SEALSQ and L5 Cartronics Partner to Develop Secure Multi-Package IoT Modules for Smart Cameras and Smart Metering

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Paris, France / Bangalore, India, July 14, 2026 (GLOBE NEWSWIRE) -- SEALSQ Corp (Nasdaq: LAES) ("SEALSQ" or the "Company"), a leading developer of semiconductor, PKI and provisioning technologies, and L5 Cartronics (LFC ) , a leading Indian electronics design and manufacturing company, today announced a strategic partnership to develop a new generation of highly competitive secure connectivity modules for IoT applications. The collaboration combines L5 Cartronics' expertise in innovative precision Clocking, Power and Interface solutions, and large-scale production with SEALSQ's hardware security technology through the integration of a SEALSQ secure element die into LFC's advanced multi-package module architecture. This approach enables a highly integrated, cost-efficient solution designed for scale manufacturing. LFC's proprietary Active EMI management technology serves as a key element of compliance standards set by various bodies such as STQC for the joint solution. A Secure and Cost-Optimized Module for the Next Generation of Connected Devices The first outcome of the collaboration will be the development of a compact, cost-effective secure module designed for high-volume IoT deployments. The companies expect this module to support broad OEM adoption across security- and compliance-driven applications. By integrating SEALSQ's secure element die directly into LFC's multi-package solution, the companies aim to provide OEMs with a turnkey module that combines wireless connectivity and embedded hardware security without increasing system complexity. The module will enable device manufacturers to securely provision cryptographic identities, authenticate devices, protect sensitive credentials and establish trusted communications with cloud platforms throughout the product lifecycle. This positions SEALSQ to participate in both initial hardware deployment and ongoing device lifecycle security management. The initial focus will be on two rapidly growing markets, both benefiting from increasing regulatory requirements and rising cybersecurity standards, driving demand for embedded hardware security: The solution has been designed to help manufacturers reduce bill-of-material costs while simplifying integration and accelerating product certification and time-to-market, key factors for large-scale IoT rollouts.

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