2026 Interim Report
Filed with HKEX · Stock code 6088 · · 81 pages · English
Corporate Information 2 Financial Highlights 4 Management Discussion and Analysis 5 Report on Review of Interim Financial Information 15 Interim Condensed Consolidated Income Statement 17 Interim Condensed Consolidated Statement of 18 Comprehensive Income Interim Condensed Consolidated Balance Sheet 19 Interim Condensed Consolidated Statement of 21 Changes in Equity Interim Condensed Consolidated
Earlier from FIT Hon Teng
- FIT Tech Day 2026 Focuses on Optical Connectivity in the AI Era, Bringing Global Industry Leaders Together to Explore "Light at Scale"
- FIT Hon Teng Secures Amphenol Patent License to Propel High-Speed AI Connectivity
- Lightmatter Announces Reference Architecture Initiative with Industry Leaders in the Open Compute Project for Co-Packaged Optics
- FIT (Foxconn Interconnect Technology) Makes Its Debut at DesignCon 2026: Launching Its 448G CHIPLINK® Solution, Leading a Revolution in AI Data Center Computing Power
- FIT Hon Teng Announces Groundbreaking of Saudi Joint Venture Smart Mobility at King Salman Energy Park
Later from FIT Hon Teng
- Notification Letter and Reply Form to Registered Shareholders
- Notification Letter and Reply Form to Non-registered Shareholders
- Monthly Return of Equity Issuer on Movements in Securities for the Month Ended 30 September 2026
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