BE Semiconductor Industries N : BE Semiconductor Industries N.V. Announces Early Redemption of € 175 Million Senior Unsecured Convertible Bonds due 2029

About this update from Be Semiconductor Industries N.v.

THIS NOTICE IS IMPORTANT AND REQUIRES THE IMMEDIATE ATTENTION OF BONDHOLDERS. IF BONDHOLDERS ARE IN ANY DOUBT AS TO THE ACTION THEY SHOULD TAKE, THEY SHOULD SEEK THEIR OWN FINANCIAL AND LEGAL ADVICE IMMEDIATELY FROM THEIR STOCKBROKER, SOLICITOR, ACCOUNTANT OR OTHER INDEPENDENT FINANCIAL OR LEGAL ADVISER. NOT FOR DISTRIBUTION IN OR INTO THE UNITED STATES OR IN OR INTO AUSTRALIA, CANADA, JAPAN, SOUTH AFRICA OR ANY OTHER JURISDICTION IN WHICH SUCH DISTRIBUTION OR RELEASE WOULD BE PROHIBITED BY APPLICABLE LAW . PRESS RELEASE BE Semiconductor Industries N.V. Announces Early Redemption of € 175 Million Senior Unsecured Convertible Bonds due 2029 Duiven, the Netherlands, May 5, 2026 - BE Semiconductor Industries N.V. (the "Company" or "Besi") (Euronext Amsterdam: BESI; OTC: BESIY) announces today the exercise of its early redemption option with respect to its € 175 million 1.875% Senior Unsecured Convertible bonds due 2029 (ISIN: XS2465773070) (the "2029 Bonds") in accordance with Condition 4.1 of the terms and conditions (the "Conditions") of the 2029 Bonds. Currently, € 175 million aggregate principal amount of the 2029 Bonds is outstanding which represents 100% of the aggregate principal amount of the 2029 Bonds originally issued. The 2029 Bonds will be redeemed on June 4, 2026 (the "Redemption Date") at 100% of their principal amount (equal to € 100,000 per 2029 Bond). The Company will also pay accrued but unpaid interest on the 2029 Bonds up to but excluding the redemption thereof. The holders of the 2029 Bonds may exercise their conversion rights no later than May 26, 2026. The conversion price of the 2029 Bonds is currently € 115.50 per Besi ordinary share versus the closing price of the Company's ordinary shares of € 244.30 on Euronext Amsterdam at the end of yesterday's trading session. About Besi Besi is a leading manufacturer of assembly equipment supplying a broad portfolio of advanced packaging solutions to the semiconductor and electronics industries. We offer customers high levels of accuracy, reliability and throughput at a lower cost of ownership with a principal focus on wafer level and substrate assembly solutions. Customers are primarily leading semiconductor manufacturers, foundries, assembly subcontractors and electronics and industrial companies. Besi's ordinary shares are listed on Euronext Amsterdam (symbol: BESI). Its Level 1 ADRs are listed on the OTC markets (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands. For more information, please visit our website at https://www.besi.com . Inside information This press release relates to the disclosure of information that qualified, or may have qualified, as inside information within the meaning of Article 7(1) of Regulation (EU) No 596/2014 of the European Parliament and of the Council of 16 April 2014, as amended (the EU Market Abuse Regulation). Contacts Richard W. Blickman, President & CEO Andrea Kopp-Battaglia, Senior Vice President Finance Claudia Vissers, Executive Secretary/IR coordinator Edmond Franco, VP Corporate Development/US IR coordinator Tel. +31(0) 26 319 4500 [email protected]

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