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Announcement on Submitting Application for H-share Offering and Listing to Hong Kong Stock Exchange and Publishing Application Materials

Announcement on Submitting Application for H-share Offering and Listing to Hong Kong Stock Exchange and Publishing Application Materials

articleCircuit Fabology Microelectronics Equipment Co.,ltd. Class HSeptember 1, 20255/news/announcement-on-submitting-application-for-h-share-offering-and-listing-to-hong-kong-stock-exchange-and-publishing-application-materials-22
Announcement on Submitting Application for H-share Offering and Listing to Hong Kong Stock Exchange and Publishing Application Materials

About this update from Circuit Fabology Microelectronics Equipment Co.,ltd. Class H

Announcement on Submitting Application for H-share Offering and Listing to Hong Kong Stock Exchange and Publishing Application MaterialsThe abstract is for reference only. Please refer to the full text of the announcement on the very day.Link of Full Text for Reference: View Attachment

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