Paragon Technologies Co., Ltd. · TWSE:3518
Paragon Technologies — Conference Presentation (July 2026)
22 slides from Paragon Technologies's conference presentation, Jul 8, 2026
Slide 1: Paragon (3518TW)
Paragon (3518TW) 2026 / 07 / 08
Slide 2: Limiting responsibility
Limiting responsibility This presentation, together with any information disclosed concurrently, may contain forward-looking statements, including but not limited to the Company’s business outlook, financial condition, and operational forecasts. These statements are based on the Company’s internal
Slide 3: Contents
Company Overview Financial Information CONTENTS Progress report Operating status Q&A 3
Slide 4: Company Overview
Company Overview 4
Slide 5: Paragon (3518TW)
Paragon(3518TW) Paragon was established in 1995 as the world's first company to apply vacuum coating (PVD) technology to EMI/ESD solutions for 3C products, it has been actively transforming in recent years to Establishment : 1995.10.20 develop third-generation semiconductor materials and advanced
Slide 6: About Paragon
About Paragon Silicon carbide products Vacuum coating (PVD) products 6 /8 inches Silicon Carbide Taiwan HQ & RD Center EMI shielding & exterior coating services (SiC) Wafer - Established: 1995 year - Nanjing Plant/Neijiang Plant - N-Type / P-Type - Capital: NTD 1,020 million (PVD Coating & Equipment
Slide 7: Development history
Development history As the world’s first company to apply Applications of Vacuum Coating (PVD) technology to EMI/ESD solutions for 3C products. Currently the largest supplier of EMI shielding for notebook computers, the company acquired Crystal Materials in 2022, gaining SiC (silicon carbide) substr
Slide 8: Financial Information
f- f- an Ke + Financial Information —_—
Slide 9: Q1 26' Consolidated Balance
Q1 26’Consolidated Balance Unit in NT$ Millon 2026.3.31 % 2025.12.31 % 2025.03.31 % cash& cash equivalents 661 27 443 20 753 36 Financial assets-current&noncurrent 368 15 379 17 407 20 Notes and accounts receivable 202 8 235 10 240 12 Inventories 17 1 12 1 16 1 non-liquid asset in suspense 0 0 10 0
Slide 10: Q1 26' Financial Structure
Q1 26’Financial Structure other 8% cash & cash equivalents 27% Fixed Assets & Right-of- use asset 42% financial assets 15% accounts receivable 8% ITEM 2026.Q1 2025 2024 2023 2022 Debt Ratio 30.28 37.66 33.37 21.49 16.30 Current Ratio 400.58 296.46 511.45 395.27 606.50 Cash flow Ratio 22.20 (52.25) (
Slide 11: 2026Q1 Consolidated income statement
2026Q1 Consolidated income statement Unit in NT$ Millon ITEM 2026Q1 2025Q4 QoQ 2025Q1 QoQ operating revenue 62 76 (14) 74 (12) Gross Profit (8) (2) (6) 1 (9) operating expenses 58 44 13 40 17 Operating Profit (66) (46) (20) (39) (26) non-operating revenue and expenses 365 (8) 373 (33) 398 continuing
Slide 12: Revenue, Gross margin
Revenue * Gross margin 120,000 25.00% 100,000 80,000 60,000 40,000 20,000 a 0) 202304 202401 2025Q1 202503 202504 "= Revenue 85,949 81,459 93,607 106,084 87,589 73,978 84,304 85,692 75,928 Gross margin) 25.00% 23.44% 19.51% 19.93% 8.37% 1.02% 12.63% 14.08% -2.30% 30% 25% 20% 15% 10% 5% 0% -15% -20%
Slide 13: Q1 26' Consolidated Cash Flow
Q1 26’ Consolidated Cash Flow Unit in NT$ Millon 2026 ended 2025 ended March 31 March 31 Cash provided by (used in) operating activities 71 (241) Cash provided by (used in) investing activities 259 (83) Cash provided by (used in) financing activities (131) (6) Effects of exchange rate change on cash
Slide 14: Important events description
Important events description The board approved a cash capital increase of NT$100 million to its subsidiary Jing Cheng Materials Co., Ltd. (115.05.08) Subsidiary Jing Cheng Materials Co., Ltd. announced a resolution to conduct a capital reduction to offset losses by NT$290 million (2026.05.08)
Slide 15: Progress report
Progress report 15
Slide 16: SiC New Plant plan
SiC New Plant plan- Full mass production will be postponed to Q1 2027 Location : Chiayi Dapu Mei Intelligent Industrial Park 2027~2028 Main products : 8-inch Conductive and 6/8-inch Semi-insulating SiC wafer (Growth period) New plant capacity : 3,000pcs/month(27H1) 6,000pcs/month(28H2) • IAIF
Slide 17: New factory progress description
New factory progress description Factory registration progress report Explanation of the trial production progress All processing equipment has been fully installed, and batch trial production So far, building occupancy permits and partial EIA permits have been of the slicing and thinning processes
Slide 18: Operational status
Operational status 18
Slide 19: Product development
Product development Cost PVD Techno logy 6/8-inch 12-inch High Voltage Power Supply Thermal Substrate TGV (Glass Technology) Energy Storage AI applications – TSiCV Green Energy Systems High power and high heat (Silicon Carbide via through-hole technology) EV dissipationSatellites Adv
Slide 20: Operational status
Operational status Current status of EMI coated products Current status of SiC wafer products 8-inch SiC conductive products have begun small-batch shipments. Benefiting from increased demand for AI products and high-power Due to the impact of order intake from major customers and poor sales in comp
Slide 21: 21
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Slide 22: True Partner for a Brighter
TRUE PARTNER FOR A BRIGHTER spokesman：Mingi Liu(CFO) TEL：(03)212-8833 E-mail：mingi@pttech.com.tw
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