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Announcement on Submission of Application Materials for the Purchase of Assets through the Issuance of Shares and the Collection of Supporting Funds, and the Related Party Transactions to the Shanghai Stock Exchange for Review

Announcement on Submission of Application Materials for the Purchase of Assets through the Issuance of Shares and the Collection of Supporting Funds, and the Related Party Transactions to the Shanghai Stock Exchange for Review

articleHua Hong Semiconductor Ltd. Class AMarch 30, 20263/news/announcement-on-submission-of-application-materials-for-the-purchase-of-assets-through-the-issuance-of-shares-and-the-collection-of-supporting-funds-and-the-related-party-transactions-to-the-shanghai-stock-exchange-for-review
Announcement on Submission of Application Materials for the Purchase of Assets through the Issuance of Shares and the Collection of Supporting Funds, and the Related Party Transactions to the Shanghai Stock Exchange for Review

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Announcement on Submission of Application Materials for the Purchase of Assets through the Issuance of Shares and the Collection of Supporting Funds, and the Related Party Transactions to the Shanghai Stock Exchange for Review The abstract is for reference only. Please refer to the full text of the announcement on the very day. Link of Full Text for Reference: View Attachment

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