May 7, 2025
Mid-term Strategy from 2025 to 2027
TODAY’S AGENDA
Corporate outline
Business results in FY2025Q1
The new mid-term strategy, “Innovate100”
Mid-term Strategy from 2022 to 2024
Topics of THine Group’s technology and solutions
Corporate outline
Provider of unique value to the world,
de facto standard technology of high-speed interface, etc.
Company Name THine Electronics, Inc.
(listed on Tokyo Stock Exchange, code: 6769)
Tetsuya Iizuka
Yoichiro Minami
Founder & CEO Tetsuya Iizuka, Ph.D
President & COO Yoichiro Minami
Capital 1,175 million yen
Founded May, 1991
Incorporated June, 1992
Business Area Planning, Designing and Sales of Mixed Signal LSI,
Providing AI & IoT devices/Solutions,
Planning, Designing and Sales of AI/Data Server
Employees 129, consolidated as of March 31, 2025
THine team
China
賽恩電子香港股份有限公司
THine Electronics Hong Kong, Co., Ltd.
Established in Nov.2012
前海赛恩电子(深圳)有限公司
Korea
THine Electronics Korea, Inc. Seoul, Korea
Established in Mar. 2010
United States
THine Solutions, Inc. Santa Clara, CA USA Established in Feb. 2018
Tokyo – Headquarters –
Tokyo, Japan
Start-up in May 1991
Cathay Tri-Tech, Inc.
THine Electronics Shenzhen, Co., Ltd.
Established in May 2013
Yokohama, Japan
The company name will be changed to “THine MobileTeK, Inc.” in July 2025
上海分公司
Shanghai-Branch
Established in Oct.2013
Taiwan
哉英電子股份有限公司
THine Electronics Taiwan, Inc.
Taipei, Taiwan Established in Sep. 2000
Acquired in Dec., 2018
THine HyperData, Inc.
Yokohama, Japan
Establish in June 2024
Business Area
Product and solution
Application market
LSI
Biz.
V-by-One® HS plus V-by-One® HS LVDS
Serial Transceiver IOHA:B
Optical Chipset (VCSEL driver, TIA)
Image Signal Processor Camera Development KitCamera solution: automotive cameras, security cameras, AR/VR, recognition camera, medical cameras, etc.
Display solution: high-resolution displays such as 8K / 4K, gaming monitors with high refresh rate
Drive recorders, automotive CID, exp. for EVs
Mobile, PC, and single board computers
OA (multi-function printers), amusement
Industrial equipment such as inspection equipment for semiconductors and LCD displays
AI optical computing for optical interconnect in networks of data centers
AI & IoT Biz.
Drive recorders with wireless modules
AED monitoring modules
IP transceivers
Remote monitoring module for vending machines and elevators
GPS tracker
AI thermography with facial recognition
IoT monitoring system
・AI servers and data servers for companies and AI research institutes though ODM/OEM
<Wireless modules>
5G/LTE/NB-IoT
<AI&IoT devices and solution>
IoT Gateway / Router AI & IoT Solution
<AI Server>
AI Server with NVIDIA H100 GPU
<Data Server> General Server Smart NIC/Switch
Financial performance in FY2025Q1 (3M)
FY2025Q1 (3M) | FY2024Q1 (3M) | ||||
Portion% | YoY | Portion% | |||
Revenues | 703 | 100.0 | 76.6 | 917 | 100.0 |
Gross Profit | 414 | 58.9 | 87.9 | 471 | 51.3 |
SG&A | 619 | 88.2 | 110.1 | 562 | 61.3 |
(R&D expenses) | 296 | 42.1 | 118.2 | 250 | 27.3 |
Operating Income | △205 | △29.3 | — | △91 | △10.0 |
(EBITDA) | △188 | △26.7 | — | △69 | △7.5 |
Ordinary Income | △343 | △48.9 | — | 42 | 4.6 |
(Reference purpose only) Ordinary Income without FX effects | △206 | △29.3 | — | △84 | △9.2 |
Net Income Attributable to Owners of the Parent | △261 | △37.1 | — | 13 | 1.5 |
(yen in million)
1,000
800
600
400
(unit: yen in million)
yen in million 600
Decreased By 13%
Revenues Gross Profit
Operating income EBITDA
Decreased by 39%
FY2024Q1
FY2025Q1
FY2024Q1
FY2025Q1
6%
Decreased
by 23%
18%
6%
3%
11%
20%
4%
5%
67%
60%
400
200
0
△ 200
LSI Biz AIOT Biz
200
0
FY2024Q1 FY2025Q1
LSI Biz in China and US became on a recovery trend while OA markets in Japan was still in the situation of inventory adjustment, resulted in revenue decrease by 13%.
