Full Year FY2025 |
Financial Summary1
May 15, 2025
Mipox Corporation
Securities Code: 5381
Refining innovation Sharpening the cutting edge
Paving the way for the next 100 years and reshaping the world's conventions
In Japan, there is a term called "tsuyuharai."
It refers to going ahead of a line of people and clearing away obstacles. Additionally, it signifies taking the lead and guiding others.
By extension, it implies being the first to take action or do something.
We remove the obstacles that stand in the way of our clients' futures.
We solve society's problems so that those who have yet to encounter them will not stumble.
For the past 100 years, we have been committed to providing solutions through our coating, slitting, and polishing technologies. Our mission is to refine the future for both our customers and society as a whole.
And while we work closely with you, we also focus on polishing our technology.
We will continue to polish with rigor and finesse to keep the future shining brightly for the next 100 years.
Agenda
01
Company Overview
Company overview
02
FY2025 2Q
Financial Results
FY2025 2Q Financial Results
03
Full Year Forecast
Full Year Forecast
04
Our Business
Our Business
05
Competitive Advantage
Competitive Advantage
06
Growth Strategy
Growth Strategy
07
Appendix
Appendix
Mipox株式会社 2025年3月期 通期決算説明資料 （証券コード5381）
3
01 Company Overview
Mipox Corporation Financial Results for the Fiscal Year Ended
in March 2025 (Securities Code: 5381)
Corporate Name
Founded on
Incorporated on
Mipox Corporation November 21, 1925
December 12, 1941
[Management Policy]
Increase Added Value
ue of through ch.
Enhance the added val our Product Business an engineering approa
Representative
Address
Listed on
Securities Code
Jun Watanabe, President and CEO
18 Satsuki-cho, Kanuma-shi, Tochigi, 322-0014
Tokyo Stock Exchange Standard Market 5381
Transform Business
4
Transition from an OEM business to an engineering services business.
Improve a Management Foundation
44
Establish a management foundation that can adapt to rapid changes and diversity.
01 Core Technologies
Mipox Corporation Financial Results for the Fiscal Year Ended
in March 2025 (Securities Code: 5381)
Perfected technical expertise in coating, slitting, and polishingWe have built our business around core coating, slitting, and polishing technologies, applying metal foil manufacturing techniques that have been practiced since our foundation.
Coating
Slitting
Polishing
We offer products and services that integrate our core technologies to enhance the added value we deliver for our customers' success.
We apply a uniform coating of formulated resins and other coating materials to PET film, copper foil, fabric, paper, and other base materials.
In addition to our proprietary abrasive and reflective materials, our multiple coating machines can create functional films tailored to meet specific customer needs.
The product, made using coating technology, is slit to the desired size. By leveraging the technology developed in the production of polishing films for hard disk drives, which require a high level of precision, we can achieve highly accurate slitting and winding even for materials that are considered challenging to slit, allowing us to deliver high-quality products.
We are dedicated to continuously researching the polishing process utilizing our proprietary abrasives and unique polishing equipment to develop products from a comprehensive and detailed customer perspective.
We aim to establish ourselves as trusted professionals in the polishing market by tackling the precision polishing of next-generation semiconductor wafers. To achieve this, we intend to leverage the high-precision polishing technology we have developed in the high-tech sector.
We apply a uniform coating of formulated resins and other coating materials to PET film, copper foil, fabric, paper, and other base materials.
In addition to our proprietary abrasive and reflective materials, our multiple coating machines can create functional films tailored to meet specific customer needs.
The product, made using coating technology, is slit to the desired size. By leveraging the technology developed in the production of polishing films for hard disk drives, which require a high level of precision, we can achieve highly accurate slitting and winding even for materials that are considered challenging to slit, allowing us to deliver high-quality products.
We are dedicated to continuously researching the polishing process utilizing our proprietary abrasives and unique polishing equipment to develop products from a comprehensive and detailed customer perspective.
We aim to establish ourselves as trusted professionals in the polishing market by tackling the precision polishing of next-generation semiconductor wafers. To achieve this, we intend to leverage the high-precision polishing technology we have developed in the high-tech sector.
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