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Announcement on Submitting Application for H-share Offering and Listing to Hong Kong Stock Exchange and Publishing Application Materials

Announcement on Submitting Application for H-share Offering and Listing to Hong Kong Stock Exchange and Publishing Application Materials

articleNexchip Semiconductor Corp. Class ASeptember 29, 20254/news/announcement-on-submitting-application-for-h-share-offering-and-listing-to-hong-kong-stock-exchange-and-publishing-application-materials-19
Announcement on Submitting Application for H-share Offering and Listing to Hong Kong Stock Exchange and Publishing Application Materials

About this update from Nexchip Semiconductor Corp. Class A

Announcement on Submitting Application for H-share Offering and Listing to Hong Kong Stock Exchange and Publishing Application MaterialsThe abstract is for reference only. Please refer to the full text of the announcement on the very day.Link of Full Text for Reference: View Attachment

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