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Tundra Semiconductor Creates World's First RapidIO(R) Interoperability Lab

The RIOLAB(TM) Addresses Component Manufactures' and OEMs' Need to 
Accelerate Next-Generation RapidIO Products to Market

DALLAS, TX, Feb. 28 /CNW Telbec/ - Texas Instruments Developers
Conference 2006 - Tundra Semiconductor Corporation (TSX: TUN), the leader in
System Interconnect, today announced that the Company has launched the world's
first RapidIO Interoperability Lab (RIOLAB(TM)) for interoperability and
specification compliance testing. Leveraging its depth of expertise,
technology leadership, and commitment to drive the commercialization of
RapidIO technology, Tundra has served as a de facto test facility for members
of the RapidIO ecosystem and OEMs alike, resulting in the development of
proven test scripts and making the formalization of the RIOLAB a natural
evolution. Members of the RapidIO Trade Association (RTA) steering committee
including Ericsson, Freescale Semiconductor, Lucent Technologies, Texas
Instruments, Xilinx, and others immediately communicated their support for the
RIOLAB initiative as a critical milestone in furthering deployment of RapidIO-
based products.
"The RIOLAB will give commercial semiconductor vendors, FPGA and ASIC
developers as well as OEMs, the ability to validate interoperability of their
products to the RapidIO specification, and in the longer-term ensure full
device interoperability, increasing the potential for broader deployment of
the RapidIO standard," said Jag Bolaria, senior analyst at The Linley Group.
The launch of the RIOLAB will accelerate the realization of a test
facility that will provide the RapidIO community with formal interoperability
reports. The RIOLAB will be designed around graduated levels of
interoperability that align with the increasing complexity of both the RapidIO
specification and the needs of silicon vendors and OEMs. Operating as an
independent facility, the RIOLAB will produce consistent and impartial results
facilitating seamless integration of multi-vendor components and accelerating
time to market for OEM products. The RIOLAB will build upon the foundation of
interoperability checklists formalized by the RTA and is expected to be
operational by summer 2006.
"As a founding member of the RapidIO Trade Association, Tundra's depth of
expertise and number of years of practical lab experience and interoperability
work with leading RapidIO silicon vendors, has made it a natural choice for
Tundra to facilitate the creation of a RapidIO Interoperability Lab," said Jim
Parisien, product manager, Product Marketing Group, at Tundra Semiconductor.
"The establishment of an independent interoperability lab is a welcomed
evolution that will meet the needs of RapidIO ecosystem members and OEMs
alike."
As a separate wholly-owned subsidiary of Tundra, the RIOLAB will be a 
not-for-profit venture. Tundra is investing in the initial set-up costs and
will offset recurring costs with vendor test fees. As a member of the RapidIO
ecosystem, Tundra firmly believes that the early existence of an
interoperability lab will strengthen and accelerate the overall market
opportunity, which benefits the entire RapidIO community. Within 12 to
18 months of operation, the RIOLAB will be transitioned to a qualified third-
party vendor within the ecosystem.
"Tundra's role in accelerating the existence of a RapidIO community
interoperability lab is timely given the proliferation of new products
expected this year," said Tom Cox, executive director of the RapidIO Trade
Association. "With the support of other leading ecosystem vendors, this lab
will provide a facility where vendors can verify the function of their
devices, thereby reassuring customers that their development work can be
applications focused."
RapidIO is an established, scalable, open-standard, switched fabric,
designed by the leaders in embedded computing specifically to deliver the
reliability, cost-effectiveness, performance and scalability required by OEMs
building equipment in the wireless infrastructure, edge networking, storage,
scientific, military and industrial markets. The standard is supported by a
technology roadmap closely attuned to the changes affecting embedded
infrastructure designers.
A wide range of RapidIO products are currently available including:
semiconductors (DSPs, Communications Controllers, Switches, FPGAs, ASIC
Library Support), software (Processor and DSP RTOS Support), boards and
modules (ATCA Carrier Cards, AMC Modules for DSPs, Processors) and FPGAs. As
products proliferate, OEMs expect RapidIO Trade Association members to ensure
interoperability so they can design systems with certainty.
"As one of the vendors that will use RIOLAB, Tundra looks forward to
successful interoperability testing with more end points and switches to
provide evidence to OEMs that silicon can interoperate seamlessly in support
of designing RapidIO-based systems," said Rick O'Connor, chief technology
officer at Tundra Semiconductor. "Tundra is committed to our role within the
ecosystem by fulfilling the need for interoperability today making it easier
for OEMs to bring their next-generation RapidIO-based products to market
faster."

About the RIOLAB(TM)

The RIOLAB is a state-of-the-art, independent testing facility that
provides device interoperability and specification compliance reports that
meet the growing needs of silicon vendors and OEMs. More information contact:
info(at)rapidiolab.com.

About The RapidIO Trade Association

The RapidIO Trade Association and its global members drive the RapidIO
interconnect architecture. This ISO-certified, open-standard seamlessly
enables the chip-to-chip, board-to-board, control, backplane and data plane
interconnections needed in high-performance networking, communications and
embedded systems. The growth of the RapidIO ecosystem in 2005 seeded
deployment of RapidIO technology in next generation wireless infrastructure,
edge networking and military systems. Over 2006, the deployment of RapidIO
will be furthered through RapidIO Trade Association initiatives including
interoperability, interworking, the next Generation PHY Release, and system-
level application demonstrations. Detailed information on the RapidIO
specification, products, design tools, member companies, and membership is
available at www.RapidIO.org.

About Tundra

Tundra Semiconductor Corporation (TSX:TUN) is the global leader in System
Interconnect providing world-class support and leading edge semiconductor
solutions to the world's foremost communications, networking, storage system,
and information technology vendors. Consistently delivering on system level
performance promises that reduce time to market, Tundra System Interconnect
ensures market advantage in wireless infrastructure, storage networking,
network access, military, industrial automation, and information technology
applications. For more information, please visit www.tundra.com.

TUNDRA is a registered trademark of Tundra Semiconductor Corporation
(Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks of
Tundra Semiconductor Corporation (Canada - registration in the United States,
European Union, and People's Republic of China pending). RIOLAB and the RIOLAB
logo are marks of the RapidIO Interoperability Lab. RapidIO is a trademark of
the RapidIO Trade Association, Inc. Other registered and unregistered
trademarks are the property of their respective owners.

(C) Copyright 2006 Tundra Semiconductor Corporation. All rights reserved.
Information subject to change without notice.