Foxconn Interconnect Technology (FIT, 6088-HK), a leading provider of connectivity solutions under Hon Hai Technology Group (2317-TW), will showcase its latest innovations at DesignCon 2026 (Booth #719) from February 24-26. Addressing the surging power demands of the AI era, FIT is presenting its vision, "Shaping the Future of Data and Power: From Chips to Grid," featuring comprehensive AI data center solutions including 1.6T interconnects, Next-Gen CHIPLINK® 448G Solutions and [...]
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