Aehr Test Systems · NASDAQ:AEHR
Aehr Test Systems — Investor Presentation (October 2016)
18 slides from Aehr Test Systems's investor presentation, October 2016
Slide 1: Setting the Test Standard for Tomorrow
Setting the Test Standard for Tomorrow Nasdaq: AEHR Aehr Test Confidential
Slide 2: Forward Looking Statements
Forward Looking Statements This presentation contains forward-looking statements that involve risks and uncertainties relating to projections regarding industry growth and customer demand for the Company’s products. Actual results may vary from projected results. These risks and uncertainties includ
Slide 3: Investment Highlights
Investment Highlights Relentless proliferation of the number of chips in mobile devices and automobiles Increasing complexity of devices increases risk of failure Current testing equipment and processes can’t economically support the proliferation of chips and complexity Tier 1 customers act
Slide 4: Company Overview
Company Overview Aehr is a leading designer and manufacturer of REVENUE & 25%+ CUSTOMERS burn-in test equipment for the semiconductor industry $14.5 million Package level and wafer level systems Others $10.0 million Aehr pioneered wafer level testing and recently introduced a number of innovat
Slide 5: Market Drivers
Market Drivers Need for cost-efficient burn-in & testing is growing rapidly due to increasing IC complexity, costs, miniaturization, and mission-critical functionality Mobility smartphone and tablets drive increased test, quality, reliability, and environmental demands – The Apple A7 processor chi
Slide 6: Burn-in Testing – The Bathtub Curve
Burn-in Testing – The Bathtub Curve Aehr seeks to virtually eliminate “Infant Mortality” Burn-in: failure in electronic components A functional test in which electronic Burning-in components exposes them to a high- components are subject to elevated stress level and screens out infant failures p
Slide 7: Wafer Level Burn-in Testing
Wafer Level Burn-in Testing Package level burn-in is the current standard in the semi industry Wafer level and singulated die testing offers a superior value proposition, but historically has not been technologically feasible or cost-effective Next-generation ICs driving major need for Aehr’s
Slide 8: Wafer vs. Package Level Burn-in Testing
Wafer vs. Package Level Burn-in Testing WAFER LEVEL / DIE TESTING MODULE LEVEL / PACKAGE TESTING Burn-in all individual die on the Multiple ICs are tested for the first wafer time at the package or Module level Scrap failures prior to packaging A single IC failure results in scrapping the en
Slide 9: Demonstrated Value to Tier 1 Customers
Demonstrated Value to Tier 1 Customers Tier 1 customers are buying Aehr’s FOX-XP systems to attain the following benefits: Throughput – Exponential increase in volumes tested at substantial time reductions addresses industry demands of high volume products where production speeds/time to market ar
Slide 10: Proprietary Wafer Level Enabling Technology
Proprietary Wafer Level Enabling Technology Aehr’s FOX-XP is capable of both functional burn-in and test solutions – leverages proprietary aligner and contactor technology Multi-wafer technology enables customers to achieve an overall decrease in test equipment cost and fab footprint – while inc
Slide 11: Patents and IP Protected Wafer Level Burn-in & Test Innovations
Patents and IP Protected Wafer Level Burn-in & Test Innovations 42 active patents issued and outstanding, including: WaferPak temperature control methods Vacuum & pressure-based WaferPaks Maintaining probe contact over temp Electrical components in WaferPak Individual DUT power supplies
Slide 12: Worldwide Customer Base
Worldwide Customer Base Over 2,500 Systems Shipped Worldwide ASE GROUP (Partial Customer List) 12 Aehr Test Confidential
Slide 13: Aehr Product Line Up
Aehr Product Line Up FOX-XP FOX-XP Multi Wafer FOX WaferPak FOX-XP Test System Launched July Next Gen WaferPaks Test Systems Aligner 2016 Multi Wafer Tests all devices on up to 18 wafers Testing simultaneously More extensive tests with deeper data stimulus, memory capture memory, and scan opti
Slide 14: Manufacturing Capabilities
Manufacturing Capabilities State of the art manufacturing facility located in Fremont, CA 50,000+ sq. foot facility Ability to scale production by an order of magnitude increase in existing footprint Manufacturing capabilities and quality control procedures have passed rigorous Tier 1 custom
Slide 15: Recent Events
Recent Events Highlights from Recent Earnings Calls & 10-K First announcement of Apple as largest customer in FY16 (10-K) Announced ~ $10M in orders in FQ1 – off to a strong start for FY17 Received first FOX-XP production test cell order ($4.5M) from Tier 1 customer that is Aehr’s second lead
Slide 16: Significant Leverage in Business Model
Significant Leverage in Business Model Increasing recurring revenue component of business model Significant expansion opportunity in gross margins (LTM gross margin ~35%) Operating expenses largely in place to support significant growth Long-term operating margin potential of 20%+ 16 Aehr Te
Slide 17: Investment Highlights
Investment Highlights Pioneer of enabling technology that provides wafer level testing in a multi-wafer environment with substrates up to 300 mm Value proposition addresses need for yield improvement and throughput while reducing time to test, test cost, component loss, and ultimately cost of ow
Slide 18: Setting the Test Standard for Tomorrow
Setting the Test Standard for Tomorrow Nasdaq: AEHR Aehr Test Confidential
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