AIOT Biz for wireless communication modules to AED (Automated External Defibrillator), elevators, etc. was in a stable situation, while some customers of vending machines, etc. decreased shipping units because of inventory adjustment. Compared to 2024Q1 with some spot
orders, 2025Q1 resulted in revenue decrease by 39%.
Financial performance in FY2025Q1 (3M) LSI Business by application markets
600
500
400
300
(unit: yen in million)
Industrial: decreased by 15%
(70% of total)
Automotive:
decreased by 3%
Consumer: Steadily expanding the new standard of THine’s interface decreased by 12% technology “V-by-One® HS plus” for high-resolution 4K/8K
(13% of total) television and display markets shows healthy growth.
(17% of total)
OA markets are on recovery trend but and amusement markets are still affected by adjusting inventory level: +30% increase in OA, △54% decrease in amusement, and △14% in other industrial.
Analysis
Continue to sell new products for EV markets. Shipment to
overseas markets increased: +10% increase in China and
+28% in US.
200
100
0
FY2024Q1 FY2025Q1
(unit: yen in million)
12%
16%
13%
Decreased by 13%
17%
72%
70%
1,500
1,000
500
QTR Sales in LSI business
2025Q2 and after are forecasted
0
1Q 2Q 3Q 4Q
Financial performance in FY2025Q1 (3M) AIOT Business by segment
400
300
200
(unit: yen in million)
Analysis
IoT products: decreased by 59%
(63% of total)
Solution:
AI and more: Focusing on newly launching solutions and products of server decreased by 58% business by THine HyperData inc., established in 2024.
increased by 372%
Business in monitoring systems for AED and elevators, etc. was stable while those in vending machines decreased by customers’ inventory adjustment, etc.
Developing new solution such as OEM routers for surveillance
cameras, gate access controllers made successful shipments.
100
0
3%
5%
Decreased by 39%
2%
35%
85%
63%
FY2024Q1 FY2025Q1
IoT products
(unit: yen in million)
1,500
1,000
500
0
QTR Sales in AIOT business
1Q 2Q 3Q 4Q
2025Q2 and after are forecasted
Financial performance in FY2025Q1 (3M) SGA compared to FY2024Q1 (3M)
51% to 59%
* Also continued government-contracted R&D project using 300GHz communication mostly at the cost of Japanese government, MIAC
(unit: yen in million)
△11
△45
△56
△205
△91
Operating loss in FY2024Q1
Decrease in gross profit
Increase in R&D investment
Increase in
other SG&A
Operating loss in FY2025Q1
Financial performance in FY2025Q1 (3M) R&D investment
Intensive investment in R&D
R&D in FY2025
(Planned)
AIOT Biz
R&D in FY2025Q1 (3M)
(actual)
compared to the plan: 22% compared to FY2024 118%
AIOT Biz 2%
LSI Biz 98%
4%
LSI Biz 96%
Focused development to achieve the goals of
the mid-term strategy, “Innovate100”
New V-by-One®HS products for display panels and cameras of EVs New power management products
The world-first optical IC technology for AI optical computing
Modules for edge AI computing
Voice-communication-support gateway products Smart IoT router products
Smart module solutions with neural processing units for AI processing
High-speed wireless communication technology applicable to 1000Gbps data transmission (Beyond 5G), etc.
