Slide 1: Investor Conference
2025年第三季法人說明會 Investor Conference 2025.09.05
Slide 2: 免責聲明 Disclaimer
免責聲明 Disclaimer This presentation contains some forward-looking statements that are subject to substantial risks and uncertainties. Typically, these statements contain words such as “anticipate” , “believe”, “could”, “estimate”, “expect”, “intend”, “plan” , “forecast” ,”project”, “predict”, “potenti
Slide 3: A Future Beyond 10X
A Future Beyond 10X Source: TSMC, Fubon Securities Investment Advisory
Slide 4: Advanced Packaging – Key Development Focus
Advanced Packaging – Key Development Focus Multi Bin Multi Die Size
Slide 5: GMM - Precision Manufacturing, Driving the Future, Strengthening R&D
GMM - Precision Manufacturing, Driving the Future, Strengthening R&D Advanced packaging technologies are advancing rapidly, spanning CoWoS, Chiplet, SoIC, and WMCM. Focused on AI/HPC, we drive continuous innovation in high-precision pick-and-place equipment. GMM Delivering dependable, comprehensive
Slide 6: GMM Overview
Company Established in 2010 History 2018 IPO (Stock Code：6640) GMM Overview Main Products Advanced Packaging Pick & Place Chip Sorter Die Bonder Business Tucheng Taichung Locations Hsinchu Kaohsiung 6
Slide 7: 47+ Years semiconductor package inheritance
Advanced ITRI facilitated High share technology Developed in Pick & packaging GMM IPO Precision transfer from Inspection Place. equipment is on GPM GMM Initiated the Molding Toshiba. 12”Die Sorter Revenue: the rise, Established Developed Established development Processing Bonder Fan-Out NT$2.44 B de
Slide 8: Product Development Evolution
Product Development Evolution AOI Value-Added Sorter LEGO-like Modular Design → Maximizing Market Share for Sorters Bonder/ Sorter Integration of Inline Machines Complementary Core Bonder EFEM Technologies AOI Core Technologies Driving New Jig Saw Product Hybrid Bond Development Develo
Slide 9: Advanced packaging 85% up
Key Value Technology AI Sorter for Known Good Die 6S Inspection Chip Sorter Vision and Optics AP Equip. Manufacturer with best AOI Solutions Die Attach Die Bonder for Fan-out/ InFO/ CoWoS/ FOPLP Advanced packaging 85% up
Slide 10: AI Sorter for Known Good Die
AI Sorter for Known Good Die HBM HBM HBM HBM HBM HBM HBM HBM AI inspection HBM HBM HBM HBM Bin A IO HBM HBM HBM HBM HBM HBM HBM HBM Bin B IO HBM HBM HBM HBM HBM Bin C HBM HBM HBM HBM HBM HBM HBM HBM HBM Bin D
Slide 11: Strong Growth Momentum in Advanced Packaging Equipment Demand
Strong Growth Momentum in Advanced Packaging Equipment Demand
Slide 12: 2025 H1 Operating Results
2025 H1 Operating Results Unit: NT$ thousand
Slide 13: Operating Results
Operating Results Unit: NT$ thousand Operating Revenue Cumulative Revenue Year Month Last Year Monthly Cumulative Cumulative Growth Revenue (YoY) YoY Growth (%) Cumulative Revenue Revenue (%) Revenue 2025 6 339,669 122,274 177.79% 1,167,445 1,118,384 4.39% 2025 5 259,895 140,302 85.24% 827,776 996,1
Slide 14: Operating Results
Operating Results Unit: NT$ thousand
Slide 15: Historical Revenue and Market Value Growth
Historical Revenue and Market Value Growth Consolidated Revenue Unit: NT$ thousand Market Capitalization Unit: NT$100 million 200.0 3,000,000 181.1 180.0 2,441,879 2,500,000 160.0 140.0 2,000,000 120.0 1,482,315 1,482,663 1,500,000 100.0 1,187,852 80.0 1,000,000 877,331 60.0 40.8 40.0 30.3 500,000 2
Slide 16: 2025 Outlook
2025 Outlook Based on the current business outlook, H2 revenue is expected to grow significantly over H1, driven by sustained expansion in demand for advanced packaging processes. As of now, we have not observed any notable changes in direction or strategy from major customers. However, potential ex
Slide 17: 9/10-12 SEMICON TW (Booth N0762)
9/10-12 SEMICON TW (Booth N0762)
Slide 18: 10/7-9 SEMI WEST (Booth No.7531)
10/7-9 SEMI WEST(Booth No.7531) 10/8-9 SEMICON Kyushu 10/22-24 TPCA Show 12/17-19 SEMICON JAPAN