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Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs

TOKYO & SAN FRANCISCO, February 18, 2026--Renesas announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process at the ISSCC 2026.

Renesas Electronics CorporationFebruary 18, 20264
Renesas Develops 3nm TCAM Technology Combining High Memory Density and Low Power, Suitable for Automotive SoCs

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TOKYO & SAN FRANCISCO, February 18, 2026 --( BUSINESS WIRE )--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced a configurable ternary content-addressable memory (TCAM) built on a 3nm FinFET process. The new TCAM simultaneously delivers higher density, lower power and strengthened functional safety, making it suitable for automotive applications. Renesas presented the results at the International Solid-State Circuits Conference 2026 (ISSCC 2026), held February 15–19 in San Francisco, USA. With the rapid expansion of 5G and cloud/edge computing, network traffic continues to surge, driving demand for large and diverse TCAM configurations such as 256-bit × 4,096 entries. Conventional scaling that relies solely on hard macros increases peripheral area due to more banks and repeaters and makes timing closure more difficult, while also raising search power. Automotive applications further require higher safety coverage to meet standards such as ISO 26262. Renesas addresses these challenges with the following innovations. 1. Integrated Hard- and Soft-Macro Approach for Flexible Configuration The newly developed TCAM hard macros are supported by a memory compiler in fine granularities—search key widths of 8–64 bits and entry depths of 32–128. Larger configurations (e.g., 256-bit × 4,096 entries) are realized by combining these hard macros with tool-driven soft-macro auto-generation to provide a configurable single macro that covers a wide range of use cases on one chip. This achieves an industry-leading memory density of 5.27 Mb/mm². 2. All-mismatch Detection and Macro-Level Pipelined Search Each hard macro integrates an all-mismatch detection circuit (Note 1) and executes a two-stage pipelined search. Based on the first-stage result, the second stage can be continued or halted to avoid unnecessary energy consumption. For example, in 64–256-bit × 512-entry configurations, the approach reduces search energy by: In a 256-bit × 512-entry configuration, the design achieves low-power operation with search energy of 0.167 fJ/bit, and the distributed timing load enables a 1.7 GHz search clock. The resulting TCAM figure-of-merit (density × speed ÷ energy) reaches 53.8, exceeding prior work. 3. Enhanced Functional Safety for Automotive Applications (Split Data Bus and Dedicated SRAM) Because TCAM bitcells for the same address are physically adjacent, a double-bit error caused by soft errors cannot be corrected by conventional SECDED ECC (Note 2). Renesas mitigates this with two techniques: These measures significantly improve safety coverage required in automotive contexts. The TCAM’s flexible key widths and entry depths, combined with power savings and robust functional safety, make it well-suited not only for automotive use but also for industrial and consumer devices where high-speed data exchange between sensors and processors is essential. Renesas will continue to advance memory architectures that deliver high capacity, low power and high reliability. Notes About Renesas Electronics Corporation Renesas Electronics Corporation ( TSE: 6723 ) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com . Follow us on LinkedIn , Facebook , X , YouTube , and Instagram . (Remarks). All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners. View source version on businesswire.com: https://www.businesswire.com/news/home/20260218770189/en/ Contacts Media Contacts: Americas Akiko Ishiyama Renesas Electronics Corporation + 1-408-887-9006 [email protected]

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