Nanya Technology CorporationTWSE: 2408

Nanya Technology to Build 3D Wafer Packaging and Testing Fab in Pingtung Science Park

· Issued by Nanya Technology Corporation

Summary by 6ix AI

On October 1, 2026, Nanya Technology Corporation said it has received approval from Taiwan's National Science and Technology Council (NSTC) to establish a 3D wafer packaging and testing fab, a plant for packaging and testing chips stacked in layers, in Pingtung Science Park.

Key details

  • Nanya says the fab will use advanced 3D IC (stacked integrated circuit) technologies, including through-silicon via (TSV), which are vertical electrical connections passing through silicon chips, and wafer stacking.
  • Nanya says the fab will develop integrated wafer-level packaging and testing capabilities for high-performance and high-bandwidth memory solutions, which it says are driven by the rapid expansion of AI applications.

6ix AI wrote this summary from the release below and checked it against the release.

On 6ix: 6ix.com/news/nanya-technology-to-build-3d-wafer-packaging-and-testing-fab-in-pingtung-science-park

2026/10/01

Nanya Technology to Build 3D Wafer Packaging and Testing Fab in Pingtung Science Park

Taipei, October 1, 2026, Nanya Technology Corporation has received approval from Taiwan's National Science and Technology Council (NSTC) to establish a 3D wafer packaging and testing fab in Pingtung Science Park.

The new fab will incorporate advanced 3D IC technologies, including through-silicon via (TSV) and wafer stacking, to develop integrated wafer-level packaging and testing capabilities for high-performance and high-bandwidth memory solutions driven by the rapid expansion of AI applications.

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