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Tundra Expands Industry-Leading Portfolio of Serial RapidIO(R) Switches

· Issued by Tarku Resources Ltd
With Multicast Capability and a Small Footprint, the Tsi574(TM) Switch 
Targets DSP-Intensive Processing Applications - Wireless, Networking and 
Video Infrastructure

OTTAWA, May 29 /CNW Telbec/ - Tundra Semiconductor Corporation (TSX:
TUN), the leader in System Interconnect, today announced the Tundra Tsi574
Serial RapidIO Switch, a high-performance switch with patent-pending
technology that delivers the performance, power and configurability, designers
of embedded designs need to build reliable, high-performance RapidIO-based
systems for a wide range of applications such as wireless base stations, media
gateways, video infrastructure and DSP-intensive image processing.
The Tundra Tsi574 features:

- Link flexibility through mixed port widths and speeds
- Hardware multicast for improved distributed processing performance
- Supervised traffic flow for increased performance and fabric management
- Enhanced SerDes for the lowest power solution
- Low noise core, flip-chip packaging, adjustable drive current,
  adjustable pre-emphasis and receive equalization per lane contribute
  to high signal integrity

"The launch of the Tsi574 expands our portfolio of switches to include an
optimal offering for DSP aggregation on line cards," said Rick O'Connor, chief
technology officer at Tundra. "As we execute our RapidIO System Interconnect
strategy, we will continue to add to the current portfolio to address the full
spectrum of features our customers and partners need to design successful
RapidIO-based systems."

Highly Scalable, Low Port Count Serial RapidIO Switch

Based on the most recent release of the Serial RapidIO Specification
v1.3, the Tsi574 Serial RapidIO Switch sets industry benchmarks for high-
performance and low power consumption through an innovative feature set
supported by world-class design support. Ideally suited for high-performance
processor connectivity, the target applications such as media gateways and
baseband will benefit from the switch's ability to route packets to over
64,000 endpoints, independent unicast and multicast routing mechanisms, and
error management extensions that provide proactive issue notification to the
fabric controller.
This switch interconnects Serial RapidIO-enabled microprocessors, DSPs,
FPGAs, and peripheral devices, supporting an aggregate bandwidth of 40
Gbits/s. Scalable for a broad spectrum of networking, wireless and video
infrastructure applications, designers can take advantage of configuration
options to efficiently manage power requirements for high-performance. The
Tsi574's port flexibility supports up to four 4x mode ports or up to eight 1x
mode ports, with each port configurable to 1.25 Gbits/s, 2.5 Gbits/s or
3.125 Gbits/s. All of the switch's ports are completely independent and will
support mixed configurations of width and speed.
"When combined with our TMS320TCI6482, the industry's first high-
performance RapidIO-enabled DSP, we expect the multicast capability of the
Tsi574 Serial RapidIO Switch to enhance performance and simplify system design
for wireless applications." said Alan Gatherer, chief technology officer for
Texas Instruments Communications Infrastructure and Voice Group. "System
designers will benefit from new architectural base station design
possibilities by using serial RapidIO enabled products. High-performance,
scalable switches, such as the Tsi574, are an essential part of the RapidIO
ecosystem."

Serial RapidIO Switch Optimizes High-Performance in Systems

The Tsi574 integrates several features that allow the switch to leverage
the high-performance capabilities of the Serial RapidIO interconnect protocol.
The switch has low latency between ports and each port has optional store and
forward or cut-through modes providing peak performance in any configuration.
In addition, there is extensive traffic management through three fabric
scheduling algorithms and programmable buffer depth for guaranteed bandwidth.
Fabric performance monitoring enables supervised and managed traffic flows
that result in real-time fabric optimization. The Tsi574 offers low noise
core, flip chip packaging, adjustable drive current, adjustable pre-emphasis
and receive equalization per lane which all contribute to the highest possible
standards in signal integrity and performance.
"The launch of the Tundra Tsi574 switch signals momentum building behind
Tundra's growing RapidIO product portfolio, which has the depth to respond to
a wide spectrum of customers' needs for the wireless and video markets," said
Jag Bolaria, senior analyst at The Linley Group. "With multiple RapidIO
switches that are scalable for different price/performance points and include
advanced capabilities such as hardware multicast, Tundra continues to
strengthen its claim as the leader in RapidIO System Interconnect."

