22 slides from Orient Semiconductor Electronics's earnings presentation, May 15, 2026
Slide 1: Orient Semiconductor Electronics, Ltd.
華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd. （股票代號：2329）
Slide 2: Summary
Summary Part 1 Company Profile Part 2 Manufacture Service & Product Part 3 2026 Q1 Financial Performance Part 4 Competitive Advantage Part 5 Q&A 2/22
Slide 3: Company Profile
Company Profile 3/22
Slide 4: Company History
公司歷史 資本額 Capital : US$ 209M(NTD6.59B) Common Stock : US$ 209M(NTD6.59B) 2026 55th Anniversary Celebration 2015 & 2020 Strategic Partnership Announcement 2014 1st 16D microSD in the world 2005 Biz Transformation into Memory Market Apr, 1994 IPO in Taiwan Stock Exchange (TSE: 2329) 1971 Established Fo
Slide 5: Factory
Factory 6 Production buildings in NTIP Headcount : around 5,700 Headquarters (Flash Memory) Facility 2 (750,000 sq. ft.) (59,223 sq. ft.) LIC Facility 3 (256,200 sq. ft.) (158,638 sq. ft.) Facility 1 Facility 5 (146,475 sq ft.) (190,000 sq. ft.) 5/23
Slide 6: Company Organization
公司組織 Chairman Tony Tung President C. J. Tu Testing Group Semiconductor Group EMS Group • Memory IC Testing Service • Memory IC Packaging Service • EMS Service • Logic IC Testing Service • Logic IC Packaging Service 6/23
Slide 7: Manufacture Service & Product
Manufacture Service & Product 7/22
Slide 8: Total Solution: IC Packaging & Testing Service
Total Solution IC Packaging & Testing Service Drop Shipment Dry Pack Tape & Reel Final Test Assembly Wafer Grinding Wafer Probing 8/23
Slide 9: Total Solution: Electronics Manufacturing Service
Total Solution Electronics Manufacturing Service Product Design JDM, DFM, DFT NPI & Quick Turn Material from Customer Prototyping Procurement PCB Assembly Functionality & Reliability Repair and Distribution System Box Build Testing Upgrade Support Integration 9/239 OSE CONFIDENTIAL
Slide 10: Product Application
Product Application CSP/eMMC/SiP 10/23
Slide 11: 2026 Q1 Financial Performance
2026 Q1 Financial Performance 11/22
Slide 12: Consolidated Statements of Comprehensive Income (QoQ)
CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (QoQ) (Thousands of NTD) Q1/2026 % Q4/2025 % Variance Net revenue 4,860,476 100.00% 5,153,981 100.00% (5.69%) Gross profit 621,703 12.79% 791,370 15.35% (21.44%) Operating income 272,602 5.61% 422,215 8.19% (35.44%) Income before tax 291,646 6.00% 481,
Slide 13: Consolidated Statements of Comprehensive Income (YoY)
CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (YoY) (Thousands of NTD) Q1/2026 % Q1/2025 % Variance Net revenue 4,860,476 100.00% 4,077,476 100.00% 19.20% Gross profit 621,703 12.79% 538,557 13.21% 15.44% Operating income (loss) 272,602 5.61% 196,762 4.83% 38.54% Income (loss) before tax 291,646 6
Slide 14: Key Items & Index of Balance Sheet
Key Items & Index of Balance Sheet (Thousands of NTD) Q1/2026 Q4/2025 Variance Cash and cash equivalents 3,066,961 2,718,816 12.81% Financial assets-Noncurrent 2,346,166 1,833,683 27.95% & Investments-equity method Property, plant, and equipment 8,432,023 7,807,304 8.00% Total assets 22,594,916 20,7
Slide 15: Key Items & Index of Balance Sheet
Key Items & Index of Balance Sheet (Thousands of NTD) Q1/2026 Q1/2025 Variance Cash and cash equivalents 3,066,961 3,963,243 (22.61%) Financial assets-Noncurrent 2,346,166 1,755,000 33.68% & Investments-equity method Property, plant, and equipment 8,432,023 6,474,363 30.24% Total assets 22,594,916 1
Slide 16: IC Packaging and Testing Services
IC Packaging and Testing Services (Thousands of NTD) 3,500,000 100% 3,207,475 3,020,022 3,033,550 90% 3,000,000 2,724,769 80% 2,500,000 2,332,625 70% 2,113,934 2,091,219 60% 2,000,000 1,833,565 62% 59% 57% 56% 50% 57% 1,500,000 52% 51% 47% 40% 1,000,000 30% 20% 500,000 10% - 0% Q2/2024 Q3/2024 Q4/20
Slide 17: Semiconductor Group
Semiconductor Group -Percentage of revenue by product application 100% 9% 9% 8% 7% 8% 9% 9% 12% 13% 11% 13% 13% 18% 18% 80% 21% 15% 60% 40% 80% 81% 78% 78% 70% 73% 74% 73% 20% 0% Q2/2024 Q3/2024 Q4/2024 Q1/2025 Q2/2025 Q3/2025 Q4/2025 Q1/2026 記憶體相關產品 邏輯IC 測試 17/23
Slide 18: Electronics Manufacturing Services
Electronics Manufacturing Services (Thousands of NTD) 2,500,000 100% 2,243,866 2,080,486 2,120,431 2,135,707 90% 2,035,786 1,946,426 1,980,491 2,000,000 80% 1,744,851 70% 1,500,000 60% 50% 53% 1,000,000 49% 40% 48% 44% 43% 41% 43% 38% 30% 500,000 20% 10% - 0% Q2/2024 Q3/2024 Q4/2024 Q1/2025 Q2/2025
Slide 19: Competitive Advantage
Competitive Advantage 19/22
Slide 20: Competitive Advantage
- Capable of both IC & EMS / One-Stop Service. - Sufficient experience with world- class customers. Strong Customer list. - Advanced Process Capability - 25um wafer thickness - 16 Layers Die Stacking for micro SD/BGA/SD - Sip / Flip Chip / Wire Bond / Module Availability -High-end Technology - Digit
Slide 21: HAE a Hi FH
A HAE a Hi FH TION
Slide 22: Disclaimer
Disclaimer The presentation and the relevant information mentioned in this material have been compiled from both internal and external resources. These forward looking statements involve known and unknown risks, uncertainties and other factors, including price variation, competition, global economy,