Aehr Test Systems · NASDAQ:AEHR
Aehr Test Systems — Investor Presentation (June 2026)
26 slides from Aehr Test Systems's investor presentation, June 2026
Slide 1: Setting the Test Standard for Tomorrow
Setting the Test Standard for Tomorrow June 2026 | Nasdaq: AEHR
Slide 2: Aehr Test Systems Company Overview
Aehr Test Systems Company Overview Semiconductor Test & Burn-in for over 45 Years! ⚫ Worldwide leader in wafer-level XP test and burn-in systems ⚫ Unique full-wafer test and burn-in High Power High Power Multi-Wafer systems and contactors Test & Burn-In System Test & Burn-In System ⚫ Technology lead
Slide 3: Aehr Manufacturing Capacity
Aehr Manufacturing Capacity ⚫ State-of-the-art manufacturing facility located in Fremont, CA ⚫ 50,000+ sq. foot facility ⚫ Power and Infrastructure to support up to 400 wafers (tester Blades) and WaferPaks for Wafer Level Burn-in and 20 Package Level Burn-in Systems per month ⚫ Manufacturing capabil
Slide 4: Aehr Fremont Production Floor
Aehr Fremont Production Floor 4
Slide 5: Aehr Test Systems Market Drivers
Aehr Test Systems Market Drivers Need for cost-efficient wafer level, singulated die, and package level burn-in, stabilization, & testing is creating significant revenue opportunities for Aehr Test in the following key markets: ⚫ Artificial Intelligence Processors and Processing Infrastructure drivi
Slide 6: Worldwide Customer Base
Worldwide Customer Base Aehr Test Headquarters, Fremont California Aehr has been a leader in burn-in test solutions for over 45 years with thousands of systems shipped worldwide (Partial Customer List) 6
Slide 7: AI Processor Package vs Wafer Level Burn-in Flow
AI Processor Package vs Wafer Level Burn-in Flow Package Level Burn-In Test Flow Aehr Sonoma Wafer Test Packaging Pkg Test 1 Package Burn-In Pkg Test 2 SLT Aehr FOX-XP Wafer Burn-In Wafer Test Packaging Pkg Test SLT Wafer Level Burn-In Test Flow – High Quality Bare Die 7
Slide 8: Proprietary Wafer Level Enabling Technology
Proprietary Wafer Level Enabling Technology ⚫ Aehr’s FOX-XP is capable of both functional burn-in and test solutions – leverages proprietary aligner and contactor technology ⚫ Multi-wafer technology enables customers to achieve an overall decrease in test equipment cost and fab footprint – while inc
Slide 9: Aehr Wafer Level Test & Burn-in Patents
Aehr Wafer Level Test & Burn-in Patents ⚫ WaferPak temperature control methods ⚫ Vacuum & pressure-based WaferPaks ⚫ Maintaining probe contact over temperature ⚫ Electrical components in WaferPak ⚫ Individual DUT power supplies ⚫ Per Die Current Protection ⚫ Redundant power supplies ⚫ Portable Wafer
Slide 10: FOX-XP Multi-Wafer Production Test & Burn-In System
FOX-XP Multi-Wafer Production Test & Burn-In System ⚫ 9 / 18 wafer system high volume production ⚫ FOX-P blades configurable with same resource options as FOX-NP and FOX-CP blades ⚫ Delivers up to 2,048 independent universal channels or 1,024 High current or high voltage channels per blade ⚫ Deliver
Slide 11: FOX-XP with 18 Blades
FOX-XP with 18 Blades WOECUUCT dy
Slide 12: FOX-XP with Fully Automated WaferPak Aligner
FOX-XP with Fully Automated WaferPak Aligner ⚫ Fully automated FOX-XP System ⚫ Provides customers fully hands-free operation up to lights out SECS/GEM factory automation and integration ⚫ Configurable for 300mm to 100mm wafers using industry standard load ports ⚫ Optical wafer to WaferPak alignment
Slide 13: FOX-XP with Integrated WaferPak Aligners Floorplan
FOX-XP with Integrated WaferPak Aligners Floorplan 360 Wafer Capacity Footprint with full SECS/GEM E84 Automation 13
Slide 14: FOX-NP NPI and Engineering Test & Burn-In System
FOX-NP NPI and Engineering Test & Burn-In System ⚫ Dual wafer system for new product introduction, engineering and low volume production ⚫ FOX-P blades configurable with same resource options as FOX-XP and FOX-CP blades up to 3.5 kW per blade ⚫ Delivers up to 2,048 independent universal channels or
