(News Release / Translation)
Note: This is an English translation of the Japanese original for reference purposes only.
In the event of any discrepancy between this translated document and the Japanese original, the original shall prevail
April 7,2026Name of company V-Technology Co., Ltd.
Name of the Representative Shigeto Sugimoto / President and CEO Name of company LE-TECHNOLOGY Co., Ltd.
Name of the Representative Duk Lee / President, CEO Person to contact: Masahiro Ono / Chief of IR Office
TEL 045-338-1980
V Technology Receives NEDO Order for DI Exposure System "LAMBDI" ~ Secures Order for World's First 0.5μm-Class System for Advanced Packaging ~V Technology Co., Ltd. (Head Office: East Tower 9F, Yokohama Business Park, 134 Godo-cho, Hodogaya-ku, Yokohama, Kanagawa; President and CEO: Shigeto Sugimoto; hereinafter "the Company") and its consolidated subsidiary, LE-TECHNOLOGY Co., Ltd. (Head Office: DS Ichigaya Building 5F, 2-1 Ichigaya-Hachimancho, Shinjuku-ku, Tokyo; President and CEO: Duk Lee ; hereinafter "LET"), have successfully developed the world's first L/S = 0.5μm-class DI (Direct Imaging) exposure system "LAMBDI" for interposers and package substrates, and have received an order from NEDO (New Energy and Industrial Technology Development Organization) through Osaka Metropolitan University.
The Group began shipment of DI exposure systems capable of supporting 1μm-level wiring in August 2025, and has since achieved further improvements in resolution, leading to this order. Going forward, the Group will continue to develop innovative technologies that support the advancement of semiconductors and electronic devices, thereby contributing to the development of society.
The impact of this order on the Company's financial results for the current fiscal year is
expected to be minimal.
