Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging

About this update from Cadence Design Systems, Inc.

Running on Allegro AI Studio, the AuraStack AI Super Agent delivers up to 2X faster time to market, 15X higher productivity and multiphysics-driven quality across the industry's only silicon-to-system agentic AI stack SAN JOSE, Calif., July 15, 2026 --( BUSINESS WIRE )--Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning to final product in a single AI-native environment. The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation and tightly integrated multiphysics analysis domains to compress the system-design cycle through manufacturing. With the AuraStack AI Super Agent, Cadence is now the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design, advanced packaging, through to PCB design, building on its ChipStack™, InnoStack™ and ViraStack™ AI Super Agents. "The next era of AI infrastructure—spanning data centers, automotive, aerospace and physical AI—will be defined not only by silicon, but by the systems that connect, power and cool it," said Michael Jackson, corporate vice president of R&D for System Design and Analysis at Cadence. "As hyperscale data centers deploy massive AI clusters and other industries advance increasingly intelligent, high-performance systems, engineering teams face growing complexity in PCB and advanced package design. Agentic AI orchestration, combined with trusted EDA and SDA tools, enables customers to move from manual iteration to intelligent, automated design realization." Agentic AI for Packaging and PCB Design Building on the same architecture as Cadence's ChipStack AI Super Agent, agentic AI is combined with principled simulation and optimization tools, leveraging a mental model of the design intent, to automate and orchestrate the design exploration, realization and signoff. The AuraStack AI Super Agent brings together automation and optimization for system planning, constraints management, physical structure definition, IP creation and reuse, place and route, design for manufacturability and multiphysics analysis across Cadence's system design and analysis portfolio. It introduces a unified, AI-driven multiphysics foundation that concurrently models and optimizes electrical, thermal and mechanical behavior—including SI/PI, thermal, mechanical stress, drop, vibration and fatigue analysis—within a closed-loop environment, enabling earlier tradeoff evaluation and product-level optimization across the entire design flow. This continuous multiphysics feedback loop enables real-time design convergence, reducing late-stage surprises and improving overall system reliability.

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