25 slides from Orient Semiconductor Electronics's earnings presentation, Oct 1, 2026
Slide 1: Orient Semiconductor Electronics, Ltd.
華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd. （股票代號：2329）
Slide 2: Summary
Summary Part 1 Company Profile Part 2 Manufacture Service & Product Part 3 2026 Q2 Financial Performance Part 4 Outlook for 2026 Q4 Onward Part 5 Q&A 2/25
Slide 3: Company Profile
Company Profile 3/25
Slide 4: Company History
Company History Capital : US$ 208M(NTD6.59B) 2026 55th Anniversary Celebration 2015 & 2020 Strategic Partnership Announcement 2014 1st 16D microSD in the world 2005 Biz Transformation into Memory Market Apr, 1994 IPO in Taiwan Stock Exchange (TSE: 2329) 1971 Established Founder : Dr. Eugene C. Y. Du
Slide 5: Operating Locations
Operating Locations Production Employee Building Headquarters LIC (59,587 M²) (35,738 M²) Construction of New Factory (≒70,000 M²) Facility 1 Facility 3 (11,251 M²) *Launch Operation (15,691 M²) by the 2 nd Quarter of 2027 Facility 2 Facility 5 - EMS (5,625 M²) (15,705 M²) 5/25
Slide 6: Corporate Structure
Corporate Structure Chairman Tony Tung President C. J. Tu Testing Group Semiconductor Group EMS Group • Memory IC Testing Service • Memory IC Packaging Service • EMS Service • Logic IC Testing Service • Logic IC Packaging Service 6/25
Slide 7: Manufacture Service & Product
Manufacture Service & Product 7/25
Slide 8: Total Solution: IC Packaging & Testing Service
Total Solution IC Packaging & Testing Service Drop Shipment Dry Pack Tape & Reel Final Test Assembly Wafer Grinding Wafer Probing 8/25
Slide 9: Total Solution: Electronics Manufacturing Service
Total Solution Electronics Manufacturing Service Product Design JDM, DFM, DFT NPI & Quick Turn Material from Customer Prototyping Procurement PCB Assembly Functionality & Reliability Repair and Distribution System Box Build Testing Upgrade Support Integration 9/25 OSE CONFIDENTIAL
Slide 10: Product Application
Product Application CSP/eMMC/SiP 10/25
Slide 11: 2026 Q2 Financial Performance
2026 Q2 Financial Performance 11/25
Slide 12: Consolidated Statements of Comprehensive Income (QoQ)
CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (QoQ) (Thousands of NTD) Q2/2026 % Q1/2026 % Variance Net revenue 5,476,218 100.00% 4,860,476 100.00% 12.67% Gross profit 725,559 13.25% 621,703 12.79% 16.71% Operating income (loss) 345,365 6.31% 272,602 5.61% 26.69% Income (loss) before tax 453,261 8
Slide 13: Consolidated Statements of Comprehensive Income (YoY)
CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (YoY) (Thousands of NTD) Q2/2026 % Q2/2025 % Variance Net revenue 5,476,218 100.00% 5,263,888 100.00% 4.03% Gross profit 725,559 13.25% 787,827 14.97% (7.90%) Operating income (loss) 345,365 6.31% 419,883 7.98% (17.75%) Income (loss) before tax 453,261
Slide 14: Key Items & Index of Balance Sheet
Key Items & Index of Balance Sheet (Thousands of NTD) Q2/2026 Q1/2026 Variance Cash and cash equivalents 3,029,326 3,066,961 (1.23%) Financial assets-Noncurrent 6,630,744 2,346,166 182.62% & Investments-equity method Property, plant, and equipment 8,961,961 8,432,023 6.28% Total assets 26,654,758 22
Slide 15: Key Items & Index of Balance Sheet
Key Items & Index of Balance Sheet (Thousands of NTD) Q2/2026 Q2/2025 Variance Cash and cash equivalents 3,029,326 3,437,751 (11.88%) Financial assets-Noncurrent 6,630,744 1,441,800 359.89% & Investments-equity method Property, plant, and equipment 8,961,961 6,982,388 28.35% Total assets 26,654,758
Slide 16: IC Packaging and Testing Services
IC Packaging and Testing Services (Thousands of NTD) 3,500,000 100% 3,207,475 3,166,938 3,020,022 3,033,550 90% 3,000,000 2,724,769 80% 2,332,625 2,500,000 70% 2,091,219 1,833,565 60% 2,000,000 62% 57% 59% 56% 58% 57% 50% 1,500,000 51% 47% 40% 1,000,000 30% 20% 500,000 10% - 0% Q3/2024 Q4/2024 Q1/20
Slide 17: Electronics Manufacturing Services
Electronics Manufacturing Services (Thousands of NTD) 2,500,000 100% 2,309,280 2,243,866 2,120,431 2,135,707 90% 2,080,486 2,035,786 1,980,491 2,000,000 80% 1,744,851 70% 1,500,000 60% 50% 53% 1,000,000 49% 40% 43% 44% 42% 43% 38% 41% 30% 500,000 20% 10% - 0% Q3/2024 Q4/2024 Q1/2025 Q2/2025 Q3/2025
Slide 18: Semiconductor Group
Semiconductor Group -Percentage of revenue by product application Q2/2026 Test 12% Logic IC 16% Memory products 72% 18/25
Slide 19: Outlook of 2026 Q4 Onward
Outlook of 2026 Q4 Onward 19/25
Slide 20: 2026 Update to date
2026 Update to date Memory Industry: Supply-Demand Imbalance AI-driven demand has re-shaped the memory market, impacting demand for consumer electronics. NAND demand is rapidly shifting from consumer electronics toward AI Data Center, enterprise SSDs, and high-capacity storage solutions. The
Slide 21: 2026 Q4 Onward (IC BU)
2026 Q4 Onward(IC BU) IC BU: A Memory Manufacturing Platform The revenue from memory IDM customers continues to increase, supporting steady business growth. Enterprise SSD (eSSD for AI server, Data Center etc.) launch shipments, to provide AI customers One-stop shopping: from Wafer CP, packagi
Slide 22: 2026 Q4 Onward (EMS BU)
2026 Q4 Onward(EMS BU) EMS BU: A Key Supply Chain Partner for AI Customers The outlook for AI customer orders remains positive. Enterprise SSD memory modules have begun shipments to AI customers and are expected to become a growth driver next year. 22/25
Slide 23: Q&A
A HAE a Hi FH TION
Slide 24: Thank you
Thank you 24/25
Slide 25: Disclaimer
Disclaimer The presentation and the relevant information mentioned in this material have been compiled from both internal and external resources. These forward looking statements involve known and unknown risks, uncertainties and other factors, including price variation, competition, global economy,