22 slides from Orient Semiconductor Electronics's earnings presentation, Jun 14, 2024
Slide 1: Orient Semiconductor Electronics, Ltd.
華泰電子股份有限公司 Orient Semiconductor Electronics ,Ltd. （股票代號：2329）
Slide 2: Summary
Summary Part 1 Company Profile Part 2 Manufacture Service & Product Part 3 2024 Q1 Financial Performance Part 4 Competitive Advantage Part 5 Q&A 2/22
Slide 3: Company Profile
Company Profile 3/22
Slide 4: Company History
Company History 2024 53th Anniversary Celebration 2015 & 2020 Strategic Partnership Announcement 2014 1st 16D microSD in the world 2005 Biz Transformation into Memory Market 2000 HQ Building Officially Opened Apr, 1994 IPO in Taiwan Stock Exchange (TSE: 2329) 1971 Established 資本額 Capital : US$ 235M(
Slide 5: Factory
Factory 6 Production buildings in NTIP Headcount : around 5,200 Headquarters (Flash Facility 2 Memory) (59,223 sq. ft.) (750,000 sq. ft.) LIC Facility 3 (256,200 sq. ft.) (158,638 sq. ft.) Facility 1 Facility 5 (146,475 sq ft.) (190,000 sq. ft.) 5/22
Slide 6: Organization
Organization Chairman Tony Tung President C. J. Tu Testing Group Semiconductor Group EMS Group Terry Lin M. L. Tsai Major Lee • Memory IC Testing Service • Memory IC Packaging Service • EMS Service • Logic IC Testing Service • Logic IC Packaging Service 6/22
Slide 7: Manufacture Service & Product
Manufacture Service & Product 7/22
Slide 8: Total Solution: IC Packaging & Testing Service
Total Solution IC Packaging & Testing Service Drop Shipment Dry Pack Tape & Reel Final Test Assembly Wafer Grinding Wafer Probing 8/22
Slide 9: Total Solution: Electronics Manufacturing Service
Total Solution Electronics Manufacturing Service Product Design JDM, DFM, DFT NPI & Quick Turn Material from Customer Prototyping Procurement PCB Assembly Functionality & Reliability Repair and Distribution System Box Build Testing Upgrade Support Integration 9/22 OSE CONFIDENTIAL
Slide 10: Product & Application
Product & Application CSP/SIP 10/22
Slide 11: 2024 Q1 Financial Performance
2024 Q1 Financial Performance 11/22
Slide 12: Consolidated Statements of Comprehensive Income (QoQ)
CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (QoQ) (Thousands of NTD) Q1/2024 % Q4/2023 % Variance Net revenue 4,176,029 100.00% 4,736,282 100.00% (11.83%) Gross profit 826,627 19.79% 1,189,929 25.12% (30.53%) Operating income 518,217 12.41% 845,507 17.85% (38.71%) Income before tax 622,033 14.90
Slide 13: Consolidated Statements of Comprehensive Income (YoY)
CONSOLIDATED STATEMENTS OF COMPREHENSIVE INCOME (YoY) (Thousands of NTD) Q1/2024 % Q1/2023 % Variance Net revenue 4,176,029 100.00% 3,253,411 100.00% 28.36% Gross profit 826,627 19.79% 321,407 9.88% 157.19% Operating income (loss) 518,217 12.41% 101,004 3.10% 413.07% Income (loss) before tax 622,033
Slide 14: Key Items & Index of Balance Sheet
Key Items & Index of Balance Sheet (Thousands of NTD) Q1/2024 Q4/2023 Variance Cash and cash equivalents 4,281,821 3,909,728 9.52% Financial assets measured at amortized cost - - - Financial assets-Noncurrent 2,055,652 1,839,213 11.77% & Investments-equity method Property, plant, and equipment 5,370
Slide 15: Key Items & Index of Balance Sheet
Key Items & Index of Balance Sheet (Thousands of NTD) Q1/2024 Q1/2023 Variance Cash and cash equivalents 4,281,821 3,292,177 30.06% Financial assets measured at amortized cost - - - Financial assets-Noncurrent 2,055,652 1,313,702 56.48% & Investments-equity method Property, plant, and equipment 5,37
Slide 16: IC Packaging and Testing Services
IC Packaging and Testing Services (Thousands of NTD) 3,500,000 100% 3,117,660 3,157,307 2,922,271 90% 3,000,000 2,722,849 2,588,094 80% 2,314,593 2,500,000 2,148,511 70% 2,063,876 68% 68% 67% 66% 60% 2,000,000 63% 62% 61% 60% 50% 1,500,000 40% 1,000,000 30% 20% 500,000 10% - 0% Q2/2022 Q3/2022 Q4/20
Slide 17: Electronics Manufacturing Services
Electronics Manufacturing Services (Thousands of NTD) 2,500,000 100% 90% 2,000,000 80% 1,618,622 1,587,935 70% 1,544,770 1,365,948 1,494,344 1,447,102 1,500,000 60% 1,275,817 1,189,535 50% 1,000,000 40% 39% 40% 38% 37% 30% 33% 34% 32% 32% 500,000 20% 10% - 0% Q2/2022 Q3/2022 Q4/2022 Q1/2023 Q2/2023
Slide 18: Semiconductor Group
Semiconductor Group -Percentage of revenue by product application 100% 8% 10% 9% 9% 7% 8% 7% 9% 14% 15% 15% 14% 22% 18% 16% 15% 80% 60% 40% 76% 78% 77% 79% 76% 72% 75% 70% 20% 0% Q2/2022 Q3/2022 Q4/2022 Q1/2023 Q2/2023 Q3/2023 Q4/2023 Q1/2024 Memory Related Logic IC IC Testing 18/22
Slide 19: Competitive Advantage
Competitive Advantage 19/22
Slide 20: Competitive Advantage
- Capable of both IC & EMS / One-Stop Service. - Sufficient experience with world- class customers working with us. - Advanced Process Capability - 25um wafer thickness - 16 Layers Die Stacking for micro SD/BGA/SD - Sip / Flip Chip / Wire Bond / Module Availability -High-end Technology - Digitalizat
Slide 21: HAE a Hi FH
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Slide 22: Disclaimer
Disclaimer The presentation and the relevant information mentioned in this material have been compiled from both internal and external resources. These forward looking statements involve known and unknown risks, uncertainties and other factors, including price variation, competition, global economy,