STMicroelectronics high-performance vibration sensor with in-sensor AI offers a compelling alternative to piezosensor to fast-growing industrial condition-monitoring market

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ST's IIS3DWB10IS smart vibrometer STMicroelectronics high-performance vibration sensor with in-sensor AI offers a compelling alternative to piezosensor to fast-growing industrial condition-monitoring market Geneva, June 3, 2026 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an intelligent vibration sensor designed for industrial condition monitoring applications that require high accuracy, reliability, and energy efficiency. Built using ST MEMS (Micro Electromechanical Systems) technology, the IIS3DWB10IS vibration sensor with intelligent sensor processing unit (ISPU 2.0) brings advanced digital signal processing and AI inference closer to the sensing element. The result is a compact, rugged device that measures vibrations and shocks up to 200g at frequencies of 10 kHz and above. Combining digital precision and ease of use with a wide temperature range, up to 125°C, to withstand harsh environments, the vibration sensor is engineered to help customers improve equipment uptime, reduce unplanned downtime, and support predictive maintenance strategies across industrial environments. Vibration analysis is the dominant segment in condition monitoring, as many industries use rotating and oscillating machinery for cutting, shaping, moving, cooling, and other processes. The ability to prevent equipment stoppages through early detection of issues, such as predicting bearing failures in advance, helps companies across all sectors, including automotive and other manufacturing activities to optimize production flow. “Our industrial MEMS vibration sensor delivers the dynamic range and bandwidth needed for high-end applications and extends the advantages of ST in-sensor digital processing. Integrating the ISPU 2.0, with its new hardware accelerators for fast signal processing and AI inference, sharpens equipment-wear recognition while reducing latency and power consumption,“ said Simone Ferri, APMS executive VP MEMS sub-group. “Industries can expect a new generation of condition monitoring sensors, the first compelling alternative to piezosensor, that is lightweight, easy to fit and design, ultra-accurate, and energy efficient enough for battery-powered operations.” “The IIS3DWB10IS delivers unique properties for our target markets and environments. Its high dynamic range,...

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