Aehr Test Systems · NASDAQ:AEHR

Aehr Test Systems — Investor Presentation (June 2018)

20 slides from Aehr Test Systems's investor presentation, June 2018

  1. Slide 1: Setting the Test Standard for Tomorrow

    Setting the Test Standard for Tomorrow Nasdaq: AEHR

  2. Slide 2: Forward Looking Statements

    Forward Looking Statements This presentation contains forward-looking statements that involve risks and uncertainties relating to projections regarding industry growth and customer demand for the Company’s products. Actual results may vary from projected results. These risks and uncertainties includ

  3. Slide 3: Aehr Test Systems Company Overview

    Aehr Test Systems Company Overview Production Semiconductor Test & Burn-in for over 40 Years!  Technology leader in massively parallel test & burn-in systems with Packaged Part Test & 2,500 systems installed worldwide Burn-in Solutions  Unique full-wafer test & burn-in systems and contactors Multi

  4. Slide 4: Aehr Test Systems - WW Customer Base

    Aehr Test Systems - WW Customer Base Over 2500 Aehr Test Systems shipped Worldwide! (Partial Customer List)

  5. Slide 5: Aehr Test Systems' Market Drivers

    Aehr Test Systems’ Market Drivers Need for cost-efficient burn-in & testing is growing rapidly due to increasing IC complexity, costs, miniaturization, and mission-critical functionality  Automotive IC growth in sensors, control, information, and entertainment has substantially higher requirements

  6. Slide 6: Automotive Device Expansion

    Automotive Device Expansion Automotive IC growth in sensors, control, information, and entertainment has substantially higher requirements for initial quality and long term reliability Collision Detection Gesture Recognition Autonomous / Driver Assistance

  7. Slide 7: Autonomous Vehicle Sensor Systems

    Autonomous Vehicle Sensor Systems Autonomous Vehicle Sensors: LIDAR, Radar, & Camera Systems

  8. Slide 8: Vehicle Reliability and Safety

    Vehicle Reliability and Safety

  9. Slide 9: Product Expansion in Mobility

    Product Expansion in Mobility Mobility smartphone and tablets driving increased test, quality, reliability, security, and environmental demands Gesture Increased Recognition & Biometric Augmented Quality & Proximity Sensors Security Reality Reliability

  10. Slide 10: Silicon Photonics Market

    Silicon Photonics Market Integrated laser devices directly on silicon transceiver drastically lowering the cost of fiber optic transceivers for data centers and the internet cloud are driving a new requirement and opportunity for wafer level and singulated die burn in and test Silicon Photonics Grow

  11. Slide 11: Burn-in Testing – The Bathtub Curve

    Burn-in Testing – The Bathtub Curve  Aehr seeks to virtually eliminate “Infant Mortality” failure in electronic Burn-in: components A functional test in which electronic components are subject to elevated  Burning-in components exposes them to a high-stress level and screens voltages and/or temper

  12. Slide 12: Production Burn-in / Reliability Test Options

    Production Burn-in / Reliability Test Options Singulated Single Die Die Package Singulated Singulated System Die Module /Product/PCB Module “Panel” Wafer Singulated System in Package Die

  13. Slide 13: Wafer Level Burn-in Testing

    Wafer Level Burn-in Testing  Package level burn-in is the current standard in the semi industry  Wafer level and singulated die testing offers a superior value proposition, but historically has not been technologically feasible or cost-effective  Next-generation ICs driving major need for Aehr’s

  14. Slide 14: Wafer vs. Package Level Burn-in Testing

    Wafer vs. Package Level Burn-in Testing WAFER LEVEL / DIE TESTING MODULE LEVEL / PACKAGE TESTING  Burn-in all individual die on the  Multiple ICs are tested for the first wafer time at the package or Module level  Scrap failures prior to packaging  A single IC failure results in scrapping the en

  15. Slide 15: Proprietary Wafer Level Enabling Technology

    Proprietary Wafer Level Enabling Technology  Aehr’s FOX-XP is capable of both functional burn-in and test solutions – leverages proprietary aligner and contactor technology  Multi-wafer technology enables customers to achieve an overall decrease in test equipment cost and fab footprint – while inc

  16. Slide 16: Chip-Scale Package Challenges

    Chip-Scale Package Challenges Chip-Scale packaging has been driven by the mobility market (smartphones). Burn-in cycling of these very tiny products – especially high power device requires new burn-in techniques. CSP devices are near die size packages (2-15 mm2) with a ball pitch of 1mm or less WL-C

  17. Slide 17: Proprietary Module Level Enabling Technology

    Proprietary Module Level Enabling Technology  Aehr’s FOX-XP is capable of both functional burn-in and test solutions – leverages proprietary DiePak contactor technology  Singulated Die / Module technology enables customers to achieve an overall decrease in test equipment cost and fab footprint – w

  18. Slide 18: Patent / IP Protected Wafer & Singulated Die Test Innovations

    Patent / IP Protected Wafer & Singulated Die Test Innovations 42 active patents issued and outstanding, including:  WaferPak and DiePak temperature control methods  Vacuum & pressure-based WaferPaks & DiePaks  Maintaining probe contact over temp  Electrical components in WaferPak/DiePak  Indivi

  19. Slide 19: Aehr Test Manufacturing Capacity

    Aehr Test Manufacturing Capacity  State of the art manufacturing facility located in Fremont, CA  50,000+ sq. foot facility  Ability to scale production by an order of magnitude increase in existing footprint  Manufacturing capabilities and quality control procedures have passed rigorous Tier 1

  20. Slide 20: Setting the Test Standard for Tomorrow

    Setting the Test Standard for Tomorrow Nasdaq: AEHR

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