Daxin Materials Corporation · TWSE:5234
Daxin Materials — Investor Conference 2025.02.26 TWSE Information Display Center
22 slides from Daxin Materials's conference presentation, Feb 26, 2025
Slide 1: Investor Conference
Daxin Materials Corporation 達興材料 Investor A Materials Design House and More Conference 2025.02.26
Slide 2: Disclaimer
Disclaimer DAXIN’s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward- looking statements. Except as required by law, we undertake no obligation to updat
Slide 3: Agenda
Agenda Company Profile Operating Result Outlook Daxin proprietary & confidential 2/19
Slide 4: Company Profile
Daxin proprietary & strictly confidential Company Profile
Slide 5: Company Profile
Company Profile July 12th, 2006 Foundation (JV of AUO & Eternal Chemical) Paid-in capital 1,027 million NTD 424 (until Jan., 2025) Employees R&D >50% IPO on TAIEX July, 16th, 2012 (Code:5234) Revenue Y2024:4,118 million NTD Semiconductor Materials Display Materials Major products Key Raw Materials O
Slide 6: Major Products
Major Products Semiconductor materials • Functions: Direct materials and indirect materials for wafer fabrication and packaging processes. • Products: Organic release layer、Photoresist Stripper、High-Purity Solvents、High- Resolution Etchants、Protection materials for specialty processes Display materi
Slide 7: Operation Results
Daxin proprietary & strictly confidential Operation Results
Slide 8: Consolidated Statements of Comprehensive Income-1
Consolidated Statements of Comprehensive Income-1 Unit:NTD M 2024 Q4 2024 Q3 QoQ 2023 Q4 YoY Operating revenue 1,067.4 100.0% 1,073.5 100.0% (0.6%) 997.6 100.0% 7.0% Operating costs 664.6 62.3% 675.5 62.9% (1.6%) 646.9 64.8% 2.7% Gross profit from operations 402.9 37.7% 398.0 37.1% 1.2% 350.7 35.2%
Slide 9: Consolidated Statements of Comprehensive Income-2
Consolidated Statements of Comprehensive Income-2 Unit:NTD M 2024 2023 YoY Operating revenue 4,117.8 100.0% 4,264.1 100.0% (3.4%) Operating costs 2,600.0 63.1% 2,785.0 65.3% (6.6%) Gross profit from operations 1,517.8 36.9% 1,479.1 34.7% 2.6% Selling expenses 196.2 4.8% 185.8 4.4% 5.6% Administrativ
Slide 10: Revenue & Gross margin
Revenue & Gross margin Daxin proprietary & confidential 9/19
Slide 11: Revenue by Product
Revenue by Product Daxin proprietary & confidential 10/19
Slide 12: Revenue of Semiconductor materials
Revenue of Semiconductor materials Daxin proprietary & confidential 11/19
Slide 13: Consolidated Balance Sheets Highlights
Consolidated Balance Sheets Highlights Unit:NTD M 2024/12/31 2023/12/31 YoY YoY % Cash and cash equivalents 195 3.9% 244 5.7% (49) (20.1%) Current financial assets at 1,424 28.8% 1,161 19.0% 263 22.7% amortized costs Accounts receivable 1,133 22.9% 1,069 26.3% 64 6.0% Inventories 380 7.7% 338 8.2% 4
Slide 14: Consolidated Cash Flows Highlights
Consolidated Cash Flows Highlights Unit:NTD M 2024 2023 Income before tax 659 605 Depreciation and amortization 271 260 Other operating activities 27 (70) Net cash flows from operating activities 865 725 Acquisition of property, plant and equipment (190) (218) Acquisition of financial assets at amor
Slide 15: Dividend Policy
Dividend Policy High Payout Ratio Policy Cash Stock Dividend Year EPS Dividends Dividends Payout Ratio 2024 5.56 5.0 0.0 90% 2023 5.10 4.1 0.0 80% 2022 4.15 3.3 0.0 80% 2021 6.62 5.3 0.0 80% 2020 6.15 5.0 0.0 81% Daxin proprietary & confidential 14/19
Slide 16: Outlook
Daxin proprietary & strictly confidential Outlook
Slide 17: Product Domains
Product Domains Semiconductor Display Materials for Materials for ◆ Wafer Process ◆ LCD ◆ Advanced Packaging ◆ MicroLED (Fan-out, 2.5D, 3D) Green & Key Raw Materials Daxin proprietary & confidential 16/19
Slide 18: SEMI Achievements & Operation Plans
SEMI Achievements & Operation Plans HVM Verification Co-Development with Independent Co-Development with Operational Focus Development Leading SEMI Companies Leading SEMI Chemical Companies Advanced packaging Laser release layer Bevel sealant PR stripper A Highly-selective etchant PR ancillary mater
Slide 19: Display Achievements & Operation Plans
Display Achievements & Operation Plans Low-temp curing materials (ESG), Cu stripper, FFS PI, ChLC PI Development of New Specifications 1 & LCD Products Expand PSA PI adoption to new customers & Market Focus – Liquid Crystal mass production sites 2 Alignment Layer PI Optimize production processes; In
Slide 20: 2025 Business Outlook
2025 Business Outlook Based on our current business outlook, the Company expects to continue investing and achieving steady growth in 2025. In terms of semiconductor materials • Three business models advancing in parallel, driving significant semiconductor revenue growth. 1. Independent Developmen
Slide 21: Q&A
Daxin proprietary & strictly confidential Q&A
Slide 22: Thank you
Daxin proprietary & strictly confidential Thank you
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