Aehr Test Systems · NASDAQ:AEHR

Aehr Test Systems — New York Midtown CAP Summit December 2015

17 slides from Aehr Test Systems's conference presentation, December 2015

  1. Slide 1: Setting the Test Standard for Tomorrow

    Setting the Test Standard for Tomorrow December 2015 Nasdaq: AEHR Aehr Test Confidential

  2. Slide 2: Safe Harbor Statement

    Safe Harbor Statement This presentation contains forward-looking statements that involve risks and uncertainties relating to projections regarding industry growth and customer demand for the Company’s products. Actual results may vary from projected results. These risks and uncertainties include wit

  3. Slide 3: Aehr Test Investment Highlights

    Aehr Test Investment Highlights  Technology trends driving transformation in burn-in test process, migrating functional test from packaged parts to wafer level  Stacked die for SSD NAND flash  Small, hard-to-handle sensors in high value systems (mobile phones, tablets, wearables, IoT)  Automotiv

  4. Slide 4: Aehr Test Systems

    Aehr Test Systems  ABTS Advanced Burn-in and Test System platform for packaged parts introduced in 2009 with latest version ABTS-P/Pi introduced in 2012/13 (Replacement for successful MAX Burn-in System) ABTS Installation  Successfully developed Wafer Level Burn-in solution for DARPA contract in e

  5. Slide 5: Aehr Test New Product Lineup

    Aehr Test New Product Lineup  Worked with 3 of top 10 semiconductor manufacturers in the development of the ABTS and ABTS-P systems to address reliability qualification and high volume production burn-in of automotive devices and Application Processors ABTS-P Burn-in System  Worked with multiple l

  6. Slide 6: Emerging Auto IC Test Market Opportunity

    Emerging Auto IC Test Market Opportunity  Automotive IC growth in sensors, control, information, and entertainment has substantially higher requirements for initial quality and long term reliability Apple CarPlay Automotive Sensors and Advanced Driver Assistance Systems

  7. Slide 7: Production Test & Burn-in Floor

    Production Test & Burn-in Floor

  8. Slide 8: Wafer Level Test & Burn-in Roadmap

    Wafer Level Test & Burn-in Roadmap Systems -14 -1 -15 -P 14 200mm Wafers Single 300mm Wafer 15 300mm Wafers Single/Multi 300mm Wafers Active Thermal Control Liquid Thermal Control Liquid Thermal Control Active Thermal Control 1995 2002 2006 2009 2014/15 Contactors Singulated Die 200mm Wafer 300mm Wa

  9. Slide 9: Patents and IP Protected Wafer Level Test & Burn-in Innovations

    Patents and IP Protected Wafer Level Test & Burn-in Innovations  WaferPak temperature control methods  Vacuum & pressure-based WaferPaks  Maintaining probe contact over temp  Electrical components in WaferPak  Individual DUT power supplies  Per Die Current Protection  Redundant power supplies

  10. Slide 10: Multi-Wafer Production Test & Burn-in

    Multi-Wafer Production Test & Burn-in

  11. Slide 11: Wafer Level Burn-in: Why Now?

    Wafer Level Burn-in: Why Now? NAND Flash Market  Stacked die for SSD dramatically exacerbates any die yield issues  Finding yield issues post packaging on one die results in scrapping the entire package  Very costly to stack more than 4 die due to these yield issues Wafer level burn-in eliminates

  12. Slide 12: NAND Flash Market

    NAND Flash Market NAND Application Share (2013) NAND Wafers by Application Other 20.0 MP3 (Millions of 300mm equivalent) 7% 3% 18.0 SSD Wafer Starts Per Year 16.0 Tablets 14.0 Mobile 11% Cell Phones 12.0 Tablets 25% 10.0 PMP UFD 8.0 USB 14% SSD 6.0 21% 4.0 DSC/Video Flash Cards 2.0 Other 20% - 2011

  13. Slide 13: Sensors / IoT Market Opportunity

    Sensors / IoT Market Opportunity Total Connected Devices* Units Shipped by Year** 8.3B VERTICAL 50B+ AUTOMOTIVE by 2020 2013-2020 CAGR BUSINESS 38% 3.2B CONSUMER Mobile ~15B 1.2B + Tablet 2014 2017 2020 Aehr near term opportunities include Consumer & Automotive Sensors Source: * IDC May 2014, + Cisc

  14. Slide 14: Wafer Level Burn-in & Test

    Wafer Level Burn-in & Test Packaged Part Burn-in Market New Markets: Wafer Level $95M TAM $405M+ TAM PP Automotive IC PP & WL Automotive IC WL Sensor/LED/Laser Diode Production Burn-in Production Burn-in Production Burn-in / Aging Burn-in & Test Systems Burn-in & Test Systems Burn-in & Test Systems

  15. Slide 15: FOX-1P Single-Wafer Test System

    FOX-1P Single-Wafer Test System FOX-1P System in Aehr Test Fremont CA Facility FOX-1Ps with Dual Stage Wafer Prober FOX-1Ps in Manufacturing Line

  16. Slide 16: FOX-XP Multi-Wafer Test System

    FOX-XP Multi-Wafer Test System FOX-XP Development in Aehr Test Fremont CA Facility FOX-XP Engineering Workstation FOX-XP Production Test Cell

  17. Slide 17: Setting the Test Standard for Tomorrow

    Setting the Test Standard for Tomorrow December 2015 Nasdaq: AEHR Aehr Test Confidential

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