Aehr Test Systems · NASDAQ:AEHR
Aehr Test Systems — LD Micro Investors Conference (October 2022)
20 slides from Aehr Test Systems's conference presentation, October 2022
Slide 1: Setting the Test Standard for Tomorrow
Setting the Test Standard for Tomorrow October 2022 Nasdaq: AEHR
Slide 2: Forward Looking Statements
Forward Looking Statements This presentation contains forward-looking statements that involve risks and uncertainties relating to projections regarding industry growth and customer demand for the Company’s products. Actual results may vary from projected results. These risks and uncertainties includ
Slide 3: Aehr Test Systems Company Overview
Aehr Test Systems Company Overview Production Semiconductor Test & Burn-in for over 40 Years! l Technology leader in massively parallel test and burn-in systems l World-wide leader in wafer- level burn-in and test systems l Unique full-wafer test and burn- in systems and contactors
Slide 4: Testing without Compromise
Testing without Compromise Reliability, Stress, and DFT Testing without compromise l Solutions for package parts, modules, panels, or wafers allow testing at optimal process point l Confirm which devices received desired test with per device measurements, monitoring, & feedback l 100% traceability w
Slide 5: Worldwide Customer Base
Worldwide Customer Base Aehr Test Headquarters, Fremont California Aehr has been a leader in burn-in test solutions for over 40 years with thousands of systems shipped worldwide (Partial Customer List)
Slide 6: Market Drivers
Market Drivers Need for cost-efficient wafer level and singulated die burn-in & testing as well as new requirements in package part burn-in are creating significant revenue opportunities in the following key markets l Automotive IC growth in motor control and charging infrastructure using Silicon Ca
Slide 7: Automotive & EV Semiconductor Device Market
Automotive & EV Semiconductor Device Market l Automotive IC growth in sensors, control, information, and entertainment has substantially higher requirements for initial quality and long-term reliability l New high bandgap / high voltage semiconductors (Silicon Carbide and Gallium Nitride) create new
Slide 8: A New Electric Vehicle World
A New Electric Vehicle World
Slide 9: Power Inverter in Electric Vehicle Drive Motors
Power Inverter in Electric Vehicle Drive Motors 900V DC Battery Pack 1200V DC to AC Silicon Carbide Power Inverters AC Induction Motors Source: Lucid Motors
Slide 10: EV Drive Train DC to AC Power Inverters
EV Drive Train DC to AC Power Inverters “Traction” Inverters per Motor Sources: Tesla, Audi
Slide 11: Silicon Carbide Modules in EVs
Silicon Carbide Modules in EVs l A 100kW 3-phase inverter for use in future Electric Vehicle (EV’s) chargers needs a 450A to 550A rated switch for a 400V rated battery l The largest SiC dies available at a 650V voltage rating are listed below l Several devices needed in parallel for the 3-phase powe
Slide 12: Burn-in at Module is Very Expensive on Yield
Burn-in at Module is Very Expensive on Yield Silicon Carbide Module with 10 Die Customers driving to move Silicon Carbide burn-in to Wafer Level
Slide 13: SiC and Multi-Die Packages / Modules
SiC and Multi-Die Packages / Modules Module Yield as Function of Burn-in Yield Loss per Die 100% 95% 0.25% 90% 85% 0.50% Module Yield 80% 75% 0.75% 70% 1.00% 65% 60% 1.25% 55% 50% 1.50% 0 4 8 12 16 20 24 28 32 Number of Die per Module l Infant Mortality Yield loss of Modules linear with yield loss p
Slide 14: Silicon Carbide Device Process Flow
Silicon Carbide Device Process Flow Source: onsemi
Slide 15: Package Part vs Wafer Level Burn in
Package Part vs Wafer Level Burn in Package / Module Part Burn-in Wafer Level Burn-in x18 l Up to ~ 2,500 SiC devices per system l Up to ~ 45,000 SiC devices per system l Individual device handling with limited life l 1000s of devices handled at a time with micro-pogo sockets and scrub marks on devi
Slide 16: Integrated Wafer Level Test & Burn-in Solution
Integrated Wafer Level Test & Burn-in Solution WaferPak Wafer Contactor FOX-Auto Aligner WaferPak FOX-XP WaferPak Insertion Consumable input into the test Performs wafer alignment “offline” Footprint similar to single wafer system driving recurring revenue which eliminates the need for one automated
Slide 17: Aehr Wafer Level Test & Burn-in Patents
Aehr Wafer Level Test & Burn-in Patents l WaferPak temperature control methods l Vacuum & pressure-based WaferPaks l Maintaining probe contact over temperature l Electrical components in WaferPak l Individual DUT power supplies l Per Die Current Protection l Redundant power supplies l Portable Wafer
Slide 18: Silicon Carbide Market Opportunity for AEHR
Silicon Carbide Market Opportunity for AEHR l Aehr qualified at several automotive suppliers through initial lead customer for Wafer Level test and burn in of modules and discrete SiC devices l Wafer level test and burn-in will become the industry standard for Silicon Carbide devices aimed at electr
Slide 19: Key Takeaways
Key Takeaways l Pioneer of next generation technology platform for wafer level testing l Significant need for lower cost wafer level test / burn-in l Wafer level and singulated die test / burn-in being adopted by across multiple high-growth markets including Silicon Photonics and Silicon Carbide l A
Slide 20: Setting the Test Standard for Tomorrow
Setting the Test Standard for Tomorrow Nasdaq: AEHR
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