Orient Semiconductor Electronics, Limited · TWSE:2329

Orient Semiconductor Electronics — Q2 2023 Earnings Presentation

23 slides from Orient Semiconductor Electronics's earnings presentation, Aug 18, 2023

  1. Slide 1: Orient Semiconductor Electronics, Ltd.

    華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd. (股票代號:2329)

  2. Slide 2: Summary

    Summary Part 1 Company Profile Part 2 Manufacture Service & Product Part 3 2023 Q2 Financial Performance Part 4 Competitive Advantage Part 5 Q&A 2/23

  3. Slide 3: Company Profile

    Company Profile 3/23

  4. Slide 4: Company History

    Company History 2021 50th Anniversary Celebration 2015 & 2020 Strategic Partnership Announcement 2014 1st 16D microSD in the world 2005 Biz Transformation into Memory Market 2000 HQ Building Officially Opened Apr, 1994 IPO in Taiwan Stock Exchange (TSE: 2329) 1971 Established 資本額 Capital : US$ 232M(

  5. Slide 5: Factory

    Factory 6 Production buildings in NTIP Headcount : around 4,900 Headquarters (Flash Memory) Facility 2 (750,000 sq. ft.) (59,223 sq. ft.) LIC Facility 3 (256,200 sq. ft.) (158,638 sq. ft.) Facility 1 Facility 5 (146,475 sq ft.) (190,000 sq. ft.) 5/23

  6. Slide 6: Organization

    Organization Chairman Tony Tung President C. J. Tu Testing Group Semiconductor Group EMS Group Terry Lin M. L. Tsai Major Lee • Memory IC Testing Service • Memory IC Packaging Service • EMS Service • Logic IC Testing Service • Logic IC Packaging Service 6/23

  7. Slide 7: Manufacture Service & Product

    Manufacture Service & Product 7/23

  8. Slide 8: Total Solution: IC Packaging & Testing Service

    Total Solution IC Packaging & Testing Service Drop Shipment Dry Pack Tape & Reel Final Test Assembly Wafer Grinding Wafer Probing 8/23

  9. Slide 9: Total Solution: Electronics Manufacturing Service

    Total Solution Electronics Manufacturing Service Product Design JDM, DFM, DFT NPI & Quick Turn Material from Customer Prototyping Procurement PCB Assembly Functionality & Reliability Repair and Distribution System Box Build Testing Upgrade Support Integration 9 OSE CONFIDENTIAL

  10. Slide 10: Product Application

    Product Application 6 a ee ee eee eee eee Consumer A tet = I i Memory Electronics nus | Automotive | Aerospace | Communication @ Leadframe Flash Memory Card Ov i o¢

  11. Slide 11: 2023 Q2 Financial Performance

    2023 Q2 Financial Performance 11/23

  12. Slide 12: Consolidated Statements of Comprehensive Income (QoQ)

    CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (QoQ) (Thousands of NTD) Q2/2023 % Q1/2023 % Variance Net revenue 3,998,666 100.00% 3,253,411 100.00% 22.91% Gross profit 740,953 18.53% 321,407 9.88% 130.53% Operating income 418,704 10.47% 101,004 3.10% 314.54% Income before tax 571,862 14.30% 97,749

  13. Slide 13: Consolidated Statements of Comprehensive Income (YoY)

    CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (YoY) (Thousands of NTD) Q2/2023 % Q2/2022 % Variance Net revenue 3,998,666 100.00% 4,288,219 100.00% (6.75%) Gross profit 740,953 18.53% 752,628 17.55% (1.55%) Operating income (loss) 418,704 10.47% 449,047 10.47% (6.76%) Income (loss) before tax 571,

  14. Slide 14: Consolidated Statements of Comprehensive Income (Accumulated, YoY)

    CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (Accumulated ,YoY) (Thousands of NTD) Q1~Q2/2023 % Q1~Q2/2022 % Variance Net revenue 7,252,077 100.00% 8,127,119 100.00% (10.77%) Gross profit 1,062,360 14.65% 1,404,312 17.28% (24.35%) Operating income (loss) 519,708 7.17% 815,531 10.03% (36.27%) Inco

  15. Slide 15: Key Items & Index of Balance Sheet

    Key Items & Index of Balance Sheet (Thousands of NTD) Q2/2023 Q1/2023 Variance Cash and cash equivalents 3,820,624 3,292,177 16.05% Financial assets measured at amortized cost - 243,520 (100.00%) Financial assets-Noncurrent 1,453,450 1,313,702 10.64% & Investments-equity method Property, plant, and

  16. Slide 16: Key Items & Index of Balance Sheet

    Key Items & Index of Balance Sheet (Thousands of NTD) Q2/2023 Q2/2022 Variance Cash and cash equivalents 3,820,624 3,466,255 10.22% Financial assets measured at amortized cost - - - Financial assets-Noncurrent 1,453,450 545,462 166.46% & Investments-equity method Property, plant, and equipment 5,184

  17. Slide 17: IC Packaging and Testing Services

    IC Packaging and Testing Services (Thousands of NTD) 3,500,000 100% 2,922,271 90% 3,000,000 2,822,748 2,586,920 2,722,849 80% 2,314,593 2,500,000 70% 2,148,511 2,063,876 70% 67% 68% 60% 2,000,000 61% 63% 68% 60% 50% 1,500,000 40% 1,000,000 30% 20% 500,000 10% - 0% Q4/2021 Q1/2022 Q2/2022 Q3/2022 Q4/

  18. Slide 18: Electronics Manufacturing Services

    Electronics Manufacturing Services (Thousands of NTD) 2,500,000 100% 90% 2,000,000 80% 70% 1,494,344 1,447,102 1,500,000 1,238,313 1,365,948 60% 1,251,980 1,275,817 1,189,535 50% 1,000,000 40% 39% 40% 30% 37% 33% 32% 32% 500,000 30% 20% 10% - 0% Q4/2021 Q1/2022 Q2/2022 Q3/2022 Q4/2022 Q1/2023 Q2/202

  19. Slide 19: Semiconductor Group

    Semiconductor Group -Percentage of revenue by product application 100% 8% 8% 8% 10% 9% 9% 7% 14% 16% 15% 80% 24% 20% 22% 18% 60% 40% 76% 78% 72% 72% 75% 68% 70% 20% 0% Q4/2021 Q1/2022 Q2/2022 Q3/2022 Q4/2022 Q1/2023 Q2/2023 Memory Related Logic IC IC Testing 19/23

  20. Slide 20: Competitive Advantage

    Competitive Advantage 20/23

  21. Slide 21: Competitive Advantage

    - Focus on Memory Market for 20 years. - Efficient Manufacture Platform for Memory. - Advanced Process Capability - 25um wafer thickness - 16 Layers Die Stacking for microSD/BGA/SD - 1ST 1TB microSD announced to market - Highly Systematized Production Environment - MES Automation System - One-Stop S

  22. Slide 22: HAE a Hi FH

    A HAE a Hi FH TION

  23. Slide 23: Disclaimer

    Disclaimer The presentation and the relevant information mentioned in this material have been compiled from both internal and external resources. These forward looking statements involve known and unknown risks, uncertainties and other factors, including price variation, competition, global economy,

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