Financial performance in FY2025Q1
(unit: yen in million)
Assets | Liabilities and Net Assets | ||||
End of FY2025Q1 | End of FY2024 | End of FY2025Q1 | End of FY2024 | ||
Cash and Cash Equivalent | 7,459 | 7,306 | Account Payable | 139 | 289 |
Account Receivables | 418 | 1,144 | Other Current Liabilities | 291 | 306 |
Inventories | 883 | 842 | Non-current Liabilities | 236 | 141 |
Other Current Assets | 238 | 264 | Shareholders’ Equity | 8,887 | 9,309 |
Property, Plant and Equipment | 164 | 161 | Accumulated Other Comprehensive Income | 369 | 79 |
Intangible Assets | 59 | 55 | Deferred Stock-based Compensation | 82 | 73 |
Investments and others | 898 | 554 | Non-controlling Interests | 114 | 130 |
Total Assets | 10,121 | 10,329 | Total Liabilities and Net Assets | 10,121 | 10,329 |
(unit: yen in million)
FY2025Q1 | FY2024Q1 | |
CF from Operating Activity | 328 | 140 |
CF from Investing Activity | 113 | △42 |
CF from Financing Activity | △166 | △204 |
Effect of Exchange Rate Changes | △122 | 91 |
CCE at the beginning of the FY | 7,306 | 7,377 |
CCE at the end of the QTR | 7,459 | 7,362 |
receivables, etc.
JPY158 as of the end of FY2024
JPY149 as of the end of FY2025Q1
Making our best effort to achieve the revenues of JPY10Billion in the mid-term strategy “Innovate100”
Innovate100(2025ー2027)
5G&Beyond-NE
(2022ー2024)
FY2027 Revenues of JPY10Bn or more
Assuming in the case of achieving the goal ROIC (return on invested capital) exceeds 10%
(JPY in million)
Revenues Gross profit
LSI Biz JPY5Bn
AIOT Biz JPY5Bn
※including Server Biz
10,000
8,000
6,000
Assumed THine’s performance under the mid-term strategy “Innovate100”
4,000
2,000
0
FY2024 FY2025 FY2026 FY2027
Outline of the next mid-term strategy, “Innovate100”Basic strategy
THine Group will contribute to accelerating implementation of AI use cases through its three business portfolio of LSI, AIOT, and Server, proposing low power solution for data center markets that shall increase power consumption enormously.
THine Group will proactively cultivate collaboration opportunities with partners, including M&A deals.
Typical action items
Launching solution business with AI processors
Widely applying THine’s LSI solution that can aggregate IoT wiring drastically
Launching EdgeAI solution business, supporting industrial IoT use cases
Developing new DSP-less optical chipsets that extraordinary reduce power consumption and latency
Providing wireless communication solution for smart meters that can be data source for AI-based sensing
Applying wireless communication solution to automotive and industrial equipment that communicate with cloud
Starting business for telecommunications carriers
Widely applying server business, including AI servers
Enhancing synergy among THine Group’s 3 business of LSI, AIOT solution, and Servers
On July 1st, 2025, Cathay Tri-Tech., Inc., THine Group’s AIOT solution company, will change its company name to
“THine MobileTek., Inc.”, enhancing THine Group’s synergy effects.
From this FY2025 THine Group has started its new mid-term strategy, “Innovate100,” aiming its goal of revenues in FY2027 with 10 billion yen or more.
(yen in million)
Forecast in FY2025 | FY2024 results | FY2023 results | |||||
Portion% | YoY | Portion% | Portion% | ||||
Revenues | 6,366 | 100.0 | 138.0 | 4,614 | 100.0 | 5,018 | 100.0 |
Gross Profit | 3,150 | 49.5 | 124.6 | 2,528 | 54.8 | 2,435 | 48.5 |
SG&A | 2,768 | 43.5 | 110.7 | 2,500 | 54.2 | 2,476 | 49.3 |
(R&D expenses) | 1,365 | 21.5 | 118.3 | 1,154 | 25.0 | 1,102 | 22.0 |
Operating Income | 381 | 6.0 | 1360.5 | 28 | 0.6 | △40 | △0.8 |
EBITDA | 455 | 7.2 | 363.4 | 125 | 2.7 | 173 | 3.5 |
Ordinary Income | 360 | 5.7 | 136.2 | 264 | 5.7 | 71 | 1.4 |
Net income attributable to Owner of the Parent | 301 | 4.7 | 88.9 | 339 | 7.4 | △69 | △1.4 |
(unit: yen in million)
5%
yen in million
Increase
by 32%
Revenues Gross profit
by 50%
4,000
3,500
LSI Biz AIOT Biz
6,000
5,000
4,000
3,000
2,000
Increase by 38%
8%
19%
3% 2%
68%
17%
2%
2%
73%
3,000
2,500
2,000
1,500
1,000
500
0
△ 500
FY2024 FY2025 FY2024 FY2025
1,000
0
FY2024 FY2025
Japan
LSI Biz’ forecast increases by 32%. Its OA markets are on a recovery trends and overseas markets such as China and US are on a growing trend.
