Slide 1: Setting the Test Standard for Tomorrow
Setting the Test Standard for Tomorrow October 2024 Nasdaq: AEHR Aehr Test Confidential
Slide 2: Forward Looking Statements
Forward Looking Statements This presentation contains forward-looking statements that involve risks and uncertainties relating to projections regarding industry growth and customer demand for the Company’s products. Actual results may vary from projected results. These risks and uncertainties includ
Slide 3: Presenting Today
Presenting Today Gayn Erickson CEO, Aehr Test Systems 3 Aehr Test Confidential
Slide 4: Aehr Test Systems Company Overview
Aehr Test Systems Company Overview Semiconductor Test & Burn-in for over 45 Years! ⚫ World-wide leader in wafer-level test and burn-in systems XP ⚫ Unique full-wafer test and burn-in High Power systems and contactors High Power Multi-Wafer Test & Burn-In System Test & Burn-In System ⚫ Technology lea
Slide 5: Worldwide Customer Base
Worldwide Customer Base Aehr Test Headquarters, Fremont California Aehr has been a leader in burn-in test solutions for over 45 years with thousands of systems shipped worldwide (Partial Customer List) 5 Aehr Test Confidential
Slide 6: Aehr Test Systems Market Drivers
Aehr Test Systems Market Drivers Need for cost-efficient wafer level, singulated die, and packaged part burn-in, stabilization, & testing are creating significant revenue opportunities for Aehr Test in the following key markets ⚫ Artificial Intelligence Processors and Processing Infrastructure drivi
Slide 7: Aehr Market Growth Drivers
Aehr Market Growth Drivers 7 Aehr Test Confidential
Slide 8: Aehr Test Systems Market Growth Drivers
Aehr Test Systems Market Growth Drivers ⚫ Reliability test needs to grow with or ahead of the market as o Semiconductors are getting less reliable ✓ Larger die size and therefore more likely to have defects ✓ Smaller geometries ✓ More compound semis (SiC and GaN for power, and optical for communicat
Slide 9: Multi-Die Packages Drive Wafer Level Test & Burn-in
Multi-Die Packages Drive Wafer Level Test & Burn-in Onsemi EV Traction Inverters (24-die module for Power) Intel Co-Packaged Optics Demo at OFC 2024 Toshiba Micron NVIDIA 16-die NAND flash memory HBM3E 8 Die DRAM Stack Blackwell AI MCM announced at GTC 2024 for Enterprise Data Storage for AI and Sup
Slide 10: Key Trends Driving Wafer Level Burn-in
Key Trends Driving Wafer Level Burn-in Decreasing Increasing Increasing Semiconductor Reliability Reliability Needs Known Good Die ⚫ Smaller Geometries ⚫ Electric Vehicles ⚫ Heterogeneous Integration (Extends Moore’s Law) ⚫ Larger Die Sizes ⚫ Automotive Electronics ⚫ Multi-Die Modules ⚫ Compound ⚫ E
Slide 11: Aehr Test Systems Strategic Focus
Aehr Test Systems Strategic Focus Semiconductor Production Test, Reliability Burn-in and Screening ⚫ FY24 TAM Focus on Wafer Level Test and Burn-in (WLTBI) o SiC for EV, chargers, storage and power conversion o Silicon Photonics semiconductors for optical I/O and data transceivers ⚫ FY25 TAM Expansi
Slide 12: Burn-in Testing – The Bathtub Curve
Burn-in Testing – The Bathtub Curve Aehr Test Incal ⚫ Burn-in: A functional test Historical Historical in which electronic Focus Focus components are subject } } to elevated voltages and/or temperatures for Decreasing Failure Rate Constant Failure Rate Increasing Failure Rate a duration of time (2 –
Slide 13: SiC and Multi-Die Packages / Modules
SiC and Multi-Die Packages / Modules Package/Module yield loss cost much greater than cost of wafer level burn-in Tesla Traction Inverter with 24 2-die modules Lucid Traction Inverter with 3 10-die modules Onsemi Traction Inverter with 1 24-die module Onsemi Traction Inverter with 3 8-die modules 13
Slide 14: Module Yield
SiC and Multi-Die Packages / Modules Module Yield as Function of Burn-in Yield Loss per Die 100% 95% 90% 0.25% 85% Module Yield 0.50% 80% 75% 0.75% 70% 1.00% 65% 60% 1.25% 55% 50% 1.50% 0 4 8 12 16 20 24 28 32 Number of Die per Module ⚫ Infant Mortality Yield loss of Modules linear with yield loss p
Slide 15: AI Accelerator Example of Multi-Chip Packaging
AI Accelerator Example of Multi-Chip Packaging AMD Instinct MI325X Accelerator ⚫ Multiple Compute Chiplets ⚫ 8 12-Die HBM3 DRAM Stacks ⚫ Single OAM Substrate ⚫ Roadmap for new Chiplet Architecture Accelerators each year from 2023 to 2026 ⚫ 8 MI325X Cluster: 15 Aehr Test Confidential
Slide 16: Higher Reliability Needed in AI Processing?
