Chipbond Technology Corporation · TPEX:6147

Chipbond Technology — Fubon Securities Investment Forum Taipei 2017

28 slides from Chipbond Technology's conference presentation, Nov 29, 2017

  1. Slide 1: Chipbond 2017 Q3

    CHIPRBOND 2017 Q3

  2. Slide 2: Founded in 1997, Capital USD 200Mn, Staff 5000

    Founded in 1997 Capital: USD 200Mn Staff: 5000

  3. Slide 3: Packaging and testing landscape

    封測版圖 Most IC ASE, SPIL, Amkor 打線 > 70% 凸塊 錫鉛凸塊 Au CPU and Graphic ⾦金金凸塊 Intel and TSMC LCD Driver IC, RFID Chipbond, Nepes

  4. Slide 4: Gold bump applications

    ⾦金金凸塊 Au Applications Display Driver IC RFID Smart Card Finger Print Sensor

  5. Slide 5: Product flow: bumping, testing, film

    產品流程 Bumping Testing Chip on Glass Chip on Film Film

  6. Slide 6: Gold bump interconnect between IC and substrate

    ⾦金金凸塊 Interconnect between IC and Substrate Has to be gold for driver IC

  7. Slide 7: Chip on Film

    CHIP ON FILM PCB Glass PCB board Used for medium/large panels TV, Monitors

  8. Slide 8: Chip on Glass

    CHIP ON GLASS Glass PCB board Used for small panels Handsets, Tablets, NB

  9. Slide 9: Panel industry

    PANEL INDUSTRY All Panels uses Driver ICs 100% of Driver IC use Gold Bumping No exceptions

  10. Slide 10: Industry value chain

    產業鍊鍊 Design House Foundry Packaging Panel Maker LCM

  11. Slide 11: Market share: Chipbond, LB Semicon, Nepes

    Chipbond LB Semicon 48% 16% Nepes ie) Others 9% 9%

  12. Slide 12: Competitive strength

    COMPETITIVE STRENGTH Equipment design capability - Much lower equipment cost - Better understanding of process Dominating market share - Price bargaining power - ASP stability

  13. Slide 13: Driver IC

    Driver IC 8 ch Driver

  14. Slide 14: Driver IC

    Driver Driver Driver Driver Driver Driver

  15. Slide 15: Retina Display

    Retina Display a &% es

  16. Slide 16: Applications

    APPLICATIONS

  17. Slide 17: PPI

    PPI 600 500 400 300 200 100 2008 2010 2012 2014 Phones Tablets

  18. Slide 18: White box price

    Samsung 1440 LG G3 S6 Samsung iPhone 1080 HTC S5 M9 6+ 720 White 360 Box 0 200 400 600 800 Price

  19. Slide 19: Redmi Note 4

    REDMI NOTE 4 Helio X20 (Dec-core) 5.5” FHD (1920 x 1080) 13MB Camera Metal Case RMB 999

  20. Slide 20: China smartphone

    CHINA SMARTPHONE Others WVGA HD720 FHD 100 75 50 25 0 2014 2015 2016

  21. Slide 21: Out cell

    OUT CELL Cover Glass Touch Touch Sensor Controller IC TFT LCD Display Driver IC

  22. Slide 22: On & in cell

    ON & IN CELL Cover Glass TFT LCD Touch Display Touch Sensor Driver IC

  23. Slide 23: TDDI

    TDDI 20% Larger Die Size 3x Longer Test Time 40% Content per die

  24. Slide 24: Quarterly trend 16Q2 to 17Q3

    50 37.5 25 12.5 0 16Q2 Q3 Q4 17Q1 Q2 Q3

  25. Slide 25: COG vs COF

    COG COF Assembly Cost 1x 2~3x Film Cost - O

  26. Slide 26: FHD vs 4K

    FHD 4K Cost 1x 1.1x Retail 1x 1.2x # IC required 11~14 30~40

  27. Slide 27: 4K & FHD

    4K & FHD 100 75 50 25 0 Y0 Y1 Y2 Y3 Y4 Y5 Y6

  28. Slide 28: TV shipment

    TV SHIPMENT 250 200 150 100 73 50 38 3 20 0 2011 2012 2013 2014 2015 2016

Chipbond Technology — Fubon Securities Investment Forum Taipei 2017 on 6ix