AIOT Biz’ forecast increases by 50%, making intensive efforts on launching business for smart-meters, in addition to existing drive recorders, wireless communication modules to vending machine, elevators, AED, etc.
Shareholder return policyTHine Group makes efforts to achieve the new mid-term strategy, “Innovate100” and to return profits to shareholders based on assuming THine’s future growth. Dividend for FY2024 is 15JPN per share as forecasted and the forecast of dividend for FY2025 is at the same level as FY2024.
100.00%
<Trends of dividend since 2014>
Increased ordinary dividend to 15JPY (2022)
Despite the loss, keeping ordinary dividend of 15JPY (2023)
Forecast of
ordinary dividend of 15JPY (2025)
JPY
16.00
90.00%
80.00%
70.00%
60.00%
50.00%
40.00%
30.00%
20.00%
10.00%
0.00%
9JPY ordinary dividend from FY2014~2020. Although THine resulted in total loss in FY’15, FY’16, and FY’20, also made stable dividend.
Adding 30th Anniversary Commemorative dividend of 3JPY (2021)
14.00
12.00
10.00
8.00
6.00
4.00
2.00
0.00
FY2014 FY2015 FY2016 FY2017 FY2018 FY2019 FY2020 FY2021 FY2022 FY2023 FY2024 FY2025
dividend per sharedipidend payout ratioEnhancing user experience – simplifying cable wiring solution for in-vehicle touch panels for EVsStart volume production shipping of new V-by-One®HS products for EVs and industrial equipment
Enabling to transmit and receive fullHD60fps images, controlling signals, and voice signals only with 1 chip
Capable to handle approximately +28% more data volume, compared to similar-class products in automotive industry
THCV334-Q
Image receiving board
Application Processor
Touch panel display unit (voice communication support)
Supporting higher display resolution up to +28%
the world-fastest class SerDes support OpenLDI(LVDS)
Image transmitting board
(e.g. host processor board at ECU) THCV333-Q
Image data (LVDS)
Coax
STP
Cable
Sound data controlling signals
Automotive in-vehicle touch panel display
Information display
Rear seat entertainment
Navigation
Display Audio
Industrial embedded touch panel display
HMI/programmable display
Vending machines with touch panel
Elevator interior panel
Traffic monitors
New V-by-One®HS products for multi-panel solutions for EV’s and Industrial equipments
Images from left/right-side mirrors can be displayed on left/right-side window displays, simplifying automotive systems.
Achieves well-performing tach-panel responses, transmitting together with sound data through the same cables.
Contribution to envolving medical camerasV-by-One®HS product supports 4K medical cameras
Contributing to achieve 4K high-resolution endoscope cameras
The world smallest V-by-One® HS product enables to transmit images from 4K cameras to operating equipment for several meters through just one cable
THine’s image signal processor applicable simultaneously
Contributing for users to apply AI-based machine learning with 4K images for higher detection rates for early-
stage cancers
Operating host board of an endoscope
Camera part of an endoscope
Transmitter LSI
THCV243
Receiver LSI
THCV242A
Image signal processor THP7312
Ultra-small 2x3mm
long-distance data transmission by
V-by-One®HS
Application Processor
Image
Sensor
Contribution to simplifying sensing & control systemsLaunching the industry-first unique serial transceiver that enables to achieve IoT platform
IoT Platform Applied to Customer A
Adding a camera sensor and an acceleration sensor
No need to
re-design PCB
Flexible I/O pattern of sensors and controlling signals up to 4.3-billion different configuration degrees of freedom
Host PCB
Function PCB for sensors, touch panels, etc.