Slide 15: FOX WaferPak Contactor
FOX WaferPak Contactor ⚫ Extremely simple contactor “Probe Card” ⚫ No backside stiffener ⚫ No interposer required ⚫ No expensive tester interconnects ⚫ Simple per-pin repairability ⚫ Easy to manufacture in high volume ⚫ Enabling architecture for low cost of test FOX WaferPak Contactor ⚫ One aligner
Slide 16: Burn-in Testing – The Bathtub Curve
Burn-in Testing – The Bathtub Curve Production Reliability Screening / Qualification / Burn-in Burn-in ⚫ Production Burn-in: semiconductor components are } } subjected to elevated voltages and temperatures for a duration of Decreas ing Failure Rate Constant Failure Rate Increasing Failure Rate time
Slide 17: AI Accelerator/Processor PLBI Momentum
AI Accelerator/Processor PLBI Momentum ⚫ High-power package level test & burn-in for production, reliability qualification, and life-time tests ⚫ Up to 88 processors with independent test resources and high-power liquid cooling per device ⚫ Qualification and Production configurations ⚫ Shipping in v
Slide 18: AI Accelerator/Processor PLBI Momentum
AI Accelerator/Processor PLBI Momentum ⚫ Aehr Sonoma platform has the largest installed base of ultra-high- power burn-in systems for High Temperature Operating Life (HTOL) used for AI processors at test houses around the world. ⚫ Successfully captured the production system capacity needs from one o
Slide 19: Sonoma with Automated Loader / Unloader
Sonoma with Automated Loader / Unloader 19
Slide 20: AI Accelerator/Processor WLBI Momentum
AI Accelerator/Processor WLBI Momentum ⚫ Aehr worked with and successfully captured the first production orders from an AI Accelerator company to move their AI processor system level test and burn-in to wafer level on the Aehr FOX-XP system. Recently announced production capacity to drive incrementa
Slide 21: AI Accelerator Example of Multi-Chip Packaging
AI Accelerator Example of Multi-Chip Packaging AMD Instinct MI325X Accelerator ⚫ Multiple Compute Chiplets ⚫ 8 12-Die HBM3 DRAM Stacks ⚫ Single OAM Substrate ⚫ Roadmap for new Chiplet Architecture Accelerators each year from 2023 to 2026 ⚫ 8 MI325X Cluster: 21
Slide 22: Optical I/O is Here…
Optical I/O is Here… ⚫ "Spectrum-X Ethernet Photonics sets a new standard for scalable, energy-efficient Ethernet networks that power million-GPU AI clusters." – NVIDIA, March 2026 ⚫ “Intel® Optical Compute Interconnect (OCI) is a new class of optical connectivity devices, delivering multi-terabit p
Slide 23: Flash Memory WLBI Opportunity
Flash Memory WLBI Opportunity ⚫ Aehr has been engaged with multiple Flash memory companies related to our FOX wafer level test and burn-in systems for their high-volume production ⚫ Aehr recently completed the first phase showing full-wafer contact and test/burn-in of their 300mm NAND flash wafer us
Slide 24: Relative Size of Targeted Semiconductor Device Markets
Relative Size of Targeted Semiconductor Device Markets These are relative annual revenues of these semiconductor devices. Historically, annual capital spend on test ranges from 2% to 5% of the device annual revenue. Wafer Level Production Win Package Level Production Win Wafer Level Production Targe
Slide 25: Testing without Compromise
Testing without Compromise Reliability, Stress, and DFT Testing without compromise ⚫ Solutions for packaged parts, modules, panels, or wafers allow testing at optimal process point ⚫ Confirm which devices received desired test with per device measurements, monitoring, & feedback ⚫ 100% traceability
Slide 26: Setting the Test Standard for Tomorrow
Setting the Test Standard for Tomorrow June 2026 | Nasdaq: AEHR
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