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Announcement on Signing the Cooperation Agreement for the Joint Establishment of the "Fudan University Integrated Circuit Engineering Technology Integration Innovation Center" with Fudan University and Guosheng Investment, and Related Party Transaction

Announcement on Signing the Cooperation Agreement for the Joint Establishment of the "Fudan University Integrated Circuit Engineering Technology Integration Innovation Center" with Fudan University and Guosheng Investment, and Related Party Transaction

articleShanghai Fudan Microelectronics Group Co., Ltd. Class AMay 11, 20263/news/announcement-on-signing-the-cooperation-agreement-for-the-joint-establishment-of-the-fudan-university-integrated-circuit-engineering-technology-integration-innovation-center-with-fudan-university-and-guosheng-investment-and-related-party-transaction
Announcement on Signing the Cooperation Agreement for the Joint Establishment of the "Fudan University Integrated Circuit Engineering Technology Integration Innovation Center" with Fudan University and Guosheng Investment, and Related Party Transaction

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Announcement on Signing the Cooperation Agreement for the Joint Establishment of the "Fudan University Integrated Circuit Engineering Technology Integration Innovation Center" with Fudan University and Guosheng Investment, and Related Party Transaction The abstract is for reference only. Please refer to the full text of the announcement on the very day. Link of Full Text for Reference: View Attachment

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