IoT Platform with THine
IoT Platform Applied to Customer B
Changing input pins of the camera sensor, removing the acceleration sensor, and adding pressure sensor, temperature sensor, and touch-panel sensor
Contribution to use cases with contactless communicationCollaboration with STMicroelectronics’s near field communication technology
To support for new use cases in high-speed contact connectivity, combining THine’s high-speed interface technology and ST’s 60GHz RF millimeter-wave
THine’s V-by-One® and other interface technologies, together with ST’s ST60A2 contactless 60GHz transceiver, enables high-speed data transmitting solutions of board-to-board contactless connections.
Seamless device-to-device data transfer without cables and connectors
(e.g., docking stations for PCs, game consoles)
THCV334
Display panel
Touch panel
Detachable Touch Panel Display Module
Solution for detachable touch panel display (Mechanical connectors replacement for large signage modules, water-proof and dust-proof, and vibration-resistant devices can also be realized.)
Image engine System on Chip
THCV333
Using STs' ST60A2
contactless communications
for 60GHz-band millimeter-wavCeopyright © 2025 THine Electronics, Inc. All Rights Reserved. 23
Contribution to reducing power consumption in AI data centersThe world-first DSP-less optical chipset (ultra-low power and ultra-low latency) supporting VCSEL
The world-first optical DSP-less technology, “ZERO EYE SKEWTM” for 2TB/s PCI Express 7.0,
saving power consumption by 80%, lowering latency by 90%
ZERO EYE SKEWTM demonstration at OFC
Exhibited in OFC2025 with significant responses from various attendees, communicating with potential partners, customers, system venders and operators of AI optical computing in data centers
Performance with ZERO EYE SKEWTM Performance without ZERO EYE SKEWTM
*By applying ZERO EYE SKEWTM technology, it has been shown that skew in the eye pattern opening is adjusted appropriately, maintaining excellent signal quality. (Both
are eye patterns after applying 5-tap feed forward equalizer (FFE).)
* “ZERO EYE SKEW” is THine Electronics, Inc’s trade mark or registered trade mark.
Copyright © 2025 THine Electronics, Inc. All Rights Reserved. 24
Innovating solution of beyond 5G and 8K, obtaining beyond growth advantagesR&D toward 1000Gbps ultra-high-speed data transmission
Successfully developed the World-First Mixed-Signal Baseband Demodulator Technology
Wide application
remote medical diagnosis,
eSports,
8K TV, etc.
Copyright © 2025 THine Electronics, Inc. All Rights Reserved. 25
EdgeAI-Link® one stop solution, enabling to link with cloud AI solution
Accelerate customers’ time-to-market of edge A solution, reducing total developing costs
Supporting 3.5 ~ 12 TOPS (Tera Operations Per Second), preparing for faster-TOPS lineups
Various available solution: full custom, SoC board solution, and EdgeAI Computers
Applications: facial recognition, store marketing, crime prevention, drive recorders, etc.
Full Custom Solution
SoC Board Solution
EdgeAI Computer
Module + SerDes
Customized solution for customers’ request
Complete finished products
EdgeAI-Link® one stop solution
AI signage solution for sales promotion in retail stores
Images of operation of AI signage solution for sales promotion in retail stores (an example of supporting customer attribute recognition in convenience stores)
Contribution to various IoT use casesLTE/BLE Gateway CTG-B01/B02
Product Overview
CTG-B01/CTG-B02 is a BLE/LTE gateway that can collect data from various BLE sensor devices and transmit the data via LTE lines. Two types are available depending on the type of LTE line: CTG-B01 for Cat.M and NB-IoT, and CTG-B02 for Cat.1bis.
Customized applications compatible with various BLE sensors can be developed using the development environment provided by BlueX Micro. GNSS receiver function and LTE connection function via external antenna are also available as factory production options.
