Development of the iPHEMOS®-DDX Inverted emission microscope for failure analysis of advanced semiconductor packages

Hamamatsu Photonics has developed the iPHEMOS-DDX, an inverted emission microscope designed for failure analysis of advanced semiconductor packages, including AI chiplets, High Bandwidth Memory (HBM), 2.5D/3D packages, and large-scale semiconductor packages. The system enables flexible integration into existing tester-based measurement environments while improving failure analysis workflows and reducing analysis time.

Orders will be accepted starting on September 29, 2026, from semiconductor manufacturers and semiconductor equipment manufacturers worldwide. Hamamatsu Photonics will also exhibit the iPHEMOS-DDX at ISTFA 2026, which will be held in Texas, USA, from October 4 to October 8, 2026.