Establishes FC-BGA Substrate Production Site in Singapore

Tokyo - September 30, 2026 - TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has recently established a production site for Flip Chip Ball Grid Array　(FC-BGA) substrates, high-density semiconductor packages, at ADVANCED SUBSTRATE TECHNOLOGIES PTE., LTD. (AST) in the Republic of Singapore.

This plant marks TOPPAN's first overseas production facility for FC-BGA substrates, supported by the Singapore Economic Development Board (EDB) and BROADCOM Inc., a leading provider of semiconductors for telecommunications. A ceremony to mark the opening was held on September 29.

With the widespread adoption of generative AI and data centers, data traffic volumes have skyrocketed, leading to a rapid global increase in demand for cutting-edge FC-BGA substrates to support this growth. Within that growing demand, there has been an urgent need to increase capacity specifically for delivering a stable supply of large-size, high-layer-count substrates required for AI and networking equipment. While TOPPAN had focused on increasing production primarily at its Niigata Plant, a new production facility was necessary to adapt to the increased manufacturing workload associated with larger size and higher layer count substrates and to meet growing future demand. Furthermore, from the perspective of business continuity planning (BCP) to prepare for natural disasters and geopolitical risks, it was essential to establish a risk-diversification system involving multiple facilities.

・TOPPAN's first overseas FC-BGA production facility
This is TOPPAN's first FC-BGA substrate production facility outside Japan. By also expanding major operations overseas with a move like this, TOPPAN will further strengthen its global production network.

・Focus on high-demand, large-size, high-layer-count substrates
By specializing in the manufacturing of large-size, high-layer-count substrates-essential for generative AI, machine learning (ML), and large-scale network switches-AST will contribute to a stable supply in response to rising demand.

・Establishment of 70,000 m² state-of-the-art facility and development of highly skilled workforce
AST operates a facility of approximately 70,000 m² in the vicinity of Jurong Lake District and employs more than 200 highly skilled engineers and technicians. AST has also established R&D functions to meet future market needs, as well as collaborative partnerships with local educational institutions.

AST held a ceremony on September 29 to mark the opening. The ceremony was attended by approximately 200 people, including high-ranking government officials, including Mr. Gan Kim Yong, Singapore's Deputy Prime Minister and Minister of Trade and Industry, and Mr. Png Cheong Boon, Chairman, EDB, as well as representatives from partner companies and major clients.

A product exhibition area was set up at the venue to showcase AST's cutting-edge FC-BGA substrates and TOPPAN's diverse product lineup. Attendees expressed strong interest in semiconductor packaging technology for AI and networking applications, for which global demand is on the rise.

The reason we chose Singapore as our global strategic hub is that we were deeply impressed not only by the business environment and locational advantages from the global perspective, but also by their forward-thinking approach-always looking toward the future-and their ability to bring those ideas to fruition. I am confident that being able to walk alongside all of you in this wonderful place will provide a major boost to AST's growth. Through a strong partnership with BROADCOM, TOPPAN and AST will deliver innovative technologies from Singapore to the global market and contribute to the development of a next-generation, highly digital society.

To meet global demand for cutting-edge semiconductor package substrates, TOPPAN has designated AST as its first overseas production site for FC-BGA substrates. Production will start in 2026, with TOPPAN aiming to support the development of global digital infrastructure by raising the FC-BGA business's production capacity to at least 2.5 times its fiscal 2022 level by the end of fiscal 2027.

Established in Tokyo in 1900, the TOPPAN Group is a leading and diversified global provider committed to delivering sustainable, integrated solutions in fields including printing, communications, security, packaging, décor materials, electronics, and digital transformation. The TOPPAN Group's global team of more than 50,000 employees offers optimal solutions enabled by industry-leading expertise and technologies to address the diverse challenges of every business sector and society and contribute to the achievement of shared sustainability goals.
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