Gallant Micro Machining Co. Ltd. · TPEX:6640

Gallant Micro Machining — 2025年OTC法人說明會

20 slides from Gallant Micro Machining's conference presentation, Nov 11, 2025

  1. Slide 1: 2025年 OTC法人說明會 Investor Conference

    2025年 OTC法人說明會 Investor Conference 2025.11.11

  2. Slide 2: 免責聲明 Disclaimer

    免責聲明 Disclaimer This presentation contains some forward-looking statements that are subject to substantial risks and uncertainties. Typically, these statements contain words such as “anticipate” , “believe”, “could”, “estimate”, “expect”, “intend”, “plan” , “forecast” ,”project”, “predict”, “potenti

  3. Slide 3: 超過10倍速的未來

    超過10倍速的未來 Source: TSMC, Fubon Securities Investment Advisory

  4. Slide 4: TSMC CoWoS shipment and capacity growth trend

    Se ME EY Ae PUES BS A A th GMM TSMC’s annual CoWoS shipment growth trend TSMC’s annual CoWoS capacity growth trend 1,800 200% 2,000. 140% tree ATI% 1566 180% 1,800 BU ctad 1,740 Li ’ i. 160% / \ 120% 1,400 7 \ 1,600 / 110% / ~ 1,200 / \ 1,080 140% 1,400 [ \ 100% ‘e000 / \ 120% a / ‘1,200 E ; ] ~; 10

  5. Slide 5: 均華精密 — 精密製造,驅動未來,打造最堅實的研發後盾

    均華精密 — 精密製造,驅動未來,打造最堅實的研發後盾 先進封裝技術快速演進,涵蓋 CoWoS、SoIC、WMCM 、ASIC、CPO。 均華精密 聚焦 AI,持續研發高精度取放設備,為客戶提供穩健可靠的全方位後援。

  6. Slide 6: Advanced Packaging 發展主軸

    Advanced Packaging 發展主軸 Multi Bin Multi Die Size

  7. Slide 7: GMM Overview

    Company  Established in 2010 History  2018 IPO (Stock Code:6640) GMM Overview Main Products Advanced Packaging Pick & Place  Chip Sorter  Die Bonder Business  Tucheng  Taichung Locations  Hsinchu  Kaohsiung 7

  8. Slide 8: 47+ Years semiconductor package inheritance

    工研院技引 開發 先進封裝製 先進封裝製 GMM IPO Toshiba, Inspection 程設備高佔 程設備持續 GPM 精密模 12”Die 啟動 CoWoS 開發國內第 均華成立 Sorter 比營收營收 突破高佔比, 創立 具加工 Bonder Die Bonder 一台Chip Fan-Out 突破24億 H1營收約 Sorter Bonder 開發 EPS14.62元 12億元 1978 1988 1998 2008 2010 2014~2015 2018 2024 20252 DIP TSOP QFPP QFN BGA WLCSP SIP 2.5D IC 3D IC 47+

  9. Slide 9: 產品發展脈絡

    產品發展脈絡  AOI 加值 Sorter 佈局  客製化功能模組 → Sorter 市場延伸應用佔比極大化 Bonder/ Sorter Bonder  EFEM、串機模組 核心技術相輔相成 領軍系列產品  AI Inspection 核心技術  Hybrid Bond 發展 延伸新產品  Jig Saw

  10. Slide 10: AI Sorter for Known Good Die

    AI Sorter for Known Good Die HBM HBM HBM HBM HBM HBM HBM HBM AI inspection HBM HBM HBM HBM Bin A IO HBM HBM HBM HBM HBM HBM HBM HBM Bin B IO HBM HBM HBM HBM HBM Bin C HBM HBM HBM HBM HBM HBM HBM HBM HBM Bin D

  11. Slide 11: Sorter+Bonder and Laser+TnF+AM revenue

    @ Sorter+Bonder @ Laser+TnF+AM ES W% 80 75 60 57 59 51 45 45 40 38 29 24 20 12 : EE] 2020 2021 2022 2023 2024 GeCt

  12. Slide 12: Key Value Technology

    Key Value Technology AI Sorter for Known Good Die 6S Inspection Chip Sorter Vision and Optics AP Equip. Manufacturer with best AOI Solutions Die Attach Die Bonder for Fan-out/ InFO/ CoWoS/ FOPLP Advanced packaging 85% up

  13. Slide 13: GMM income statement summary

    GMM Unit: NT$ thousand Year | | | Accumulated Amount % Amount % Amount % Amount % Amount % Amount % Revenue-Consolidated 2,016,172 2,441,879 1,187,852 1,482,663 1,482,315 877,331 coGs 1,223,200 60.7% 1,518,370 62.2% 776,443 65.4% 886,296 59.8% 978,554 66.0% 616,404 70.3% Gross Margin 792,972 39.3% 9

  14. Slide 14: Monthly revenue

    —_ GMM Unit: NT$ thousand eelAg BWA - Rat BFA BABW |ATBABW |AFR AM) [BAR BW [Ae Aat Bl | AURAL RIS eL(%) 114} 9] 266,377 136,660 94.92%] __ 2,016,172 1,592,428 26.61% 114) 8] 394,121 169,096 133.08%| 1,749,795] __—1,455,768 20.20% 114} 7] + 188,229 168,288 11.85%| 1,355,674] 1,286,672 5.36% 114} 6]

  15. Slide 15: Accumulated and Q3 results year over year

    —_ GMM Svea Unit: NT$ thousand Year 2025mi1== 2024n1 == YoY 202503 2024093 YoY Revenue-Consolidated 2,016,172 1,592,428 27% 848,727 474,044 79% Gross Margin 792,972 607,489 31% 340,039 179,566 89% Gross Margin % 39.33% 38.15% 1% 40.06% 37.88% 2% Operating Expense 483,226 327,231 ° 48% 213,857 101,18

  16. Slide 16: 歷年營收與市值成長

    歷年營收與市值成長 Unit: NT$ 億元 Unit: NT$ 億元 ※ 係依每年最後一個營業日收盤價 *流通在外股數

  17. Slide 17: 2025 展望

    2025 展望 根據目前對營運前景的評估,GMM 預期可持續受惠於先進封裝製程需求的擴張,第四季營收表現可望 在 AI 所帶動的終端應用需求下維持穩健動能。 同時,隨著先進封裝技術於全球產線的持續導入與擴產,GMM 將持續深化與客戶間的合作與共同開發, 各產品線推進將同步進行。我們對整體年度營運表現仍保持正向期待,並視其具備進一步成長的亮點 與空間。

  18. Slide 18: SEMICON TW 2025 and 2026

    2025 SEMICON TW (Booth N0762) 2026 9/2-4SEMICON TW (Booth N0662)

  19. Slide 19: Coming up soon~~

    2025 12/17-19 SEMICON JAPAN 2025 Coming up soon~~ 2026 10/13~15 SEMICON West Booth 2149、2249 10/7 ~ 9 SEMICON West (Booth N07531)

  20. Slide 20: Coming up soon~~

    2025 12/17-19 SEMICON JAPAN 2025 Coming up soon~~ 2026 10/13~15 SEMICON West Booth 2149、2249 10/7 ~ 9 SEMICON West (Booth N07531)

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