015 2016

21. Slide 21: FHD vs 4K cost and IC count

    FHD 4K Cost 1x 1.1x Retail 1x 1.2x # IC required 11~14 30~40

22. Slide 22: 4K penetration

    4K 滲透率 100 75 50 25 0 Y0 Y1 Y2 Y3 Y4 Y5 Y6

23. Slide 23: TV shipments

    電視出貨量量 250 200 150 100 73 50 38 3 20 0 2011 2012 2013 2014 2015 2016

24. Slide 24: Out cell

    OUT CELL Cover Glass Touch Touch Sensor Controller IC TFT LCD Display Driver IC

25. Slide 25: On & in cell

    ON & IN CELL Cover Glass TFT LCD Touch Display Touch Sensor Driver IC

26. Slide 26: Touch display IC

    觸控顯⽰示IC 20% Larger Die Size 3x Longer Test Time 40% Content per die

Chipbond Technology — Investors Conference by Credit Suisse Hong Kong 2017 on 6ix