Chipbond Technology Corporation · TPEX:6147

Chipbond Technology — Overseas Investors Conference by OTC and KGI Securities Hong Kong 2017

26 slides from Chipbond Technology's conference presentation, Jun 2, 2017

  1. Slide 1: Chipbond 2017 Q2

    CHIPRBOND 2017 Q2

  2. Slide 2: Founded in 1997, Capital USD 200Mn, Staff 5000

    Founded in 1997 Capital: USD 200Mn Staff: 5000

  3. Slide 3: Packaging market and bumping

    封裝市場 Most IC ASE, SPIL, Amkor 打線 > 70% Primary interconnecting method Bumping Solder Bumps Au CPU and Graphic Gold Bump Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes

  4. Slide 4: Au Applications

    ⾦金金凸塊 Au Applications 驅動 IC RFID 智慧卡 指紋辨識感應器

  5. Slide 5: Product lines: Bumping, Testing, COG, COF

    產品線 Bumping Testing Chip on Glass Chip on Film Film

  6. Slide 6: Gold bumping: IC to substrate connection

    ⾦金金凸塊 IC 與 基板的連結

  7. Slide 7: Chip on Film

    CHIP ON FILM PCB Glass PCB board Used for medium/large panels TV, Monitors

  8. Slide 8: Chip on Glass

    CHIP ON GLASS Glass PCB board Used for small panels Handsets, Tablets, NB

  9. Slide 9: Panel Industry

    PANEL INDUSTRY All Panels uses Driver ICs 100% of Driver IC use Gold Bumping No exceptions

  10. Slide 10: Supply Chain

    SUPPLY CHAIN Design House Foundry Packaging Panel Maker LCM

  11. Slide 11: Global Capacity

    GLOBAL CAPACITY Chipbond LB Semicon 48% | 6% Nepes ie) Others 9% 9%

  12. Slide 12: Driver IC

    Driver IC 8 ch Driver

  13. Slide 13: Driver IC

    Driver Driver Driver Driver Driver Driver

  14. Slide 14: Retina Display

    Retina Display a &% es

  15. Slide 15: Applications

    APPLICATIONS

  16. Slide 16: PPI

    PPI 600 500 400 300 200 100 2008 2010 2012 2014 Phones Tablets

  17. Slide 17: White Box Price

    Samsung 1440 LG G3 S6 Samsung iPhone 1080 HTC S5 M9 6+ 720 White 360 Box 0 200 400 600 800 Price

  18. Slide 18: Redmi Note 4

    紅米 NOTE 4 Helio X20 (Dec-core) 5.5” FHD (1920 x 1080) 13MB Camera Metal Case RMB 999

  19. Slide 19: China Handsets

    中國⼿手機 Others WVGA HD720 FHD 100 75 50 25 0 2014 2015 2016

  20. Slide 20: Out Cell

    OUT CELL Cover Glass Touch Touch Sensor Controller IC TFT LCD Display Driver IC

  21. Slide 21: On & In Cell

    ON & IN CELL Cover Glass Touch Touch Sensor Controller IC TFT LCD Display Touch Driver Display Driver IC IC

  22. Slide 22: TDDI

    TDDI IC ⾯面積增加 20% 測試時間增加 200% 每顆 IC 增加 40% 內容

  23. Slide 23: 16Q2 to 17Q3 chart

    50 37.5 25 12.5 0 16Q2 Q3 Q4 17Q1 Q2 Q3

  24. Slide 24: FHD vs 4K

    FHD 4K Cost 1x 1.1x Retail 1x 1.2x # IC required 11~14 30~40

  25. Slide 25: 4K TV Penetration

    4K TV 滲透率 100 75 50 25 0 Y0 Y1 Y2 Y3 Y4 Y5 Y6

  26. Slide 26: TV Shipment

    TV SHIPMENT 250 200 150 100 73 50 38 3 20 0 2011 2012 2013 2014 2015 2016

Chipbond Technology — Overseas Investors Conference by OTC and KGI Securities Hong Kong 2017 on 6ix