Daxin Materials Corporation · TWSE:5234
Daxin Materials — Q2 2025 Earnings Presentation
22 slides from Daxin Materials's earnings presentation, Aug 13, 2025
Slide 1: Investor Conference
Daxin Materials Corporation 達興材料 Investor A Materials Design House and More Conference 2025.08.13
Slide 2: Disclaimer
Disclaimer DAXIN’s statements of its current expectations are forward-looking statements subject to significant risks and uncertainties and actual results may differ materially from those contained in the forward- looking statements. Except as required by law, we undertake no obligation to updat
Slide 3: Agenda
Agenda Company Profile Operating Result Outlook Daxin proprietary & confidential 2 / 19
Slide 4: Company Profile
Daxin proprietary & strictly confidential Company Profile
Slide 5: Company Profile
Company Profile July 12th, 2006 Foundation (JV of AUO & Eternal Chemical) Paid-in capital 1,027 million NTD 424 (until Jan., 2025) Employees R&D >50% IPO on TAIEX July, 16th, 2012 (Code：5234) Revenue Y2024：4,118 million NTD Semiconductor Materials Display Materials Major products Key Raw Materials O
Slide 6: Major Products
Major Products Semiconductor materials Direct materials and indirect materials for wafer fabrication and packaging processes. • Advanced and Mature Wafer Process Materials • Advanced Packaging Materials (Fan-out, 2.5D, 3D) Display materials Direct materials and indirect materials of processes for LC
Slide 7: Operation Results
Daxin proprietary & strictly confidential Operation Results
Slide 8: Consolidated Statements of Comprehensive Income-1
Consolidated Statements of Comprehensive Income-1 Unit：NTD M 2025 Q2 2025 Q1 QoQ 2024 Q2 YoY Operating revenue 1,151.1 100.0% 1,106.1 100.0% 4.1% 1,028.2 100.0% 11.9% Operating costs 684.5 59.5% 653.4 59.1% 4.8% 645.3 62.8% 6.1% Gross profit from operations 466.5 40.5% 452.7 40.9% 3.1% 382.9 37.2% 2
Slide 9: Consolidated Statements of Comprehensive Income-2
Consolidated Statements of Comprehensive Income-2 Unit：NTD M 2025 H1 2024 H1 YoY Operating revenue 2,257.1 100.0% 1,977.0 100.0% 14.2% Operating costs 1,337.9 59.3% 1,260.0 63.7% 6.2% Gross profit from operations 919.3 40.7% 717.0 36.3% 28.2% Selling expenses 105.6 4.7% 95.3 4.8% 10.8% Administrativ
Slide 10: Revenue & Gross margin
Revenue & Gross margin Daxin proprietary & confidential 9 / 19
Slide 11: Revenue by Product
Revenue by Product Daxin proprietary & confidential 10 / 19
Slide 12: Consolidated Balance Sheets Highlights
Consolidated Balance Sheets Highlights Unit：NTD M 2025/6/30 2025/3/31 2024/6/30 Cash and cash equivalents 266 5.7% 166 3.3% 202 4.2% Current financial assets at 1,102 23.4% 1,564 31.0% 1,342 28.2% amortized costs Accounts receivable 1,192 25.3% 1,147 22.7% 1,105 23.2% Inventories 369 7.8% 380 7.5% 3
Slide 13: Consolidated Cash Flows Highlights
Consolidated Cash Flows Highlights Unit：NTD M 2025 Q2 2025 Q1 2024 Q2 Income before tax 186 226 164 Depreciation and amortization 69 68 68 Other operating activities (68) (101) (54) Net cash flows from operating activities 122 197 98 Acquisition of property, plant and equipment (68) (42) (75) Acquis
Slide 14: Dividend Policy
Dividend Policy High Payout Ratio Policy Cash Stock Dividend Year EPS Dividends Dividends Payout Ratio 2024 5.56 5.0 0.0 90% 2023 5.10 4.1 0.0 80% 2022 4.15 3.3 0.0 80% 2021 6.62 5.3 0.0 80% 2020 6.15 5.0 0.0 81% Daxin proprietary & confidential 13 / 19
Slide 15: Outlook
Daxin proprietary & strictly confidential Outlook
Slide 16: Industry Overview
Industry Overview Semiconductor From the second half of 2025 through year-end, the ongoing growth in AI server and high-performance computing demand will drive advanced packaging, advanced process technologies, and related materials — especially in sub-3 nm nodes and in areas such as CoWoS and HBM
Slide 17: Semiconductor Products
Semiconductor Products End Products Lithography Deposition High-Purity Solvent • Specialty Modifier PR Ancillary Materials Specialty Rinse Assembly High-purity Polymer Chip Design Packaging Laser Release Layer Cu Seed Etchant Photoresist Stripper Doping Etching Transfer Bonding Layer
Slide 18: Revenue of Semiconductor Materials
Revenue of Semiconductor Materials Daxin proprietary & confidential 17 / 19
Slide 19: Display Products
Display Products Low-temp curing materials (ESG), Cu stripper, FFS PI, ChLC PI Development of New Specifications 1 & LCD Products Expand PSA PI adoption to new customers & Market Focus – Liquid Crystal mass production sites 2 Alignment Layer PI Optimize production processes; Increase in-house Enhanc
Slide 20: 2025 Business Outlook
2025 Business Outlook Based on the current business outlook, the Company expects to maintain prudent and steady growth in 2025: In terms of Semiconductor and Key Raw Materials • Advance three business models in parallel to accelerate the pace of new product development (1. Independent research and
Slide 21: Q&A
Daxin proprietary & strictly confidential Q&A
Slide 22: Thank you
Daxin proprietary & strictly confidential Thank you