Gallant Micro Machining Co. Ltd. · TPEX:6640
Gallant Micro Machining — Investor Conference (March 2024)
20 slides from Gallant Micro Machining's conference presentation, Mar 29, 2024
Slide 1: GMM
GMM SINCE 2010
Slide 2: Disclaimer
Disclaimer 2 This presentation contains some forward-looking statements that are subject to substantial risks and uncertainties. Typically, these statements contain words such as “anticipate” , “believe”, “could”, “estimate”, “expect”, “intend”, “plan” , “forecast” ,”project”, “predict”, “potential”
Slide 3: Agenda
Agenda 3 Operating Result Market Trend & Product Development
Slide 4: 4
4
Slide 5: Operating Results
Operating Results 5 Unit : TWD thousand Year 2024/01~02 2023 2022 2021 2020 2019 Accumulated Amount % Amount % Amount % Amount % Amount % Amount % Revenue-Consolidated 470,511 1,187,852 1,482,663 1,482,315 877,331 758,006 COGS 776,443 65.4% 886,296 59.8% 978,554 66.0% 616,404 70.3% 477,057 62.9% Gro
Slide 6: Quarterly revenue
Quarterly revenue 6 Unit : TWD thousand 500,000 470,511 450,000 466,323 400,000 350,000 300,000 250,000 256,470 200,000 226,845 238,214 150,000 100,000 50,000 - 2023Q1 2023Q2 2023Q3 2023Q4 2024/Q1 JAN~FEB
Slide 7: Key factors of profit growth
Key factors of profit growth 7 Constant investment with AP Plant Customized tech to value up product Deep dive to core tech & product Expand capacity for immediate service
Slide 8: Core Products
Core Products 8 Die Bonder Trim & Form Chip Sorter Laser Marking Jig Saw
Slide 9: Key & Core Technology
Key & Core Technology 9 Key & Core Technology includes Precision P&P, Photonics integration and precision machinery. Trim & Form LF/FPC/ PCB Punch Market share for Die Pick and Place machine Others Auto-Mold holds over 70% in Taiwan market. Wafer Level Molding Market share for Precision P & P
Slide 10: Rating of Core Product in 2023
Rating of Core Product in 2023 10 Others 13% TnF 13% Laser Pick&Place 8% 66%
Slide 11: Market Positioning
Market Positioning 11 TW IC packaging Equipment Industry Metaverse High Performance Computing AI Internet of Things Mobile Device Automotive Electronics
Slide 12: Customer Pool
Customer Pool 4, GMM 12 SSss ASE GROUP CHIPLOND = BE: me 22: ae Pe FRABFR — oReATEK ~ yy ChipMOS Bee DO Tithe CMsen pings woninwtunrecwcer MICROCHIP ~~ nstenan Om Tion. Cee +t ad
Slide 13: Vision and Business Strategy
Vision and Business Strategy 13 Become a world-class / regional-leading enterprise 專注特定領域 Dedicate to 價值導向為 Value-added advanced packaging 及市場 market 目標 oriented
Slide 14: Competitive Advantage
Competitive Advantage 14 Brand Decentralized G2C alliance identity over customer collaboration 40 years share Close ＆ Technology stable recognized customer by first well- known relationship brands
Slide 15: Growth strategy
Growth strategy 15 Benchmarking international competitors Expand applications and fields on the basis of core technology to roll out new products Multiple increasing of productivity capacity Standard modularized and flexible product mode
Slide 16: 16
16
Slide 17: Market Opportunities & trend
Market Opportunities & trend 17 2022~2028 Global advanced packaging market revenue is estimated to have CAGR of 10% Master the trend of advanced packaging and strategically layout key products.
Slide 18: RD Innovation – Product Cultivation
RD Innovation – Product Cultivation 18 Chip sorter Die Bonder Jig Saw
Slide 19: Future Prospect
Future Prospect 19 Promote Competitive Products Promote Taiwan Keep Growing core products to Revenue overseas market
Slide 20: Thank You
Thank You
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