ULVAC to Sponsor ICEP-HBS 2026 as a Gold Sponsor

The 25th International Conference on Electronics Packaging (ICEP), Japan's largest international conference in the electronics packaging field, will be held in conjunction with the IEEE EPS Hybrid Bonding Symposium (HBS) as "ICEP-HBS 2026" this April at the International Conference Center Hiroshima (Hiroshima, Japan).
The ULVAC Group is proud to support the conference as a Gold Sponsor. Furthermore, in a first for an equipment manufacturer, ULVAC is contributing to the operation of the conference by serving as the General Chair of ICEP-HBS 2026.

External Links

ICEP-HBS 2026
https://www.jiep.or.jp/icep/
https://www.jiep.or.jp/icep/message/

For Further Information

ULVAC, Inc.　web_info