Announcement on Implementation of Dividend Distribution for 2024
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Announcement on Implementation of Dividend Distribution for 2024
Filed with SSE · · 4 pages · Chinese
Release
Epoxy Base Electronic Material Corp. Ltd. on 6ix
Earlier from Epoxy Base Electronic Material
- Announcement on Capital Increase from Wholly-owned Subsidiary Hongkong Epoxy Base to Subsidiary Zhuhai Epoxy Base Electronic Materials Co., Ltd.
- Announcement on Resolution of the 2024 Annual General Meeting
- Announcement on Provision of Online Voting Reminder Service for General Meeting
- Announcement on Increasing Capital in Its Wholly-Owned Subsidiary Zhuhai Epoxy Base Electronic Material Co., Ltd.
- Report for Q1 2025
Later from Epoxy Base Electronic Material
- Announcement on Completion of Industrial and Commercial Registration for Subsidiary Zhuhai Epoxy Base Electronic Material Co., Ltd.
- Announcement on Progress in Providing Guarantee for Wholly-owned Subsidiary Zhuhai Epoxy Base Electronic Material Corp. Ltd. and Wholly-owned Sub-subsidiary Zhuhai Hongren Electronic Material Technology Co., Ltd. to Apply for Financing Amount from Bank
- Announcement on Shareholding Reduction Plan of Senior Management Members
- Announcement on Resolutions of the 18th Meeting of the 6th Board of Directors
- Announcement on Completion of Use and Cancellation of Special Account for Raised Funds
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