Items | CTG-B01/CTG-B02 | ||
Left side connector | Application software connector | ① | SWD interface |
Top indicators | Power | ② | White |
LTE communication | ③ | Blue | |
Alarm | ➃ | Red | |
BLE communication | ⑤ | Green | |
Right side connector | SIM connector | ⑥ | Nano SIM push-push type |
USB power delivery connector | ⑦ | Type-C | |
Upper side connector | External RF antenna connector | Ⓑ | Valid when SMA・female is selected |
Average power consumption in operation | Idle state | CTG-B01 Approximately 60mA@5V DC CTG-B02 Approximately 50mA@5V DC | |
General operation state | CTG-B01 Approximately 80mA@5V DC CTG-B02 Approximately 60mA@5VDC | ||
Operating environment | Temperature | 0 ~ 40℃ | |
Humidity | 30 ~ 80% | ||
Storage environment | Temperature | -10 ~ 55℃ | |
Humidity | 30 ~ 80% | ||
Size | Length × Width × Height | 111.5 × 77 × 25.5 (mm) | |
Weight | Approximately 105g | ||
Upper side
Ⓑ
②
③
① ➃
⑤
Left side
⑥
⑦
Top Right side
SIM6600-eM2 supporting SIMO Cloud SIM
Features of SIMO Cloud SIM
Wireless communication Module
SIM6600-eM2
SIM6600-eM2 is a smart module with Android system and
supports LTE Cat.7.
It adopts MTK's 4-core 64-bit ARM Cortex-A53 processor with clock speed up to 2.0GHz and IMG GE8300 GPU.
It supports wireless communication modes such as LTE-TDD/LTE-FDD/HSPA+, and achieves communication speeds of up to 300Mbps downlink and 150Mbps uplink.
Benefits of applied products
It can connect to all carrier networks in Japan, so if a disaster causes a network outage, it will automatically switch to another carrier.
No need to insert a SIM, greatly reducing kitting work
Mobile Carriers
Uploaded to cloud
Dynamically pushed
SDK
Automatically selects the optimal line, ensuring constant online operation
Supports global carrier lines, can be used overseas
Can be used with a wide variety of products
Reasonable pricing plans
Examples of products supporting SIMO Cloud SIM
Industrial Router WiFi4/VPN
Dongle: Built-in antenna type
also available
MiniPC Windows11/ Linux Ubuntu
Major features
Standard M.2 interface
Embedded eSIM (2.6mm x 2.4mm)
MTK 4-core 64-bit ARM Cortex-A53 processor
High throughput data communication
Supports LTE and UMTS networks for global coverage
Rich software functions: Virtual SIM, FOTA, etc.
Toughness Tablet
IP camera
Copyr
With PoE
CPE
WiFi6
Contribution to various IoT use casesVideo call terminal CTV-003
Simple use Easy to set up
Easy to installation
Communication method
LTE (VoLTE)
Display
8-inch WXGA
Touch panel
Electrostatic multi-touch panel
Remote control
Specified low power radio
Size
235(W)x 195(H) x 65(D)mm
Power source
AC100~240V
Weight
0.9 kg
Operating temperature
0℃~40℃
Specification of the main terminal with stand
Features (supporting LTE)
Video call terminal, suitable for use cases in medical, welfare,
and nursing case
Easy calling at anytime from anywhere
LTE line supports calling at anytime from anywhere even from remote place, outside of office or home
Simple use allows even children or elderly people to operate easily
One touch operation on the touch panel
One push of a button of a remote controller
Comfortable communication with looking at speakers’ face
Simple remote controller, using specified low power radio, less susceptible to walls and obstructions than infrared communication
Battery-powered
user can talk for a certain time even in a sudden power outage
Re-dialing/auto answer function, equipped with functions designed for use in the medical and welfare fields, such as an “auto answer function” that automatically starts a video call and a “redialing function” that repeatedly dials until communication with the other party is established.
Copyright © 2025 THine Electronics, Inc. All Rights Reserved. 30
* Can also be used as a regular telephone.