AVAILABILITY AND DESIGN SUPPORT TOOLS

The Tsi574 Serial RapidIO Switch will be sampling in September 2006.
Volume pricing for the Tsi574 is under $80USD. The Tsi574 is implemented in
0.13 micron CMOS technology, packaged in a 21mm x 21mm, 399ball FCBGA package.
The Tsi574 uses the same package as the Tsi564A(TM) and the two devices are
software compatible. The device requires 1.2V and 3.3V power supplies and is
rated for industrial and commercial temperature operations. The switch also
supports IEEE 1149.6 JTAG standard for high speed interconnects. For more
information on product features and benefits, go to www.tundra.com/tsi574
Using the Tundra Serial RapidIO Development Platform (SRDP) and
applications engineering support, designers can commence early stage product
development, later porting software to their own prototype hardware platforms,
resulting in faster time to market.

ABOUT TUNDRA RAPIDIO(R) SWITCHES

Tundra switches provide chip-to-chip interconnect between RapidIO end-
points and can replace existing proprietary backplane fabrics for board-to-
board interconnect. As a founding member of the RapidIO Trade Association and
long-time Steering Committee member, Tundra continues to provide leadership in
the development of the RapidIO standard and was the first semiconductor vendor
to bring Parallel and Serial RapidIO switches to market. RapidIO is the
leading serial interconnect standard for embedded systems and is supported by
industry leaders such as, Alcatel, AMCC, EMC Corporation, Ericsson, Freescale
Semiconductor and Lucent Technologies. The Tundra family of RapidIO switches
includes the Tsi574, Tsi578(TM), Tsi568A(TM), Tsi564A and Tsi500(TM).

ABOUT TUNDRA

Tundra Semiconductor Corporation (TSX:TUN) is the global leader in System
Interconnect providing world-class support and leading edge semiconductor
solutions to the world's foremost communications, networking, storage system,
and information technology vendors. Consistently delivering on system level
performance promises that reduce time to market, Tundra System Interconnect
ensures market advantage in wireless infrastructure, storage networking,
network access, military, industrial automation, and information technology
applications. For more information, please visit www.tundra.com.

Attachments:

Tundra Tsi574 Product Photo visit:
http://www.tundra.com/NewsRoom/MediaResources/ImageLibrary/Tsi574.cfm

Tundra Tsi574 Block Diagram visit:
http://www.tundra.com/pics/products/80B803B_BK001_01.gif

Tundra Semiconductor Products:
www.tundra.com/Products/ProductsListing.cfm

Tundra Semiconductor Webinars: www.tundra.com/NewsRoom/Webcasts/index.cfm

Tundra Semiconductor White Papers: www.tundra.com/whitepapers

TUNDRA is a registered trademark of Tundra Semiconductor Corporation
(Canada, U.S. and U.K.). TUNDRA and the Tundra logo are registered marks of
Tundra Semiconductor Corporation (Canada - registration in the United States,
European Union, and People's Republic of China pending). Tsi574, Tsi578,
Tsi568A, Tsi564A and Tsi500 are trademarks of Tundra Semiconductor
Corporation. RapidIO is a trademark of the RapidIO Trade Association, Inc.
Other registered and unregistered trademarks are the property of their
respective owners.
Development of the Tsi574(TM) was made possible in part with the
assistance of the Technology Partnerships Canada Program.

(C) Copyright 2006 Tundra Semiconductor Corporation. All rights reserved.
Information subject to change without notice.