Higher Reliability Needed in AI Processing? Meta article from July 2024: The Llama 3 Herd Models: https://a i.meta.co m/resear ch/pub lications/th e-llama-3-her d-of-models/ 16 Aehr Test Confidential
Slide 17: Aehr Wafer Level Test & Burn-in Patents
Aehr Wafer Level Test & Burn-in Patents ⚫ WaferPak temperature control methods ⚫ Vacuum & pressure-based WaferPaks ⚫ Maintaining probe contact over temperature ⚫ Electrical components in WaferPak ⚫ Individual DUT power supplies ⚫ Per Die Current Protection ⚫ Redundant power supplies ⚫ Portable Wafer
Slide 18: Proprietary Wafer Level Enabling Technology
Proprietary Wafer Level Enabling Technology ⚫ Aehr’s FOX-XP is capable of both functional burn-in and test solutions – leverages proprietary aligner and contactor technology ⚫ Multi-wafer technology enables customers to achieve an overall decrease in test equipment cost and fab footprint – while inc
Slide 19: FOX-XP Multi-Wafer Production Test & Burn-In System
FOX-XP Multi-Wafer Production Test & Burn-In System ⚫ 9 / 18 Wafer System for High Volume Production ⚫ Configurable for high power test for AI and Optical I/O ⚫ Configurable for Gate, Drain, and Body Diode Stress tests ⚫ Integrated standard 20ºC to 150ºC thermal control unit ⚫ FOX WaferPak Contactor
Slide 20: Aehr's New Fully Automated WaferPak Aligner
Aehr’s New Fully Automated WaferPak Aligner ⚫ Available in stand-alone as well as fully integrated with FOX-XP System configurations ⚫ Provides customers fully hands-free operation up to lights out SECS/GEM factory automation and integration ⚫ Both stand-alone and integrated configurations have now
Slide 21: Sonoma High Power Reliability Test of AI xPUs
Sonoma High Power Reliability Test of AI xPUs ⚫ High-power test & burn-in for reliability qualification and life-time tests ⚫ Up to 88 processors with independent test resources and high-power liquid cooling per device ⚫ Qualification and Production configurations ⚫ Shipping in volume with multiple
Slide 22: Testing without Compromise
Testing without Compromise Reliability, Stress, and DFT Testing without compromise ⚫ Solutions for package parts, modules, panels, or wafers allow testing at optimal process point ⚫ Confirm which devices received desired test with per device measurements, monitoring, & feedback ⚫ 100% traceability w
Slide 23: AI Accelerator/Processor WLTBI Opportunity
AI Accelerator/Processor WLTBI Opportunity ⚫ Aehr working with an AI Accelerator company to move their AI processor system level test and burn-in to wafer level ⚫ Our proprietary WaferPaks and new high-power FOX-XP system allow delivery of precise voltages at extremely high currents up to thousands
Slide 24: Flash Memory WLTBI Opportunity
Flash Memory WLTBI Opportunity ⚫ Aehr has been engaged with multiple Flash memory companies related to our FOX wafer level test and burn in systems for their high-volume production ⚫ Aehr has now secured a commitment from one of the major Flash memory suppliers to evaluate the FOX-XP system with our
Slide 25: Optical I/O is Coming…
Optical I/O is Coming… ⚫ “It was never about just … transceivers, it was about the learning curve because we knew that, down the road, optics needed to be co-packaged with Ethernet switches. And it will eventually be integrated with the CPU or XPU as well.” – Robert Blum, Senior Director of New Busi
Slide 26: Setting the Test Standard for Tomorrow
Setting the Test Standard for Tomorrow October 2024 Nasdaq: AEHR Aehr Test Confidential